Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL
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*NVIDIA® Jetson™ Nano with Maxwell™ architecture with 128 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Optional IP42 cover kit for semi-outdoor applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +60°C*JetPack supported
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Product
Edge AI Box
EPC-R7000
Edge AI Box
EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
NVIDIA® Jetson™ Xavier NX-based Industrial AI Smart Camera for the Edge
NEON-2000-JNX Series
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ADLINK NEON-2000 series is the NVIDIA® Jetson™ based industrial AI cameras, which integrates the Jetson Xavier NX or Jetson™ TX2, Image Sensor, Optimized OS, Rich I/O for vision applications in a compact chassis and verified thermal performance, that saves not only users' TCO (Total Cost Ownership) on the integration and trouble shooting, but also the dimension and cables on the installation.
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Product
MiniPCIe Edge AI Module
VEGA-330
Edge AI Inference System
miniPCIe Edge AI Module with two Intel® Movidius™ Myriad™ X VPUs onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Fanless Network Appliance For SD-WAN& UCPE Edge Deployment With Coming 5G & Wi-Fi 6 Support. Ideal For SD-WAN Deployments.
FWA-1112VCL
Network Appliance
Intel® Atom® C3000, up to 8 CoresIP40, fanless design, 0 ~ 40°C temperature rangeUp to 4 x 1GbE RJ-45 + 2 x 10GbE SFP slots or 1 x 1GbE SFP and 6 x RJ-45 slots5G LTE and Wi-Fi 6 RF certifiedIntel® QAT integrated2 x PoE+ support (optional)
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Product
4U AI GPU Edge Server
AXE-7400SR
MEC Server
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
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Product
Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Product
BT Imagine New wafer Thickness System
IS-T1
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Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Product
Signage & Edge Computers UBX-500 Series
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Mini edge servers are designed for compact spaces, efficiently storing and processing large data volumes for local computing and real-time AI.
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Product
WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
M.2 Edge AI Module With One Intel® Movidius
VEGA-320
Edge AI Inference System
m.2 Edge AI Module with one Intel® Movidius™ Myriad™ X VPU onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks. Scalable for multi video streams edge inference.
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Product
LTE Advanced Edge Computing Gateways - ICR-4400
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The LTE advanced (Cat.12) high-speed 4G routers & powerful edge computing gateways with a variety of interfaces focused on complex router and IoT task.
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Product
Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Product
MPI PA Wafer Probers
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MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Intel® Processor N97 IoT Edge Computer With 4x LAN, 6x COM, 4x USB, 1x HDMI, And 1x VGA.
UNO-247 V2
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Intel® Processor N97Flexible iDoor expansion design with sufficient IO port4 x GbE, 2 x USB3.2, 2 x USB2.0, 2 x RS232/422/485, 4 x RS485, 1 x HDMI, 1 x VGA, 2 x GPIOCompact size with fanless designOptional 4G/GPS/GPRS/Wi-Fi communicationTerminal block for wiring capabilityOptimized mechanical design for easier RAM swappingSupport Win11 IoT and Ubuntu 22.04
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
SQFlash ER-1 U.2 2.5" SSD (SFF-8639) PCIe/NVMe Gen.4 X4, Edge Grade
SQF-CU2 ER-1
Solid-State Drive
U.2 (SFF-8639) PCIe/NVMe 2.5" SSD, Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4, AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC, Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution, SMART and GUI management tool.
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
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The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
VUltra-Short 1U Edge Server
SKY-8134S-11
Blade Server
vUltra-short 1U edge server with 4th Gen Intel® Xeon® Scalable processor, optimized for Open RAN, MEC, and low-latency edge workloads.
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Product
PCI Edge Connector Card
PMC239/F
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The PMC239/F also comes with a fan. The fan can be disconnected from its power if not needed.
