Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
Testing, Inspecting & Cleaning Kit
KI-TK033
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850/1300 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO, SC, LC connectors
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Product
Automatic Flight Inspection System
AT-930DG
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Fully Automatic OperationAll-Weather CapabilityDifferential GPS Position ReferenceHigh Accuracy and Maximum ReliabilityWindows User Interface SoftwareEasy to Operate and Easy to LearnMinimum Maintenance RequirementsModular System ArchitectureLong-Term Supportability
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Product
Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
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VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Product
3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Visual Visual Inspection Device
IP-3000
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Our visual visual inspection device Inspection Pro IP-3000 is an inspection device that quickly and accurately inspects the mounting board, which is constantly evolving, and judge whether it is good or bad without omission.
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Product
Terahertz Imager for Material Inspection
T-SENSE FMI
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This highly efficient technology is based on the most recent research results. Production can be monitored and controlled at various levels. T-SENSE FMI uses millimeter waves in the lower terahertz range with no health risks involved. This means that the equipment can be used anywhere and for several purposes without the need for radiation protection.
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In-Line Inspection
Mapvision | Q
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Inspect ALL features for EACH part you manufature within your Takt time – even for the most complex components with hundreds of features.
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Product
Probes for Tube Inspection
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Probes for tube inspection are lightweight but solidly constructed eddy current, remote field, magnetic flux leakage, and IRIS ultrasound. These probes are used for ferromagnetic or non-ferromagnetic tube inspection applications.
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Product
GPR Bridge Inspection Equipment
BridgeScan
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Geophysical Survey Systems, Inc.
BridgeScan™ is a complete, affordable GPR system that is an effective tool for quickly determining the condition of aging bridge decks, parking structures, balconies and other concrete structures. The system is also used to obtain accurate concrete cover depth on new structures.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
Fiber Inspection and Cleaning
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Dust - just because you can't see it doesn't mean it's not there. A 1-micrometer dust particle on a single-mode core can block up to 1% of the light (a 0.05dB loss). The only way to know it's clean is to inspect it before you connect it. And if it's dirty, it needs to be cleaned with the right tools or you might just make it worse. Know it's clean with our cleaning and inspection tools.
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Product
Automatic Flight Inspection Systems
AT-940
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The AT-940 is a mobile and deployable flight inspection system providing high performance in the smallest possible package.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Structural Adhesive Bead Inspection
Predator3D
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The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Product
Automatic and Accurate Inspecting Systems
Circuit AOI
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The Circuit AOI system is designed to perform automatic and accurate inspecting systems. It integrates rigid mechanical system with advanced vision technology and manufactured and tested by strict is standards. It is suitable for circuit inspection for PCB/FPC, verification and repair. Innovation and unique inspection algorithms are applied to inspect open, short, protrusion, nick, scratch, pin hole, island, line width/space violation, object missing and others defects. AOI system can use offline setup project and check results. It will improve the throughput.Compare to halogen lighting, the full angle LED lighting of Circuit AOI can obtain the best image contrast and is good for different panel type inspection.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Automated QC Inspection Solutions
R-Series
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The Best Alternative to Traditional Coordinate Measuring Machine (CMM). The R-Series product line will help you eliminate bottlenecks at the traditional coordinate measuring machine. These new solutions, when added to the production line, will help increase productivity through quality control processes that require no human involvement.
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Product
Mask Foreign Matter Inspection Device
PR-PD2HR
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Efficient foreign matter inspection and measurement with high yield.
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Product
RFID Label Inspection System
Eurotech RFID FS
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The Eurotech RFID FS RFID accurately rewinds rolls of RFID labels and validates their receptivity by running them through the Voyantic Tagsurance RFID inspection system. The unit allows stopping at a predetermined editing spot for the removal and replacement of the defective piece, as well as indicating defective labels by a mark printed by an inkjet system integrated with the machine. Adjustment of the closed loop tension control system can be made through adjusting the parameters on the software that control the servo motor control system. This gives the customer a virtual infinite range with which to wind their labels without cracking the inlay or antenna. As well accurate web adjustment and guidance is provided with a web guide system complete with an ultrasonic sensor. The Eurotech RFID FS RFID label inspection system is equipped with the Voyantic Tagsurance for testing the performance of RFID tags. This is done by verifying that the tag responds to commands on its whole operational frequency range, which means testing the tag on multiple frequencies, also outside the RFID reader frequency. Accurate power output combined with the Voyantic Snoop Pro antenna, optimized for testing tags inline at high speed, allows defining precise acceptance criteria and achieving stable quality.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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HD Inspection System
vCam-6
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The vCam-6 HD inspection system from Vivax-Metrotech gives you the flexibility to cover a range of inspections including municipal collection systems, residential plumbing, indoor commercial lines, and lateral lines from three inches up to eight inches in diameter. Our camera systems use the latest technology packaged in a rugged, lightweight, compact profile made specifically for the harsh conditions related to sewer lateral inspections. All Vivax-Metrotech camera systems are backed up by a full one-year warranty, on-site training, and local support through our dealer network.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Wafer Mapping Sensor
M-DW1
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Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Inspection & Alignment Services
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As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard COMPACT
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Rotary Precision Instruments UK Ltd
Designed for horizontal or vertical applications with a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Product
Measuring And Inspection Systems For Extrusion, Injection Molding & Calendering Of Plastics And Films
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Measuring and inspection systems from Micro-Epsilon are used in the plastics processing industry in order to ensure efficient production.
