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Product
End Point IP Core
PCIe
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The highly configurable PCIe End point IP core supports x1, x2, and x4 lane with a selection of 32/64-bit data path. Depending on design requirements, a maximum of 8 VCs and 8 TCs are supported. The IP core consists of many useful features that can be included to enhance system performance and to address special design needs in different applications. The data link layer allows the configuration of infinite credits to boost the flow control efficiency. By-pass mode, cut-through mode, and store-and-forward mode are other optional items. The transport layer features include configurable ECRC generation and checking, support for up to 64 configurable outstanding non-posted requests, and configurable payload size from 128 to 4 Kbytes
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
Processor Blade
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
THIN 1U Embedded PC - Intel® 13th/14th Generation Desktop Core™ I3/i5/i7
EPC-T228A
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Thin design with 44.2mm in height.Support Intel® 13th/14th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Expandable ROS2 Robotic Controller With Intel® 9th Gen Core Processor
RQI-53/55/57/58
Robotic Controller
ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Product
Intel® Core™ Panel Controller
AMAX-PT800 V2
Controller
Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 128-axis motion control with 500 μs EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Modular Computing Box designed with 13th Gen. Intel® Core™ i5-1335UE deca-core/ i7-1365URE deca-core processor
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Product
3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
Processor Blade
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Product
15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
Panel PC
Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43
Motherboard
The ADLINK IMB-M43 is industry's first 6th/7th Gen Intel Core i7/i5/i3 Processor (formerly codenamed Skylake/Kabylake) based industrial ATX motherboard in the LGA1151 package with Intel Q170 Express chipset. The ADLINK IMB-M43 supports high-speed data transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz memory up to 64 GB in four DIMM slots.
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Product
13th Gen. Intel® Core I7/ I5/ I3/ U300E P/U-Series 3.5" SBC
MIO-5377R
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13th Gen. Intel® Core™ Processor up to 14 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB, IBECC support by SKU4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2x LAN, 8x USB (incl. 1x USB4), 4x UART, 2x CANBus, 3x I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports Windows 10/11 LTSC & Ubuntu 22.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic Suite
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Product
Iron loss Testers
ATS Series
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Hunan Linkjoin Technology Co., Ltd.
Linkjoin Iron Loss Testers
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784966-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
Versatile All-In-One Medical Panel PC Family With 12th/13th Generation Intel® Core™ Processor Performance
MLC-S Series
Panel PC
- Powerful 12th/13th Gen Intel® Core™ i3/i5/i7/i9 processor- 21.5’’or 23.8’’ full HD display with PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities- 7 illuminated soft-touch function keys on the front glass- Edge-to-edge glass surface and patented screwless design allow for easier and faster cleaning and disinfection procedures- Fully sealed aluminum housing and fan less design for high hygienic standards with IP54 rated ingress protection and antibacterial treatment- PCIe x16 internal expansion slots for storage, networking and processing cards
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
12/13/14th Gen Intel® Core™ Processor LGA1700 NVIDIA Quadro MXM GPU Integration
AIMB-288E B1
Motherboard
12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport NVIDIA Quadro Embedded MXM GPUUp to 96GB DDR5 5600 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 22.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
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12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
Computer on Module
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-M47H
Motherboard
ADLINK IMB-M47H Industrial ATX Motherboard offers high computing performance with diverse I/O for industrial automation applications. It is the suitable choice for applications requiring real-time processing and high-level graphic capability.
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
Single Board Computer
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Product
Industrial All-In-One Touch Panel PC Based On 7th Gen. Intel® Core™ Processor
STC2-KL Series
Panel PC
- Intel® Core™ i3-7100U/i5-7300U/i7-7600U- 10.1"/15.6”/21.5” 16:9 LCD with LED backlight up to 50,000 hours- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
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Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
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Product
Open Pluggable Specification-Plus (OPS+) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q370 And TPM 2.0
OPS700-520
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The OPS700-520 is an Open Pluggable Specification Plus (OPS+) digital signage player. The high-performance signer player is powered by the high-performance LGA1151 socket 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Coffee Lake S) with the Intel® Q370 chipset. This OPS+ digital signage module supports Trusted Platform Module (TPM) 2.0, Intel® Active Management Technology (Intel® AMT) 11.0 as well as Intel Unite® solution for content sharing and collaboration. It comes with two 260-pin DDR4-2400 SO-DIMM sockets that can provide system memory of up to 32GB. The Coffee Lake S-based OPS700-520 offering future-proofed flexibility and performance is among one of the most advanced and powerful digital signage players in the market.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81 And TPM 1.2
OPS883-H
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The OPS883-H OPS-compliant digital signage player is powered by the 4th generation Intel® Core™ i7/i5/i3 processor (codename: Haswell) with the Intel® H81 chipset. It has one 204-pin DDR3 SO-DIMM socket with maximum up to 8 GB. It offers stunning 4K Ultra High Definition (UHD) content via a HDMI port. The Intel® Core-based OPS883-H is ideal for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center and many more. This smart pluggable signage module is connected to OPS-compliant display via a standardized JAE TX-25 plug connector, and includes DisplayPort, UART, audio, USB 3.0 and USB 2.0 signals. To fill different application needs, the signage unit reserves a wide choice of I/O ports on front panel, including one USB 3.0 ports, two USB 2.0 ports, one COM port, audio (in/out) and a Gigabit Ethernet port. This slim-type OPS system has one internal PCI Express Mini Card slot to connect Wi-Fi or 3G/ LTE modules to satisfied users wireless needs. It features one easy-to-access 2.5” SATA HDD as storage device. Also, it supports TPM 1.2 feature which is designed to secure system.
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Product
12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
