Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
-
Product
LED Tester For Chip And Wafer
-
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
-
Product
Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
-
The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
-
Product
Surveyor Thickness Gauge
Multigauge 5650
-
The Multigauge 5650 Surveyor Thickness Gauge is a simple, robust ultrasonic thickness gauge designed specifically for ship and small craft surveyors, but can also be used in applications where different measurement modes are required. The user has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. The gauge can be used for metal, GRP or plastic measurement and it automatically switches modes and settings depending on the type of probe fitted. The easy to use keypad on the Surveyor Thickness Gauge allows operator interface whilst the bright LCD display can be used in all light conditions. All probes have Intelligent Probe Recognition (IPR), which automatically adjusts settings in the gauge at the same time as transmitting recognition data the result is a perfectly matched probe and gauge for enhanced performance. Additionally, the Automatic Measurement Verification System (AMVS) used with multiple echo ensures only true measurements are displayed, even on the most heavily corroded metals.
-
Product
Thick Film Chip Resistors
-
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
-
Product
Metal Thickness Tester
Multigauge 5500 Waist
-
Mounts onto a belt or chest harness for hands free use. Bright LED display. Top display for convenient viewing.
-
Product
Ultrasonic Thickness Gauge
45MG
-
The 45MG is an advanced ultrasonic thickness gauge packed with standard measurement features and software options. This unique instrument is compatible with the complete range of Olympus dual element and single element thickness gauge transducers, making this innovative instrument an all-in-one solution for virtually every thickness gauge application.
-
Product
Thickness Meter for Phosphor Coating
PM200T
-
PM200T is applicable for the manufacturers of fluorescent lamp. During the procedure of powdering tube, PM200T solves the problem efficiently how to control the phosphor thickness and uniformly of the tube. It becomes the important tool to reach best lumen output and save the phosphor.
-
Product
Thick Film Bleeder
GBR-350
-
GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
-
Product
Wafer and Cells PL System
HS-PL
-
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
-
Product
Wafer Sort
-
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
-
Product
Non Contact Thickness Measurement Systems
-
Non contact thickness measurement is becoming more complicated with each passing year.From medical devices to food packaging, we understand the needs from an array of industries to successfully design non contact thickness measurement systems to meet your needs:
-
Product
ECHO 9 Advanced Corrosion Thickness Gages
ECHO 9
-
ECHO 9 offers a 3.5” high resolution sunlight readable color display with live A-Scan, echo to echo to ignore coatings, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 9 is available in 4 models including the ECHO 9, ECHO 9DL, ECHO 9W and ECHO 9DLW.
-
Product
Solar Wafer Transfer Tool
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
-
Product
Current Sensing Resistors, Thick Film Type
-
Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
-
Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
-
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
-
Product
WAFER MVM-SEM
E3300 Family
-
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
-
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
-
Product
Wafer Inspection System
-
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
-
Product
Ultrasonic thickness gauge
-
The frequency range of sound that can be heard by the human ear is about 20Hz to 20KHz, and sound waves with higher frequencies are called ultrasonic waves. In general ultrasonic flaw detection equipment, 5MHz is often used in the range of 1MHz to 20MHz as standard.
-
Product
Automotive Paint Thickness Meters
-
Linshang automotive paint meter, also named paint thickness meter, is a painting thickness gauge used to test car paint thickness. Linshang automotive paint meter can identify the substrate automatically. If you devote to find a cost effective paint thickness meter, you can view the digital coating thickness gauges listed below.
-
Product
Handheld Digital Thickness Gauges
HC-210
-
Shenzhen Chuangxin Instruments Co., Ltd.
HC series of coating thickness gauge is a portable thickness gauge with eddy current thickness method and electromagnetic thickness method. It can be used to quickly and accurately measure the thickness of coating or cladding material without damaging it. As an essential instrument for professional material protection, this coating thickness gauge is widely used in manufacturing industry, metal processing industry, chemical industry and commodities inspection etc., both in the laboratory and in the engineering field. It can measure the thickness of nonmagnetic layer on magnetic metal substrate condition (such as steel, iron, alloy and hard magnetic steel, etc.) and the thickness of conductive layer on nonmagnetic metal substrate condition (such as rubber, paint, plastic, anodic oxidation film, etc.).
-
Product
Hand Held Ultrasonic Thickness Meter
Multigauge 5600
-
On screen user information such as probe frequency and remaining battery. Colour LCD display. Easy to use keypad and menu system.
-
Product
Paint & Powder Coating Thickness Gauge
415
-
The new Elcometer 415 Industrial Paint & Powder Thickness Gauge provides simple, fast and accurate coating thickness measurements on smooth and thin industrial paint and powder coatings.
-
Product
Wafer Test
-
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
-
Product
Wafer Inspection Products
-
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
-
Product
Digital Thickness Gauge
K094
-
For carpets, with weight set 20-2000 GM/cm², presser foot 412mm², range 0-25mm x 0.01mm.
-
Product
Handheld Gauge for Nondestructive Coating Thickness Measurement
PHASCOPE PMP10 DUPLEX
-
The professional for duplex measuring. The specialist for measuring the thickness of duplex layers from automotive to roof panels.
-
Product
Wafer Test
-
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
-
Product
EMAT Thickness Gauges
-
The EMAT thickness gauge uses advanced electromagnetic-acoustic technology to measure metal thickness, even in cases where traditional methods like piezo-ultrasonic or laser-optical are not applicable.
-
Product
Thickness Measurement Products
-
Our film thickness measurement products are available for every application. We stock most of the products listed below for fast delivery. Browse through them or contact one of our Application Engineers, who can immediately assist you with your film thickness measurement needs.
