Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
WATOM
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Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
Edge Gateway
EPC-R3220
Edge Gateway
EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
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Product
Edge Gateway
EPC-R4710
Edge Gateway
EPC-R4710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI and rich IO as dual GbE/6serials/6USB/5GPIO. EPC-R4710 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
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Product
Edge Gateway
EPC-R4680
Edge Gateway
EPC-R4680 is an ARM based Box Computer powered by Rockchip ARM Cortex-A17 RK3288 Quad core high performance processor, which supports 4K display and 4Kx2K multiformat video decoding via HDMI. It also features M.2, Mini-PCIe and SIM card slots for WIFI, BT and 4G connectivity. EPC-R4680 also offers rich interfaces such as 6 USB2.0, 6 UART, 1 GbE and 8 GPIO. It is an ideal solution for Kiosk, Vending machine and Digital signage application.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
Edge Computing Platform
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
AI Inference System Based On NVIDIA Nova Orin For AMR Applications
MIC-732-AO
Edge AI Inference System
Fanless and ultra-compact design. Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS. Supports 1 x 10GbE, 1 x 2.5GbE, 3 x USB 3.2 Gen 2 (10 Gbit/s). Supports 2 x CANbus, 1 x mPCIe, 2 x Nano SIM slots. Support Total 8-ch GMSL3.0/2.0 with FAKRA connectors.
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Product
Edge AI Inference System
AIR-120
Edge AI Inference System
Edge AI inference system powered by Intel® Atom® processor with Hailo-8 AI acceleration module.
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Product
AI Inference System
MIC-741-AT
Edge AI Inference System
AI Inference System Powered by NVIDIA® Jetson Thor™. Embedded with NVIDIA® Jetson T4000™ up to 1200 TFLOPS (FP4). Supports 1 x SFP28 (1 x 25GbE). Supports 2 x 1GbE, 2 x 10GbE4, 6 x USB 3.2 Gen 2, 2 x M.2 2280, 1 x M.2 Ekey (Support both WiFi AEKey), 1 x M.2 Bkey (LTE,5G).
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Product
High-Performance All-In-One Gateway For Battery Energy Storage Systems
ECU-1170
Edge Gateway
Quad-core Cortex-A55 processor, 1.8GHzConnectivity: 4 GbE, 8 RS-232/485, 2 CAN, 1 mPCle and 1 M.2I/O: 20 DI, 6 DO, 8 Relay, 2 AIBattery-powered RTC, Watchdog, and optional TPM supportWide operating temperature range: -40~70°COptional 5 sec power backup with SupercapacitorSupports IEC 61850, IEC 104, DNP3, Modbus, MQTT, and OPC UAPreloaded with Yocto Linux and EdgeLink or Ubuntu Linux
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Product
NXP I.MX8MPlus Cortex-A53 Edge AI Box Computer
EPC-R3720
Edge AI Box
NXP i.MX8M Plus Cortex-A53 Quad/Dual up to 1.8GHz.On-board LPDDR4 6 GB, 4000MT/s memory.HDMI up to 3840 x 2160 at 30Hz resolution.Dual GbE LAN, 1 USB2.0 and 1 USB 3.2 Gen 1.1 Micro SD Socket & 1 Nano SIM Slot.1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot.Supports Windows 10 IoT Enterprise on Arm, Yocto Linux and Android BSP.4 Kinds of Rear I/O for Each Vertical Focus: IEM, Self Service, Automation and Networking.
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Product
Edge Gateway
EPC-R4760
Edge Gateway
EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
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Product
Edge AI HPC System
AIR-500D
Edge AI Inference System
Edge AI HPC system powered by Intel® Xeon® D-1700 Series processors with support for up to 4 PCIe slots. Intel® Xeon® D-1700 series processor 4x DDR4 SO-DIMM sockets support ECC/nonECC memory up to 128GB.
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Product
Edge Card Adapter, Universal, for .062 PCB
111107138
Edge Card Adapter
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
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Product
Edge AI Inference System
AIR-021
Edge AI Inference System
Edge AI Inference system powered by NVIDIA® Jetson Orin™ NX/Nano and Super mode. Compact and high performance AI box. NVIDIA® Jetson Orin NX 16GB/8GB and Orin Nano 8GB Modules. 12~24V wide power and -20~50 °C (NX) -10~50°C (NANO) supported.
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Product
Edge Card Adapter, Universal, for .093 PCB
111107148
Edge Card Adapter
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
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Product
Edge AI Inference Systems
Edge AI Inference System
Powered by NVIDIA Jetson family and RTX, AIR series provides scalable AI inference performance or efficient retraining on a large scale at the edge.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
