BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Unlisted Product
27 GHz Bandwidth Open Top Socket for BGA121
SG-BGA-6457
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Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 121 pin BGA IC's. The SG-BGA-6457 socket is designed for IC size - 12x12mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 27 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering, and uses industry's smallest footprint. The socket is constructed with open top lid for access to the center of IC package. The socket comes with ball guide for the precise alignment of BGA balls to PCB pads. The SG-BGA-6457 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -35 C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin. Works with devices such as 121BGA, 12mm square package with 11x11 array and 1mm pitch.
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Unlisted Product
40 GHz Bandwidth ATE Socket for BGA240
SMP-BGA-8007
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Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064x6.464 mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The socket is also designed to dissipate few watts with aluminum compression screw assembled on the swivel lid and can be customized up to 100 watts with modified fin design on top of the screw and adding axial flow fan. The contact resistance is typically 15 milliohms per pin. The socket connects all pins with 40 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering, and uses mechanical hardware for mounting. The socket is constructed with swivel lid which incorporates a quick insertion method so that IC''s can be changed out quickly for engineering verification before installing into the ATE.
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Unlisted Product
Chip Size 0.65mm Pitch BGA Socket Adapter
SFS-BGA144V-52
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Users can socket their 144 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint. Giga-snaP™ SFS-BGA144V-52 allows 0.65mm pitch, 8x8mm body, 12X12 array 144 ball BGA package to be placed in socket and operated without compromising performance in high speed applications.



