Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
MiniPCIe Edge AI Module
VEGA-330
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miniPCIe Edge AI Module with two Intel® Movidius™ Myriad™ X VPUs onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks.
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Product
04 With Pins For PCB Or Soldering Eyelets | 12, 24 Positions | 1 - 4 Wafers
04-Selector-Overview
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Very robust, multi wafer selector with up to 24 positions, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
4-Slot Edge Intelligent DAQ Controller
ADAM-5630
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Support Modbus/RTU, Modbus/TCP Client and Server function librariesC and Python programming based on Linux operating systemSupport Web server for I/O configuration and monitoringBuilt-in real-time clock and watchdog timer4 serial communication ports onboard2 Ethernet Ports4 or 8 I/O slot expansion1 micro SD slot expansion for data storage
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
04 With Pins For PCB | 4 Wafers | 12 Positions
04-4xx4-20/70-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Pocket-Size DIN-Rail Edge IPC With Intel® Atom® X6413E
UNO-127
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Intel® Quad core x6413E processor with 4GB/8GB DDR4 onboard memoryCompact, robust, fanless and cable-free system with high stabilityOptimized basic unit with 2 x GbE, 2 x USB, 1 x HDMIOn-board full-size mPCIe port for various expansion capabilityBuilt-in TPM2.0 for hardware-based securitySystem ground isolation designCertified with IEC 61010-2-201 for industrial applicationUbuntu Core 20 certified hardwareSupport Windows 11 IoT Enterprise LTSC
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
04 With Pins For PCB | 4 Wafers | 24 Positions
04-4xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL
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*NVIDIA® Jetson™ Nano with Maxwell™ architecture with 128 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Optional IP42 cover kit for semi-outdoor applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +60°C*JetPack supported
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Product
Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
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The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
04 With Soldering Eyelets | 2 Wafers | 24 Positions
04-2xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
System
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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Product
01 With Soldering Eyelets | 12 Positions | M6 | 2 Wafers
01-2xxx-00/30xx-12-M
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Multi wafer compact selector with 30° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
16 Channel Leading Edge Discriminator
V895
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The Mod. V895 is a 1-unit wide VME module housing a 16 channel leading edge discriminator. The module accepts 16 negative (positive on request) inputs and produces 16 differential ECL outputs with a fan-out of two on four front panel flat cable connectors.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Compact IoT Edge Computer With Intel® Core™ I CPU
UNO-238
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8th generation Intel® Core™ i processor2 x GbE, 4 x USB3.2, 2 x RS-232/422/485, 1 x HDMI, 1 x DP, 1 x GPIO (8 bit)Compact, fanless designRubber stopper for stand mount and optional kit for DIN-rail mountingThreaded DC jack for reliable power supplyOptimized mechanical design for easy RAM swapping
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Edge Gateway
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The Edge Gateway provides a solution to manage distributed wireless sensors. On the one hand, new sensors can be added to the measurement systems easily and on the other hand, the gateway is powerful enough to evaluate the measurements and detect irregularities.
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
Controller
Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
4U Edge AI HPC
AIR-510
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4U Edge AI HPC powered by Intel® Raptor Lake S CPU and NVIDIA Certified with RTX™ 6000 Ada Generation. Intel® Raptor Lake S Platform to support Intel® Core™ 14th Gen processors. NVIDIA Certified with RTX™ 6000 Ada Generation graphic card
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Signage & Edge Computers UBX Zero Series
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Compact ARM-based edge computer with full Google Mobile Services, security updates, and device management for smart retail and kiosks.
