Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Mechanical Coating Thickness Gauges
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Mechanical Coating Thickness Gauges are suitable for working in high risk areas such as high temperature or flammable atmospheres, underwater or where the risk of explosion is high and could be triggered by the use of an electronic instrument. From the simplest coating thickness gauge Elcometer 101 which will provide you with quick and immediate results to the more accurate coating thickness gauge Elcometer 211, also called the "banana gauge" which is ideal for cold and underwater surfaces.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Ultrasonic Thickness Gauge
UTG-1500
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The new PHASE II UTG-1500 is a hand held microprocessor controlled ultrasonic thickness gauge specifically designed for measuring the thickness of metallic and non-metallic materials such as aluminum, titanium, plastics, ceramics, glass and any other good ultrasonic wave-conductor as long as it has parallel top and bottom surfaces.
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2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Ultrasonic Thickness Gauge
SONOWALL® 50
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The SONOWALL 50 features a highly accurate data read out and a large measurement range. An integrated data logger and its user-friendly operation make the device ready for a wide variety of applications. The included software is a convenient tool to store and evaluate the measurements.
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Product
Radar solution for thickness measurememt of steel & metal
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Our radar sensor solution determines the thickness and the thickness profile of steel plates, steel strips or steel slabs (up to 1600 °C hot) with an accuracy of up to ±10 µm on the roller conveyor. Thanks to robust radar technology, sophisticated signal processing and intelligent radar algorithms, OndoSense radar sensors achieve this high level of precision in thickness measurement even under the difficult production conditions of the steel industry with smoke, steam, dirt, vibrations, fire and extreme temperatures.
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Ultrasonic Material Thickness Gauges
MTG
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The Elcometer Ultrasonic Material Thickness Gauges have all the features and functionality necessary for measuring material thickness and velocity on virtually any material - for a wide range of applications.
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Underwater Thickness Gauges
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Cygnus have created a range of versatile underwater and subsea thickness gauges for use by divers and engineers. These measuring devices provide a simple and time-saving method of obtaining ultrasonic thickness measurements in underwater conditions.
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Film Thickness Tester
MX Series
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Qualitest covers a complete and competitive range of Thickness Testers for plastic films, composite films, adhesives, adhesive tapes, laminated films, plastic films, paper and other materials.
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Product
Drone Thickness Gauge
Multigauge 6000
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The Multigauge 6000 Drone Thickness Gauge has been designed specifically to mount onto a drone or UAV. This new technology has already had many successful installations on various models of drone and this is the first dedicated drone thickness gauge available worldwide.
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Product
Non Contact Thickness Measurement Systems
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Non contact thickness measurement is becoming more complicated with each passing year.From medical devices to food packaging, we understand the needs from an array of industries to successfully design non contact thickness measurement systems to meet your needs:
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Product
Non-contact Film Thickness Measurement
ALTO-IRT-7000
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ALTO-IRT-7000 (IMPEDANCE RESONANCE TECHNOLOGY ) FILM THICKNESS METROLOGY TOOL UTILIZES NON-CONTACT CAPACITIVE AND EDDY CURRENT TECHNOLOGY TO ANALYZE MICRO SECTORS ON COATED SURFACES THAT ARE 1000 TIMES SMALLER THAN ANY COMPARABLE EDDY CURRENT PRODUCTS. BUT MOST IMPORTANTLY, THIS UNIQUE IRT TECHNOLOGY ALLOWS FOR SOPHISTICATED ANALYSES OF THE CONTINUOUS AND DISCRETE FILMS BELOW 50 ANGSTROMS, DRAMATICALLY IMPROVING THE ACCURACY OF QUALITY CONTROL READINGS.
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Product
Ultrasonic Wall Thickness
UTG
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The PosiTector UTG measures the wall thickness of materials such as steel, plastic and more using ultrasonic technology. Ideal for measuring the effects of corrosion or erosion on tanks, pipes or any structure where access is limited to one side. Multiple echo (UTG M) Thru-Paint models measure the metal thickness of a painted structure without having to remove the coating.
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Current Sensing Resistors, Thick Film Type
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Multi-mode Ultrasonic Thickness Gauge
MMX-6DL
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The MMX-6DL has all the features of the MMX-6 plus: An Internal data logger that stores a total of 1000 readings in 10 files of 100 readings each file. This gives the user the ability to store, and download the stored measurements directly to a PC using our DakView software program. The software and transfer cable are included in the MMX-6DL kit.
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Thick Film Passive Element
GBR-250
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GBR-250 series high voltage resistors are made in a thick film technology on ceramic substrates (Al2O3 96%). These elements are used in high voltage applications.
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Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Material Thickness Gauges
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PeakTech Prüf- und Messtechnik GmbH
Can use the speed of sound to measure the material thicknesses of most sound wave conducting materials, such as metal, glass, plastic, ceramics and much more. In addition to the high resolution of 0.1 mm, the device also offers a self-calibration function for maximum accuracy via a 4 mm metal plate integrated in the housing.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Thickness Check Calix
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For the manufacturing of a perfect cold strip, many factors are crucial. Our measuring frames specifically check the thickness-related quality parameters of the strip steel or steel sheet. Free of radioactive radiation, laser sensors are used in the cold strip areas that do not require protection measures with laser class 2, or only low precautions when using laser class 3B sensors. The installation of our measurement systems is quick and uncomplicated for our customers. The CALIX is integrated into the line with its C-shaped frame across the material flow. Our solutions with and without traversing determine all important parameters for quality assurance, including strip thickness, edge thickness, wedge or cambering, and measure the complete thickness profile. Thus, you have full process control in the current production.
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Product
Anti-Sulfurated Thick Film Type Resistors, Precision Type
ERJ-U2R/ERJ-U3R/ERJ-U6R Series
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Panasonic Industrial Devices Sales Company of America
High Precision And High Resistance To Sulfurization In One Resistor!Panasonic's ERJ-U2R, ERJ-U3R, ERJ-U6R (ERJ-U*R Series) offers high precision and also provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection. High resistance to sulfurization is achieved through the use of an anti-sulfurated electrode structure and material in the manufacture of ERJ-U*R Series Resistors. AEC-Q200 Compliance and IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C Reference Standards for the entire ERJ-U*R Series of High Precision, Thick Film Chip Resistors from Panasonic ensures optimal quality and reliability.
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Product
Coating Thickness Gauges
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Coating thickness gauge is a kind of portable measuring instrument, can take fast, intact, precise measurement of coating thickness. It can not only be used in engineering field, laboratories, but also meet the demand of multiple measuring by using different probes. It is used widely in manufacturing, metal processing industry, chemical industry, commodity inspection field, etc. As an essential instrument in material protection industry.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Thickness Gauge
MX-5
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The MX-5 is a simple to use hand-held Ultrasonic Thickness Gauge. It offers features that make your job easier. An Alarm mode, Differential mode, high speed scanning, and data send are the main features of the MX-5. The MX-5 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
