Sockets
receive conductors.
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Product
LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Custom Test Connectors and Sockets
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Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Camera Module Socket
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Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
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DU Sockets
445012
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DU bushings are rolled dry sliding bearing bushings and also serve to properly guide the guide pins into the pin carrier plate.
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Wall Mount Power Supplies
AC-DC Dual Tracking Outputs
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Although small in size, these mini-modules offer high performance at modest prices. They provide the voltages commonly required for driving op amps and other balanced loads and may be mounted in an area only 3.5" x 2.5". Terminal strip input/output connections eliminate all need for sockets or soldering. Short circuit protection, encapsulated construction, and conservative design assure long term reliability.
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Product
Fibre Channel PXI Express Test & Simulation Instrument
PXIe-FC4
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Avionics Interface Technologies
3U PXIe form factor will fit into any PXIe or hybrid slot - Supports Point-to-Point, Switched Fabric, and Arbitrated Loop topologies - Two independent Fibre Channel ports - Two SFP sockets accept fiber or copper transceivers - Each port supports 1, 2, and 4 Gbps speeds - Comprehensive decoding of FC-1, FC-2, and Upper Layer Protocol (ULP) frames - Triggering and Filtering - Error Injection on any Header or Payload Parameter - Data Capture to on-board memory or disk file - Live Capture and Current Value Monitoring - IRIG-B Time Code Encoder/Decoder for Data Correlation - In-line Port Configuration for Transparent Analyzer - Supports multiple ULPs including FC-AE-ASM, FC-AE-RDMA, FC-AE-1553, and FC-AV - Supports HS-1760E applications, including AS5653, AS5625, and AS5627fcXplorer Windows-based FC Simulator and Analyzer Test Software
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Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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230V AC Socket Tester(For UK)
1942
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Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon indicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1W*Frequency: 50Hz
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Product
Pico-ITX SBC With Intel® Pentium® N3710 & Celeron® N3060 Processor, HDMI (VGA)/LVDS, LAN And Audio
PICO300
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The PICO300, an extreme-compact fanless pico-ITX motherboard, is built with the Intel® Pentium® N3710 or Celeron® N3060 processor (codename: Braswell SoC). One SO-DIMM socket is provided to support up to 8GB of DDR3L-1600 memory. The PICO300 is supported in dual display configurations along with one 18/24-bit single/dual-channel LVDS and a choice of VGA or HDMI. Furthermore, the tiny 2.5” pico-ITX embedded board features Intel® integrated Gfx graphic engine to build excellent media and graphics performance capability. In addition, the compact size of the pico-ITX form factor also makes the PICO300 suitable for space-constrained embedded applications. It runs fanless operation, and supports -20°C to +60°C operating temperature. Combined all features as above, the PICO300 is ideal for any media editing, imaging, graphics and video intensive applications that be applied for a wide array of industrial IoT industries.
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Product
Interface Board for Gigabit Ethernet
40-965-910
Interface
The 40-965-910 is a converter card for the 40-201 Ethernet/AFDX Fault Insertion Switch. Adapts the 78-Pin D-type connector on the front of the module to 4 RJ45 sockets and one 9-way D-type connector for fault signals. Allows the fault insertion testing of Gigabit Ethernet signals.
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BGA Socket And BGA Adapter Systems
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Mill-Max's BGA Socket/Adapter Systems are used for both socketing BGA devices and interconnecting circuit boards. Systems are available to fit 1mm, .050" and .8mm grid footprints.
