Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
-
Product
Wafer Thickness, TTV, Bow and Warpage
-
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
-
Product
Wafer Thickness Measuring System
WT-425
-
Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
-
Product
Wafer Thickness Measurement System
MPT1000
-
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
-
Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
-
The MX30x series are manual one-point Thickness gauges for silicon wafers.
-
Product
Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
-
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
-
Product
Backgrinding & Stress Relief
-
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
-
Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
-
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
-
Product
Semiconductor Metrology Systems
-
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
-
Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
-
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
-
Product
BT Imagine New wafer Thickness System
IS-T1
-
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
-
Product
Wafer Sorter and Inspection
SolarWIS Platform
-
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
-
Product
Wafer Prober
Precio XL
-
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
-
Product
Thickness Gauge
-
Hildebrand Prüf- und Meßtechnik GmbH
You can select a Thickness Gauge based on a specific standard, a specifiy material or foot diameter and weight/pressure.
-
-
Product
Thickness Gauge
Multigauge 5300 GRP
-
Designed to check the condition of Glass Reinforced Plastic (GRP) or Engineering Plastics. It can also be used on uncoated metal
-
Product
Coating Thickness Gauges
-
Non-destructive coating thickness measurement of non-magnetic coatings, e.g. paint, enamel, chrome on steel, and insulating coatings, e.g. paint and anodizing coatings on non-ferrous metals.
-
Product
MPI PA Wafer Probers
-
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
-
Product
Thick Film Bleeder
GBR-350
-
GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
-
Product
Drone Thickness Gauge
Multigauge 6000
-
The Multigauge 6000 Drone Thickness Gauge has been designed specifically to mount onto a drone or UAV. This new technology has already had many successful installations on various models of drone and this is the first dedicated drone thickness gauge available worldwide.
-
Product
Wafer Probe Heads
-
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
Product
Coating Thickness Measurement
-
The Calotest instruments from Anton Paar provide quick, simple and inexpensive determination of coating thicknesses. Employing the simple ball-cratering method, the thickness of any kind of single or multi-layered coating stack is accurately checked in a short time, in full compliance with relevant international standards.
-
Product
Automated Front & Backside Mask Aligner System
Model 6000
-
With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
-
Product
Wafer Mapping Sensor
M-DW1
-
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
-
Product
Wafer Probe Loadboards/PIB
-
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
-
Product
Paper Thickness Tester
DRK107A
-
Shandong Drick Instruments Co., Ltd.
DRK107A Paper Thickness Tester is professionally applied to testing the thickness of paper specimens.
-
Product
Tooth Thickness Micrometer
-
Measures the "root tangent length" of gears. Compatible modules differ depending on the model.
-
Product
Contactless Wafer Geometry Gauge
MX 20x series
-
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
-
Product
Glass Thickness Meters
-
Now Detecting Laminated Glass! The Glass-Chek ELITE is suited perfectly for glass replacement, but it's perfect for many other applications as well. Whether you're installing ..
-
Product
Thick Film Inspection
785
-
For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
-
Product
Coating Thickness Gauges
-
Coating thickness gauge is a kind of portable measuring instrument, can take fast, intact, precise measurement of coating thickness. It can not only be used in engineering field, laboratories, but also meet the demand of multiple measuring by using different probes. It is used widely in manufacturing, metal processing industry, chemical industry, commodity inspection field, etc. As an essential instrument in material protection industry.
