Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
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Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
Photonics Wafer Probing Test System
58635
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The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
