BGA
Surface mount chip package, which uses solder balls for its connectors.
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Product
DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
Interposer
The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
Interposer
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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Product
BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
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Product
DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
Interposer
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Product
RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
Interposer
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Product
BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
Interposer
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
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Product
Futureproof Your Control PLD And Bridging Designs
MachXO3
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*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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Product
SMT Rework Station
RW1210
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Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Product
Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
IC/BGA Tester
Focus-2005
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As a screening checker to detect defective devices(mainly electrostatic destruction)which are returned from fields before failure analysis process of IC/LC in the quality assurance division of semiconductor manufacture.As a screening checker to detect defective devices before acceptance inspection by IC/LSI expensive tester at semiconductor company(trading, manufacture)Short/Open checker for semiconductor sensor device.It is possible to measure two kinds of measurements which are constant voltage biased current measurement and constant current biased voltage measurement. User can set the threshold of 10 ranks. （auto measurement）Only device can be measured. It is also possible to fabricate the test fixture.Various devices can be measured by replacing the socket board.It is no need to generate complex test programs as reference values are calculated from good device.It can be expanded by adding multiplexer boards which are 128pins per one board.(MAX 2048pins)
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Product
Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
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The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Product
TDR System
TS9001
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The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
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Product
Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Product
8th Gen Intel® Core™ Processor BGA 1528
AIMB-233
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Supports Intel® Core™ core i7-8665UE /i5-8365UE/I3-8145UE/Celereon 4305UE, 15W TDP, BGA 1528 16nm ProcessorSupports two 260-pin SO-DIMM up to 64GB DDR4 2400 MHz SDRAMSupports multiple display I/O supports versatile Tri display functions for HDMI,Support PCIex1, 2 M.2 (1 F/S miniPCIe), 4 USB 3.1, 2 USB 3.0 and 2 SATA IIISupport wide range 12V~24V DC Input and low profile heightSupports WISE-PasS/RMM and Embedded Software APIsSupport SUSI, WISE-DeviceOn and Edge AI
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Buffered Analog Crosspoint Switches
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Analog Devices buffered video crosspoint switches offer multiple configurations from 8x8 up to 32x32 channels with gain of 1 or 2 and are offered in LQFP, LFCSP, and BGA packages. These crosspoint switches can be programmed either in serial or parallel modes and are used primarily for routing high speed signals, including composite video (NTSC, PAL, SECAM) and component video (YUV, RGB) in applications such as studios, video on demand, in-flight entertainment, surveillance, and video teleconferencing.
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Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
Test Socket Based Elastomeric Matrix Connectors
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Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Product
Labelling Systems
8000BL
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The Model 8000BL is a high volume labelling system for tray-borne devices. Equipped with tray stackers and a Zebra 90XiII label printer, the 8000BL can apply labels safely, accurately and quickly to BGAs, QFPs, TSOPs, PGAs, etc.
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Product
Detective Logic Analyzer
DDR3
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Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured StatesContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsRow Hammer Analysis for potential data corruptionInteractions among up to 8 ranks, over two slots are analyzed.Mode Register Listing providedSupports Auto-Clock rate detect and clock stoppage Connects to the target under test with DIMM, SO-DIMM, and BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Product
Circuit Card Assembly
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Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Single Site Test Handler
3210
Test Handler
Chroma Single Site Test Handler 3210 supports various package types such as BGA series, QFP series, QFN, TSOP, and more. The handler is primarily designed for early device design and engineering validation.
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Product
X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Product
BGA SSD
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BGA SSD PCIe Gen.4 offers high-performance data transfer in a compact form factor, ideal for ultrabooks, gaming laptops, and enterprise storage.
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Product
Inspection Solutions
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Entire range of optical inspection systems. From the SPI machine (SPI inspection) for checking solder paste printing, to an inline AOI for THT or SMD-assembled PCBA, to AXI machine for BGA x ray inspection. And furthermore, GÖPEL electronic's AOI PCB inspection can be used for conformal coating inspection (CCI) of various protective coatings applied to boards.
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Product
For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Product
Universal Automated Programming System
4900
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The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
