Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Coating Thickness Gauge
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Shenzhen Linshang Technology Co., Ltd.
Linshang coating thickness gauge, also named dry film thickness gauge, which can identify the substrate automatically. It can be used in various fields such as coating thickness measurement, plating thickness measurement, fireproof and anticorrosive coating thickness measurement, etc. The dual-use coating thickness gauge such as LS220H, LS221, LS223 are suitable for ferrous and non-ferrous substrates, LS225+F500 is special for ferrous substrates and LS225+N1500 is special for non-ferrous substrates.
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Product
Portable Thickness Gauge
Magna-Mike 8600
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The Magna-Mike® 8600 is a portable thickness gauge that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Hall Effect Thickness Gage
Magna-Mike 8600
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The Magna-Mike® 8600 is a portable thickness gage that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
Thin Film Composition and Thickness Monitor
P-1000
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The Precision P-1000 readily analyzes compound thin films utilized in semiconductor, superconductor, magnetic and applications.
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Product
Flatness, Bow, Warp, Curvature, Glass Thickness
1D-glass Thickness Profile Measuring Instrument GPM2
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Optik Elektronik Gerätetechnik GmbH
Highly accurate automatic measurement of glass thickness distributions. The glass thickness profiler GPM has the function to execute a fast and precise determination of the thickness profile of flat glass samples or another transparent material with a thickness range from 30µm to 700µm (option with sensor type 1) and width to 1200mm. The measuring point distance of the profile measurement can be varied over a micro-step-controlled positioning steering between 0.1mm and 1mm. The measured value accommodation for a scanning point takes place with the help of a special hardware module for image processing algorithms within 40 ms. The entire measuring time for a sample results thus as product from the sample width which has to be measured, the measuring point distance and the measuring time per measuring point.
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Product
Thickness and Flaw Inspection
FOCUS PX / PC / SDK
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Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
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Product
Ultrasonic Thickness Gauge
72DL PLUS
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The Olympus 72DL PLUS™ ultrasonic thickness gauge delivers precision thickness measurements at high speed in a portable, easy-to-use device. With fast scanning, advanced algorithms, and our lowest-ever minimum thickness capability, you can confidently measure the thickness of very thin layers in the most challenging applications.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Ultrasonic Thickness Gauge
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Is a widely used nondestructive test technique for measuring the thickness of a material from one side.
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Product
Destructive Coating Thickness Gauges
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Designed for measuring on a non-metallic substrate or assessing the thickness of a multi-coat paint, Elcometer offer a range of destructive coating thickness gauges such as the Elcometer 121/4 and Elcometer 141 that are portable and easy to use.
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Product
Layer Thickness Meter
CHY 113
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It is usded to measure the thickness of metallic coatings (eg paint) only on substrates with ferromagnetic alloys (eg steel). The meter is designed to provide easy operation in one hand.
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Product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
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With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Paperboard Thickness Tester
DRK107D
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Shandong Drick Instruments Co., Ltd.
It is used to test thickness of plane sheet samples, widely used in paper, board and other sheet material industry.
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Product
Ultrasonic Thickness Gauge
QTG Series
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Ultrasonic Thickness Gauge - QTG Series are economical, user-friendly, menu driven, and multi-functional units offering extensive features from basic measurements (model: QTG I) to extended memory (5000 reading storage) and USB output capabilities (model QTG II). The instrument can measure with very high resolution (0.01 mm or 0.001 inches) the thickness of metallic and non-metallic materials such as steel, aluminum, titanium, plastics, ceramics, glass and any other good ultrasonic wave conductor. The Ultrasonic Thickness Gauge - QTG Series accurately displays readings in either inches or millimeters and is equipped with special features like Automatic recognition of probes with different frequencies and Automatic zeroing of the unit.
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Product
Concrete Coating Thickness Gauge
500
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The Elcometer 500 Coating Thickness Gauge accurately measures the thickness of coatings on concrete and other similar substrates* - non destructively.
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Product
ECHO 7 Ultrasonic Precision Thickness Gage
ECHO 7
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ECHO 7 represents our most advanced thickness gage ever. ECHO 7 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of contact, delay line and immersion probes from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 7 is available in 4 models including the ECHO 7, ECHO 7DL, ECHO 7W and ECHO 7DLW.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Coating Thickness Measurement Gages
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Coating thickness or dry film thickness (DFT) is an important variable that plays a role in product quality, process control, and cost control. Measurement of film thickness can be accomplished by selecting the best mil gage for the particular application.
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Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Film Thickness Measurement
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Film thickness measurement can be measured using a number of different techniques depending on the thickness and number of layers. In its simplest form a simple measurement can be made of a single layer with a reflective lower surface using interference fringes. For more complex materials with multiple layers interference measurement is still made, but the mathematical deconvolution becomes increasingly important as does the refractive index of each layer.
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
Thick Film Passive Element
GBR-183
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GBR-183 series resistors are made in a thick film technology, on ceramic substrates(Al2O3 -96%). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-183 series elements are used both for general, and professional applications.
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Product
Automated Wafer Prober for Magnetic Devices and Sensors
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Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
