Sockets
receive conductors.
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Product
Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Relay Sockets & Accessories For Power Relays
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Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
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Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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eMMC
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These sockets are specifically designed for standard 153 & 169 Ball eMMC devices. Custom probing sockets also available.
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Product
Circuit Breaker Finder Accessory Kit
69411
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For use with ET300 Digital Circuit Breaker Finder.Light socket adapter for finding the correct circuit of a lighting fixture.Alligator clip adapter enables use of on bare wires.
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Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
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Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Product
Flex Socket Test Module
JT 2127/Flex Socket Test Module
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The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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Product
K-Base Test Board Adapter
1180
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The TESCO K-Base Test Board Adapter allow quick, convenient testing of self-contained K-Base meters on test boards designed for socket type meters. The K-Base Test Board Adapters are designed for single phase (Catalog No. 1180-2) and polyphase (Catalog No. 1180-4).
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Product
ESD Ground Point
EGP-020
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The EGP-020 ESD Ground Point is a convenient mechanical socket that can be mounted on to any equipment frame for equal-potential bonding to the equipment. The 4 mm socket is not insulated, made of lathed brass, nickel-plated, for use as grounding socket.The EGP-020 is designed to be mounted on an unpainted conductive surface.
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Fusion Bonded Cable Jumpers
Series 152FB
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Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
