Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Product
Metrology Software
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ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
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Dimensional Metrology
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Nova offers in-line optical integrated and stand-alone metrology platforms. The metrology product portfolio, combined with our modeling algorithm software, delivers unique measurement capabilities for the most advanced semiconductor technology nodes.
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Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Digital Readouts & Metrology Tools
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HEIDENHAIN digital readouts have universal applications. In addition to standard tasks on milling, drilling and boring machines and lathes, they also can be used with machine tools, measuring and testing equipment, and special machines in fact, they can be used with any machine where axis slides are traversed manually.
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Product
Add-ons For Metrology
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We offer add-on products for Optical Frequency Combs and metrology applications. These include heterodyne photodetectors (BDU), and highly stable RF oscillators, just to name a few.
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Product
Scatterometers / Thin Film Metrology Systems
OptiPrime Series
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The n&k OptiPrime series are automated metrology systems used to fully characterize and monitor Thin Film and OCD applications for both current and next generation IC processes.
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Product
Dimensional Metrology
Integrated Metrology Family
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Nova is the market leader in the space of integrated metrology platforms with multiple generations of products. Our integrated metrology platforms enable advanced process control (APC) to monitor and control wafer to wafer variations of complex high-end CMP and Etch applications with high productivity and reliability required for the most advanced logic and memory technology nodes.
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Rotational Metrology System
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The ZeroTouch® Rotational Metrology System is a precise, high-speed, in-line or near-line metrology, and inspection system that measures critical dimensions of rotors, stators, brake discs, and other cylindrical parts, providing manufacturers with real-time metrology, and inspection data to optimize production processes, detect defects, and improve ROI.
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Product
Universal 3D Metrology Software Platform
PolyWorks
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Defining the cutting edge of 3D metrology, the PolyWorks software suite maximizes productivity, quality, and profitability when integrating 3D measurement technologies into an industrial manufacturing process. From part and tool design and prototyping down to final inspection of assembled products, PolyWorks offers advanced solutions to cover the complete product development cycle. Interfacing directly with major brands and technologies of single-point and point cloud 3D measurement devices through plug-in extension modules, this universal platform also supports a wide array of native point cloud and polygonal model file formats.
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Product
Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Product
Metrology System
Echo
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The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Product
Thin Film Metrology Systems
Gemini Series
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The n&k Gemini-TF, Gemini-TF-M and Gemini-FPD are specifically designed for measurements of patterned and unpatterned films on transparent or opaque substrates. These tools are used extensively for solar cell, flat panel and photomask applications. The tools belonging to the Gemini-TF Series are based on unpolarized Reflectance (R) and unpolarized Transmittance (T) measurements, with a 50μm spot size for both R and T. R and T are simultaneously measured to determine film thickness and n and k spectra from 190nm – 1000nm
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Coupler Metrology
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Rosenberger Hochfrequenztechnik GmbH & Co. KG
Rosenberger provides directional coupler-based measurement techniques as well as probes for comprehensive cross-domain coupling analysis.Nowadays, the introduction of new accessories within vehicles, like rear seat infotainment, smart dashboards, and various advanced driver assistance systems, has increased the demand for high-speed automotive bus systems working in parallel with the high-voltage power networks in electric cars.
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Product
Metrology System
IMPULSE V
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With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Product
Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Product
INnLline Metrology Automated & Robotized Solutions
Automation projects
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Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
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Linear Metrology System
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The ZeroTouch® Linear Metrology System is a high-speed, non-contact linear inspection system ideal for measuring linear-shaped parts such as hip stems and aerospace blades faster than traditional methods.
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Product
Metrology
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Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Gear Metrology System
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The Gear Metrology System is a non-contact gear inspection system that generates a 3D point cloud, providing manufacturers with real-time metrology and inspection data to optimize production processes, and improve ROI.
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High Accuracy Dimensional Metrology System
Pinnacle 250
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The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring.
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3D Metrology Solutions
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SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Product
Metrology
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SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Product
Metrology System
Atlas V
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The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
