Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
2U Edge Server
SKY-7632D
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2U edge server with dual 3rd Gen Intel® Xeon® CPUs, massive expansion, and high-density storage. Optimized for AI inference, CDN, and edge data caching.
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Product
04 With Soldering Eyelets | 1 Wafer | 24 Positions
04-1xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
AIR Edge AI HPCs
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Advantech's AIR-400/500 Series Edge AI HPCs provide extreme AI power with high-performance CPUs and GPUs for in medical, and LLM fine-tuning fields.
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Product
Edge AI Platforms
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ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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Product
01 With Soldering Eyelets | 12 Positions | M8 | 2 Wafers
01-2xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Edge Mini Server System
UBX-510SZ
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Edge Mini Server System with Intel® Xeon® W-12xx or 10th Gen. Core™ i7/i5/i3 Series Processor. Built-in an Intel® Xeon® W-12xx or 10th Gen Core™ i3/i5/i7 processor, Supports Windows Server 2019/2022 or Windows 10/11. Plentiful I/O ports for various apploications, Easy-maintenance hard drive cage for large storage (RAID) capability, Flexible PCIe expansion.
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Product
01 With Soldering Eyelets | 12 Positions | M10 | 2 Wafers
01-2xxx-00/30xx-12-N
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Multi wafer compact selector with 30° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
2U Edge Server With 5th/4th Gen Intel
SKY-820V3
Server Board
2U edge server with 5th/4th Gen Intel® Xeon® Scalable processors, ideal for AI training, inference, and high-performance edge computing.
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL-NX
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*NVIDIA® Jetson™ Xavier NX with Volta™ architecture with 384 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +50°C*JetPack supported
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Product
04 With Pins For PCB | 2 Wafer | 12 Positions
04-2xx4-20/70-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Edge AI Inference System
AIR-055
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Edge AI Inference system powered by Qualcomm Dragonwing™ IQ-9075 processor up to 100 TOPS. Compact and high performance Edge AI box at least 100 TOPS AI computing. Qualcomm ® DragonWing IQ9075 processor built-in.
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Product
04 With Pins For PCB | 2 Wafers | 24 Positions
04-2xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Solid Edge
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Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Product
Compact Size Mid Tower GPU Server AMD® EPYC™ 8004 Series Processor For Edge AI Inference, Industrial Automation, And Compact GPU Workloads.
SKY-602E3
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Processor: Single AMD® EPYC™8004 Series Server ProcessorMemory: 6 x DDR5-4800 MHz ECC RDIMM, up to 576GBRemote Management: IPMI function supportExpansion: Supports 4 x PCIe x16 double-deck FH/10.5" cards or 2 x PCIe x16 double deck FH/10.5" cards + 4 x PCIe x8 single deck FH/10.5" cardsPSU: 800 Watt 1+1 redundant power supply with 80+ platinum level certification
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Product
Multi Access Edge (MEC)
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The 5G future is open and disaggregated. Gain access to Radisys Edge offerings to accelerate time-to-market and reduce costs by leveraging a full cloud-native solution for virtualized or containerized deployment on any COTS hardware and access to a dedicated network services team.
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Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Batch Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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Product
IoT Edge Computer With Intel® Celeron® J3455
UNO-247
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Intel® Celeron® J3455 processorRobust design with high stability2 x GbE, 2 x USB3.0, 2 x USB2.0, 4 x RS232, 2 x RS485, 1 x HDMI, 1 x VGACompact size with fanless designRubber stopper design for stand mount and optional kit for DIN-rail mountThreaded DC Jack design for more steady power supplyOptimized mechanical design for easier RAM swapping
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Product
2U 20" Short-Depth Edge Server
HPC-6240+ASMB-622V3
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2U 20" short-depth edge server with a 5th/4th Gen Intel® Xeon® CPU, 4TB DDR5, and 8 PCIe Gen5 slots. Built for high-density AI and edge data centers.
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Product
Laser Type Edge Detection Sensor
LD
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Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
04 With Soldering Eyelets | 1 Wafer | 12 Positions
04-1xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Edge Card Adapter, Universal, for .093 PCB
111107148
Edge Card Adapter
VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
