Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Video Inspection
MacroZoom
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Our MacroZoom Video Inspection packages are useful is countless industries. MacroZoom solves the problems that customers have with traditional microscopes, by offering an unlimited working distance, as well as field of view, and hugely generous 1-80x magnification range.
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Inspection Tool
AMI DF2400
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Automated In-line Inspection Tool for Defect-Free Production Without Sacrificing Throughput. The FACTS² delivers state-of-the-art, automated in-line inspection for quality and process control.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Battery Inspection
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We design, develop and manufacture X-ray solutions specifically for battery cells. At Exacom we stand for passion, innovation, out of the box thinking, honesty and reliability, as well as speed and a hands on mentality.
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Digital Inspection
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The DI-1000 and DI-1000L-PRO inspect fiber optic connector endfaces, providing clear sharp digital images on your Windows® PC. The DI-1000 and DI-1000L-PRO use LIGHTEL's Series 2 Tips and come with a soft case designed to fit easily into a standard laptop case.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Thickness and Flaw Inspection
OmniScan SX
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Olympus is proud to introduce the OmniScan® SX, a flaw detector that benefits from more than 20 years of phased array experience and shares the OmniScan DNA. For improved ease of use, the OmniScan SX features a new streamlined software interface displayed on an 8.4 in. (21.3 cm) touch screen. A single-group and non-modular instrument, the OmniScan SX is easy to operate and cost-effective for less demanding applications.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
Article Inspection Solution
ExtraEye
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First article inspection (FAI) in the PCB assembly process is one of the most important steps - left unchecked every mistake from assembly machine setup multiplies into hundreds of incorrectly assembled PCBs. Maximum accuracy in first article inspection is extremely important.
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Product
Non-Destructive Inspection Equipment
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Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Product
Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Abrasive & Blast Inspection
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Blasting parameters: A number of important parameters need to be monitored during the blasting or water jetting process, these include: air pressure (at the nozzle), nozzle diameter, blast media contamination & pH values in order to avoid recontamination of the substrate during blasting.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Smart Inspection Station
SiS
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Smart Inspection Systems LLC was born in 2010 in response to orthopedic manufacturers’ demands for faster inspection than their sister industries. Our signature product, the Smart Inspection Station™ (SiS™), is an automated turnkey inspection solution that yields comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. The SiS™ is custom-configured per the client’s needs, yet versatile enough for simultaneous commissioning on multiple product lines. The product of years of refinement, the SiS™ gives comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. Your SiS™ can be custom-configured according to your needs, but is still versatile enough for simultaneous use on multiple product lines. And best of all, every SiS™ purchase comes with ongoing support from L3I’s expert staff.
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Product
Manual Contactless Wafer Detector
HS-NCS-300
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Silicon Inspection System
NIR-01
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The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
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Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
LED Inspection
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Indicates which LEDs are not working. Checks if all diodes are placed in the correct places. Independently configures a test program for each new LED panel. Fast and effective – 1000 LED panel test takes up to 3 seconds.
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Inspection and Maintenance
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Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Fiber Optic Inspection
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Optical Wavelength Laboratories
A dependable connector endface inspection scope is a vital part of any fiber optic professional’s tool kit. Inspecting patch cord connector endfaces before attaching them to equipment or patch panels saves time and effort, and ensures a clean, quality connection. These 400x video inspection scopes allow users to view connector endfaces on a PC or laptop screen, preventing harmful invisible light from entering the users eye, and ensuring maximum eye protection.
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Automated Optical Inspection
AV871 Series
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The AV871 Series of AOI solutions from ASC International builds upon the industry leading AV862 Series with the addition of a larger platform to manage oversized boards. Accepting boards as large as 22" x 26", the AV871 Series meets the needs of those companies requiring large board capacity.
