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Product
PICMG 1.3 Full-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor (up to 95W)*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 Long-DIMM for up to 64GB of memory*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported (optional)*Supports M.2 Key M (C246/Q370)
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 and Xeon E3-1200 v5/v6 Processors
IMB-M43-C236
Motherboard
The IMB-M43-C236 is ADLINK's ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
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Product
Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
Panel PC
- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
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Product
Return Loss, Impedance & Balance Measurement Accessory
Model SLM620-1
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For Loss- Frequency Range : 300Hz to 620KHz.- Impedance : 60 to 1000 ohms (40dB maximum).- Accuracy : ±1dB (upto 300KHz) ±2dB (300KHz to 620KHz).For Impedance- Frequency Range : 300Hz to 620KHz.- Impedance : 60 to 3000 ohms.- Accuracy : ±10% (upto 300KHz) ±20% (300KHz to 620KHz).
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Intel® Core™ I3-N305 Processor And Intel® Processor N-Series 3.5" SBC
MIO-5154
Single Board Computer
Intel® Core™ i3-N305, N-series N97 and N50Single Channel DDR5-4800 up to 16GB3 independent display: LVDS + HDMI + DPDual GbE, 6 USB, 6 COM, SMBus/I2CExpansion: M.2 E-Key 2230, M.2 B-Key 2280 & 3052Supports iManager & Software APIs, WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
Industrial Computer
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
1394 and AS5643 IP Core Solutions
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Synthesizable 1394 and AS5643 IP Core solutions PHY, LLLC, PHY & LLC for multiple FPGA families.
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
Modular Compact Embedded Box PC With 6th/7th Gen Intel® Core™ I CPU
UNO-2484G
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Intel® Core™ i7/i5/i3/Celeron Processor with 8GB DDR4 built-in Memory4 x GbE, 4 x USB 3.0, 1 x HDMI, 1 x DP, 4 x RS232/422/485Stackable 2nd layer for up to 4 iDoor extension or customize for domain applicationsCompact Fanless DesignRuggedized by zero cable and lockable I/O designSupports 30+ iDOOR combination with four main categoriesDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi Communication by iDoor Technology with RED Compliance
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Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Product
3.5" SBC With Intel® Atom® X7835RE/x7433RE/x7211RE (Extended Temperature SKU) And Core™ I3-N305; Processor N97
MIO-5354
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Intel® Atom™ x7835RE, x7433RE, x7211RE, support Extend Temp.DDR5-4800 up to 16GB, support IBECC by Platform3 independent display: LVDS + HDMI + DP2x LAN, 6x USB, 4x COM, 2x CAN-FD, SMBus/I2C, DC-in 12~24VExpansion: 3x standalone M.2 slot: E-Key 2230, B-Key 2280 & 3052Supports EdgeBMC (for OOB control) & Software APIs, DeviceOn
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
LV Iron Core Shunt Reactors
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Iron core Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system. Shunt Reactors are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. Shunt Reactors can be directly connected to the power line or to a tertiary winding of a three-winding power or distribution transformer.
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor For Railway And Vehicle PC
UST500-517-FL
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The UST500-517-FL is powered by the LGA1151 socket 7th/6th generation Intel® Core™ and Pentium® processors up to 65W with the Intel® Q170 chipset. The integrated 16 PoE ports are available in RJ-45 or M12 connectors for IP cameras. It provides a full scope of power protection that includes intelligent vehicle power management technology for ACC on/off delay, shutdown delay, and over/under voltage protection. Enhanced by its robust structure and system design, the UST500-517-FL is able to operate under a wide temperature range from -40°C to +70°C and vibration endurance up to 3 Grms. This transportation embedded box is in compliance with ISO 7637-2 and EN 50155 for mobile surveillance applications. There are 16 Gigabit LAN ports which support 802.3at/af Power over Ethernet with a total power budget of 200W. Its DVI-D, HDMI and VGA interfaces support three surveillance monitors. Furthermore, its external accessible SIM card slot enables users to easily change SIM card for different telecommunication service. With wireless LAN modules, this user-friendly transportation embedded system can real-time transmits the video to the control center. The two built-in or four swappable SATA hard drives are used for mass storage of video files.
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Product
Detector of Earth Faults on Multi/Single-Core Terminations
CableTroll 2320
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CableTroll 2320 is an indicator for detection of Earth faults (PtG) and short circuit (PtP) faults on multi-core and single core cable terminations. The unit uses NorTroll type current sensors.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3100-CF Series
Embedded Platform
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM) and 5x Intel® i210-AT
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Performance Core i7 Mission Computing Platform
ComSys-5362
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The ComSys-5362 is a rugged COTS based mission computer. A powerful yet power stingy 15W Intel Core™ i7 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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Product
Drum Core Inductors
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Drum core inductors are so named as the conductor (round magnet wire) is wound directly onto the ferrite core which is shaped like a drum or spool. The wire is then connected to the core, a plastic base or metal lead frame to form the surface mount termination. Drum core inductors come in unshielded (high saturation current but potentially more EMI) and shielded constructions (lower saturation current but closed magnetic path for lower EMI). The shielded constructions use either a second ferrite core or a magnetic resin epoxy to create the magnetic shield.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Product
Optical Loss Test Set
OLTS
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Tests for the total amount of light loss on a fiber optic link.
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Product
LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
Intelligent Pluggable System Specification (IPSS) Digital Signage Player With 4th Gen Intel® Core™ I5, Intel® QM87, AMT 9.0 And TPM 1.2
OPS885
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The OPS885 is world first Intelligent Pluggable Systems Specification (IPSS) compliant digital signage player. The OPS885 adopts the 4th Generation Intel® Core™ i5 processor with the Mobile Intel® QM87 Express chipset and provides superb graphics performance with 4K resolution. It comes with Intel® Active Management Technology 9.0 (AMT 9.0) that offers convenient remote diagnosis and cost-effective maintenance. The advanced signage player also features Intel® Retail Client Manager (Intel® RCM) that integrates an easy-to-use digital signage content CMS with analytics and security features. The IPSS compliant OPS885 provides digital signage vendors a comprehensive solution, and reduces their development effort and time to market. It is excellent for various display applications in shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
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- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
