Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Dimensional Metrology
Stand-Alone Metrology Family
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Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Automated Metrology
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KLA Instruments automated metrology instruments enable fab process control to quantify electrical properties, material deposited/removed, surface topography/roughness and critical dimensions. Automated metrology options include optical profilometry, stylus profilometry and film thickness mapping.
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Metrology
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SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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High Precision 3D Metrology
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Ensure zero-defect quality in all product deliveries and boost customer satisfaction: ISRA’s precision metrology systems measure all object and surface properties down to the nanometer level while ensuring the shortest cycle times.
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Product
Semi-automated Metrology System
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Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
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Product
Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Product
Advanced Metrology System
AMS Series
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Precision systems for accurate measurement and quality control in semiconductor manufacturing.
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Product
Scatterometers/ Thin Film Metrology Systems
LittleFoot Series
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The n&k LittleFoot-CD, and LittleFoot-CD450 are DUV-Vis-NIR scatterometers/thin film metrology systems, based on polarized reflectance measurements (Rs and Rp) from 190nm to 1000nm, with microspot technology. The systems in the LittleFoot-CD Series determine thickness, n and k spectra from 190nm-1000nm of thin films, as well as depths, CDs, and profiles of trenches and contact holes.
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Product
Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Digital Readouts & Metrology Tools
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HEIDENHAIN digital readouts have universal applications. In addition to standard tasks on milling, drilling and boring machines and lathes, they also can be used with machine tools, measuring and testing equipment, and special machines in fact, they can be used with any machine where axis slides are traversed manually.
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Metrology Equipment
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Exact Metrology sells, services and implements metrology equipment from the 3D scanning industry's leading manufacturers. Our highly trained team can configure our comprehensive lineup of portable CMMs, 3D scanners, 3D laser scanners and 3D metrology equipment & digitization equipment and software for practically any application.You'd have to scan far and wide to find a more inclusive selection of 3D metrology equipment. We sell everything from Faro arms to 3D body scanners; white light scanners to blue light scanners; coordinate measuring machines to desktop 3D scanners.
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Product
Metrology Software
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ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
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Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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In-Line Metrology
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In-line metrology systems are integrated into production lines for comprehensive process control during substrate transfer between deposition chambers.
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Metrology System
Echo
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The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Benchtop Models For Best Film Metrology
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Fixed, high-precision laboratory instruments used to accurately measure properties like film thickness, refractive index, and roughness.
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Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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In-Line Metrology
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For industrial applications, k-Space is known for its ability to provide robust data and analysis for in-line solutions in production environments. k-Space works side by side with the customer to understand their specific measurement and inspection needs, and then develops a custom solution to meet the identified requirements. Our solution includes custom measurement technology, software, database generation and integration, go/no go determination, pick and place, alarm status, and PLC communication.
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Product
Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Quantum & Metrology Instruments
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Beyond quantum sensors, Exail’s photonics solutions enable real applications in other quantum technology fields. They also enable precise control and transmission of the frequency, phase and amplitude of a laser light through fibered telecommunication links, for metrology applications. The true and deep understanding of Exail teams for the fundamental physics behind its technology explains the absolute quality of its time & frequency reference products.
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Thin Film Metrology Systems
Gemini Series
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The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
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Universal 3D Metrology Software Platform
PolyWorks
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Defining the cutting edge of 3D metrology, the PolyWorks software suite maximizes productivity, quality, and profitability when integrating 3D measurement technologies into an industrial manufacturing process. From part and tool design and prototyping down to final inspection of assembled products, PolyWorks offers advanced solutions to cover the complete product development cycle. Interfacing directly with major brands and technologies of single-point and point cloud 3D measurement devices through plug-in extension modules, this universal platform also supports a wide array of native point cloud and polygonal model file formats.
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Metrology
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
Network analyzers are used to measure so-called scatter parameters (S-parameters). These describe the behaviour of electrical components with the help of wave magnitudes. Whether simple cables, filters, amplifiers or complex subsystems, the following applies to all these components: Different loads can have unseen effects on the measured values over time.
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INnLline Metrology Automated & Robotized Solutions
Automation projects
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Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
