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Product
Thermal Camera Cores
Tenum® 640
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With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
Optical Return Loss (ORL) Meter
OPTOWARE-S300 (FOTS-ORL Meter Systyem)
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The Optical Return Loss(ORL) Meter is an efficient system for the characterization and test of optical components and systems to be performed in high quality.
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Product
Intel® 8th. Gen. Core I7/i5 Processor Fanless Embedded System
EPC-C301
Embedded PC
Intel 8th. Gen. Core Processor with Quad/Dual Cores (i7/i5), TDP 15W.Semi-Industry Fanless slim systen, Din Rail or Wall mount design.HDMI + DP* (Support vai MIO) dual display.4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe, DC-in 12V.-20 ~ 60 degree extend temperature operating.Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.No RED certification.
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Product
OPTICAL LOSS TEST SET (OLTS) MQJ KIT
4000-1025
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The OLTS (Optical Loss Test Set) - MQJ Kit includes a soft, padded carrying case with strap that is provided to protect all of the components during transportation and/or storage.
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
Modular Edge Computer
Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
7th & 6th Gen. Intel® Core™ U-Series (I7/i5/i3/*Celeron®), 3.5" SBC W/MIOe
MIO-5272
Single Board Computer
7th & 6th Gen. Intel® Core™ U-series (i7/i5/i3/*Celeron®)Dual SO-DIMM slots support up to 16GB memoryMulti-Display: VGA + HDMI 1.4 + LVDS (48bit)Expansion: 2x Full-size miniPCIe slots (one for mSATA), MIOe connector for I/O extensionDual GbE, 6x USB, 2x COM, SMBus/I2C, GPIO, TPM (optional)Supports Windows 10 LTSC & Ubuntu 20.04 LTS, embedded software APIs, WISE-DeviceOn
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Product
15" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315S RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
Motherboard
Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
Embedded Platform
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-208
Motherboard
12th/13th/14th Gen Intel® Core™ Desktop Processors, max. 24Core, support H610E chipsetUp to 64GB DDR4 3200MT/s with two SO-DIMMPCIe x16 Gen4Triple independent displays with 2 DP, 1 HDMI, 1 LVDSRich expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen1x1 & 6 USB2.0, 2 SATA III and 6 COMWISE-DeviceOn and Embedded Software APIs
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Product
SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
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SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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Product
Industrial ATX Motherboard With 10th Generation Intel® Core™ I9/ I7/ I5 /i3 Processor
IMB-M46
Motherboard
The ADLINK IMB-M46 Industrial ATX Motherboard supports lines of the 10th Generation Intel® Core™ i desktop processors, an Intel® Q470E Chipset, and 5 PCIe expansion slots to provide a cost-competitive embedded computing solution.
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Product
11th Gen. Intel® Core U-Series I7/i5/i3/Celeron 3.5" SBC W/ MIOe
MIO-5375
Single Board Computer
11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28WDual Channel DDR4-3200 up to 64GB4 simultaneous displays: LVDS/ eDP*, HDMI, DP, USB Type-C2 GbE, 4 USB3.1, CAN Bus, DC-in 12-24VExpansion: M.2 E-Key/B-Key/M-Key (supports NVMe) , MIOeSupports iManager, WISE-PaaS/RMM, SW API, and Edge AI Suite
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Product
14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
Industrial Computer
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
Split Core Current Transformer
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Beijing GFUVE Electronics Co.,Ltd.
Have a "split" in the core that allows the CTs to open and be placed around the conductor without having to disconnect the conductor or disrupt the wiring.
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Product
Single and Dual Core Digital Signal Processor
SI-C665xDSP
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The SI-C665xDSP from Sheldon Instruments is a C programmable Digital Signal Processor (DSP) card designed for low power environments that require intensive computing in a cost sensitive solution.
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Product
Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
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The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Product
Air Core Electric Arc Furnace Reactors
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Arc Furnace Reactors are serially connected reactors that are installed in the supply systems of arc furnace transformers to stabilize arc and limit the unstable arc furnace current and voltage drop which optimize their melting process. These buffer reactors are connected in series to the primary side of the furnace transformer. Typically these reactors are tapped coils and manufactured as per customer'stap requirements.
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-277
Motherboard
Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAMSupports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA IIISupports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W AmplifierSupports ATX powerSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-DeviceOn
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Product
12/13/14th Gen Intel® Core™ Processor LGA1700 NVIDIA Quadro MXM GPU Integration
AIMB-288E B1
Motherboard
12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport NVIDIA Quadro Embedded MXM GPUUp to 96GB DDR5 5600 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 22.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
3U 7th Generation Intel® Core™ i3-7100E Processor-Based PXI Express Gen3 Controller
PXIe-3937
Controller
The ADLINK PXIe-3937 PXI Express embedded controller, based on the 7th gen Intel® Core™ i3 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
Rugged IP67-rated Fanless Embedded System With Intel® Core™ I5-7300U & Celeron® 3965U, VGA, GbE LAN, 2 USB, 2 COM And 9 To 36 VDC
eBOX800-511-FL
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The eBOX800-511-FL is a fanless embedded system with IP67-rated housing and M12 connectors for mission-critical environments. This rugged embedded system is powered by the onboard 7th generation Intel® CoreTM i5-7300U and Celeron® 3965U (formally codename: Kaby Lake) and comes with one 204-pin DDR4-2133 SO-DIMM slot with system memory up to 16GB. The eBOX800-511-FL is designed for enabling to function in harsh environments with power protection, a wide range operating temperature from -30°C to 60°C, operating shock tolerance up to 3G and 9-36V wide range DC input. Additionally, there are M12 lockable connectors and N-jack type waterproof antenna openings to meet the performance needs for outdoor critical applications such as facility condition monitoring. Furthermore, the fanless embedded box computer comes in great expansion possibilities, including flexible I/O connectors and two 2 PCI Express Mini Card slots. For enhanced platform security the eBOX800-511-FL provides Trusted Platform Module (TPM) 1.2 support.
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Product
Diagnostic Cores
VersaCore™
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The diagnostic cores are uniquely designed in the VC20 format. Using the customizable PCB, components can be added to create a "golden core" to quickly troubleshoot your system Test SMUs, Test Motherboard, Test Pogo pins, Test Relay matrix.
