Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
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The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Product
Wafer Thickness Measurement System
MPT1000
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Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Platform
AXM XM8000 Wafer
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The complete solution for operator free, automated X-ray wafer metrology. XM8000 is specifically designed for inline use in clean room environments.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
04 With Soldering Eyelets | 1 Wafer | 24 Positions
04-1xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
04 With Pins For PCB Or Soldering Eyelets | 12, 24 Positions | 1 - 4 Wafers
04-Selector-Overview
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Very robust, multi wafer selector with up to 24 positions, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Memory Test System
T5221
Test System
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Product
Translating process images into significant tool-defect reduction
Trans-Imager
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Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Product
MPI Manual Probe Systems
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MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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Product
Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Product
CMP Tester
CP-6
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The state of the art Rtec CMP tester CP-6 allows to study and characterize CMP process like never before. In addition to polishing wafers & substrates the tester comes with inline surface profilometer. This combinations sheds information on why and how the surface, friction, wear etc. changed. Tester also measures several inline parameters such as friction, surface roughness, wear volume etc. to understand the process in detail.
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Product
Step Recovery Diodes
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SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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Product
Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Product
MASK MVM-SEM® E3600 Series
E3640
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Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Product
Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
RF Front-end
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The RF integrated passive device (RF IPD) uses a high-resistivity substrate to integrate quality factor components such as capacitors and indictors. Many functions like impedance matching networks, harmonic filters, couplers, baluns, and power combiners/splitters can be designed using IPD technology. ST's IPDs are manufactured using thick film and HiRes Si or glass wafer manufacturing technology and photolithography processing.
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Product
Mask Alignment Systems
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EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
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Product
SR/QE Testing System
PVE300
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Industrial Vision Technology Pte Ltd.
Solar Cell Multi-function SR/QE Testing System is specially designed for Photovoltaic Industry to characterize the Optical Performance of Raw material, process wafer, finished solar cell, as well as small Module.
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Product
Minority Carrier Lifetime Tester
HS-CLT
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HS-CLT Minority Carrier Lifetime Tester has strong functions. It can not only measure carrier lifetime of wafer but also silicon ingot, silicon filament,silicon phosphorus ingot,silicon boron ingot, seed crystal and other irregular shape silicon material.The minority carrier testing ranges from 1μs to 6000μs, the minimum resistivity is 0.1Ω.cm, (can be extensive to 0.01Ω.cm). Dynamic curve monitoring in the whole process.
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Product
Flat Carbon Sensor Conductivity meter
HE-960LF / FS-09F-1/2
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It is effective to keep the dilution of Slurry constant. Maintaining an appropriate conductivity value contributes to process stability in the wafer polishing process. Even highly viscous sample liquids such as CMP Slurry can be measured without problems because they use a sensor structure that reduces the risk of the sample liquid sticking to the electrodes. In addition, the sensor is made of a wetted material with excellent chemical resistance, which meets the cleanliness requirements of semiconductor processes. In addition to the above, it can also be used for introduction at the semiconductor process development stage and conductivity control of special chemicals.
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Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
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Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Product
Embedded Systems Projects
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Precision Development Consulting Inc
Module Controller in Track System for silicon wafers, Static Headstack Tester, DOS Device Driver, LED Wafer Prober
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Cantilever Probe Card
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MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Product
Multi-Cell Test System
Cellcia
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Next-generation wafer probing system for 300mm wafers. The multi-layer system structure maximizes the efficiency of testing, further reducing the total testing cost.
