Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
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Product
Probe Cards
Direct Dock
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Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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Probe Cards
Ceramic Blades
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SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
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Probe Cards
LCD Driver
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LCD Driver devices are utilized in some of the most popular high definition tech products such as LCD televisions, high functioning smart phones and tablets.
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Probe Cards
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PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Generic Probe Cards, PIB's, and Loadboards
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Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
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PCIe Carrier For PMC And PrPMC
PCI104
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The PCI104 is a PCIe carrier for PCI Mezzanine Cards (PMC) or Processor PCI Mezzanine Cards (PrPMC). The PCI104 carrier allows simplified testing of PMC/PrPMCs and their associated PMC I/O Modules (PIMs) by using a PC environment during board development or deployment. The PCI104 can also reduce the costs of manufacturing PMC/PrPMCs by allowing manufacturers to use off-the-shelf PCs for functional testing. The PCI104 converts the PCIe x4 edge connection to PCI-X via a PCIe to PCI-X bridge. The trace lengths to the PMC/PrPMCare kept to a minimum so the PMC/PrPMC can run with a133MHz PCI-X clock speed. The J4 connector of the installed PMC/PrPMC is routed to a 96-pin DIN connector per theVITA-35 specification. The PCIe to PCI-X bridge can run in either transparent or non-transparent mode and can also operate in forward or reverse mode. The PCI104 has a fan mounted on the board to cool the PMC/PrPMC. The fan can easily be removed for testing and probing of hosted card.
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Product
Probe Card
T90™ Series
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The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Multi-Test Resistivity Measurement System
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Sheet resistance mapping of thin films with a collinear 4-point probe, Temperature co-efficient of resistance (TCR) of thin films with collinear 4-point probe, Precision temperature co-efficient of resistance (TCR) with 2-point Kelvin probes and precision surface temperature probe, resistor testing with 2-point Kelvin probes,Precision resistor testing with a Kelvin probe card, temperature co-efficient of resistance resistor test (TCR), and Standard TCR test of multiple resistors with Kelvin probes or a probe card.
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Product
Probe Card
VersaTile™
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Celadon has reduced the size of a probe card to 28mm with the VersaTile™ with Advanced Cantilever™ technology. The VersaTile™ with Advanced Cantilever™ technology can fit on a conventional 3-hole mount probe positioner for single site probing. The same VersaTile™ with Advanced Cantilever™ technology can be used in a 300mm VersaPlate™ for multi-site probing.
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Vertical Space Transformers
ST
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The Space Transformer (ST) is an integral part of the probe card, utilized between the probe head and the PCB. Nidec SV Probe provides a wide variety of space transformation options including: • WST™ (Wired Space Transformer) • MST™ (Modular Space Transformer) • MLC (Multi-Layer Ceramic) • MLO/Mini-PCB (Multi-Layered Organic) • Multi-Site MLO Reflow of Package Substrate • MLC with MLTF to 50µm PitchOne of the main priorities for Nidec SV Probe is the internal development and manufacture of our own probe card components. We now offer in-house manufactured space transformer technologies with shorter lead time and competitive pricing. Contact your sales representative to learn more about our internally manufactured STs or any of our other ST technologies.
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Complete Power Quality Analysis System
PK4564
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PK4564 complete Power Quality Analysis System includes PS4550 Power Quality Analyzer with extended memory, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
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Vertical Probe Cards
B3
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The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Probilt™ Probe Card Analyzers
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ITC has a complete range of probe card metrology products that address all probe technologies, probe card sizes and probe counts.
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Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Probe Card Analyzers
PB6500
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The Probilt PB6500 has many features that make it the ideal analyzer for all probe card technologies, including the latest probe tip geometries being used to test leading edge semiconductor devices. Its excellent electrical measurement capability and the ability to drive relays on any channel make it the best tool for probe cards with complex circuits and relays on the PCB.
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Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Cryogenic Applications
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Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Probe Card
VC43™/VC43EAF™
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VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Metrology
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SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Probe Card Analyzers
PB6800
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The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Cantilever Probe Card
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MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Motherboards
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ITC currently manufactures over 100 different motherboard types, including interfaces to all major brands and types of testers. Additionally, ITC has the ability to quickly design and manufacture motherboards for any new tester interface including custom probe cards.
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Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
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Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Complete Power Analysis System
PK3564-PRO+
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PK3564-PRO+ complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, CASW Weather-Resistant Carrying/Operating Case, and 2-year deluxe warranty.
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Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Probe Card
T40™ Series
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Ultra low noise and fast settling modeling and characterization tests are made possible by Celadon’s patented ceramic probe cards.
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Probe Card
VS Series
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Japan Electronic Materials Corp.
*Vertical contact Probe Card with Spring*Suitable for Area array Bump Test
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CMOS Image Sensor
CIS
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CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
