Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Receivers
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SDR receivers (Software Defined Radio) perform all signal processing in software, offering multi-standard support, access to all data in the channel, and advanced RF measurements.DekTec's other receivers are based on standard demodulator chips and therefore do not take cycles from the host CPU. These can be used if the SDR features are not required.
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Product
Video Signal Generator
MSPG-6100
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Analog was a main item in display device industries at the past time., but from now on, the digital is getting developed with multi-function and large-sized resolution. MSPG-6100 is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV(NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex, etc.. bad program to protect a person under age through the regulation grade.
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Product
Ultra-compact Photoelectric Sensor
EX-20 Ver.2
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Panasonic Industrial Devices Sales Company of America
Using a single chip optical IC, Panasonic created the powerful EX-20 Ultra-Compact Photoelectric Sensors, which are among the smallest Photoelectric Sensors worldwide and in spite of their miniature size, the Sensors incorporate a sensitivity adjuster. Since a red LED dot light source is used, alignment and confirmation of the sensing position is easy, even if very tiny objects have to be detected.
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Product
Fixed Attenuators
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Macom Technology Solutions Holdings Inc.
MACOM offers fixed attenuator bare die to be used in chip and wire assemblies. These products offer excellent return loss and flat attenuation from DC to 50 GHz. Attenuation values range from 0 to 20 dB.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
Embedded Antennas
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Embedded chip antennas are compact and integrated antennas designed to be directly mounted on a printed circuit board (PCB) or embedded within electronic devices. These antennas are often used in wireless communication applications, such as Wi-Fi, Bluetooth, GPS, and IoT devices, due to their small size and ease of integration.
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Product
N2 O2 Analyzer
GNL-IN881 Series
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
GNL-IN881 series analyzer is the online intelligent measurement instrument, which adopting advanced ion current oxygen sensor with single chip technology. N2%=100%-O2%.It has been widely used in the fields of nitrogen separation from air, fertilizer, petrochemicals and biological fermentation. - See more at: http://en.ci-ele.com/8aedb8bf-ef48-4f8c-127a-797c939a6181/78ea4933-855f-c270-f389-d6ac3b6fe432.shtml#sthash.Dk7zX5DN.dpuf
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Product
Digital Receiver Exciter (DREX)
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CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
Memory Module
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
6in1 Sensor (6DoF Automotive Inertial Sensor)
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Panasonic Industrial Devices Sales Company of America
Panasonic’s 6in1 Sensor For Highly Accurate, Flexible And Sensitive Automotive And Industrial Applications Panasonic’s 6in1 (6DoF) Inertial Sensor is designed for highly accurate motion detection for automotive, industrial and commercial sensing applications. It provides highly sensitive and accurate linear acceleration (3-Accelerometers) and angular position detection (3-Gyroscopes) all in one (1) single MEMS chip (4.5mm x 4.5mm x 1.1mm)! This enables the 6in1 Intertial Sensor to be compact, highly accurate, easy-to-install and highly reliable.
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Product
Impulse Voltage Generator
GDCY
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The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Cloud And Networking
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From laser chips (EMLs, DMLs, and VCSELs) and pluggable coherent transceivers to pump lasers and TrueFlex® colorless/directionless/contentionless ROADMs, Lumentum’s comprehensive, vertically integrated portfolio lowers costs and speeds time-to-market. We optimize our components for best-in-class performance, creating flexible and scalable platforms that address ever-changing market conditions and product migrations. To ensure field reliability, Lumentum uses only the best materials and processes including stringent, proprietary burn-in processes during laser manufacturing.
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Product
Resister
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Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Product
Chip-Type Attenuators
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Panasonic Industrial Devices Sales Company of America
Chip-Type Attenuators for high-frequency signal attenuation, level adjustment or matching improvement.
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Product
PC/104 Single Board Computer with Vortex86DX3 System-on-Chip
CM1-86DX3
Single Board Computer
The CoreModule CM1-86DX3 is a PC/104 board with DMP Vortex86-DX3 single chip solution and has a very good performance to power ratio. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphic controller and audio controller together with an additional GBit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. Two Ethernet ports (1x GBit and 1x 100MBit), four RS232/RS422/RS485 serial ports, two USB 2.0 host controller to handle the communication with external devices. There are PS/2 connectors for keyboard and mouse. A first generation SATA interface allows the connection of hard disk or CD drive. CFast is also available. System expansion can easily be realized over the PC/104 bus connectors.
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Product
Ultra High Speed Programmers
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With superpro/7500 as the representative of the high-speed programmer, support chip comprehensive, burning faster, is adhering to the Superpro family's outstanding pedigree of the latest professional intelligent general programmer/burner/burner. Relying on Xeltek powerful device.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Module Spectrum
nRF52840 Series
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Raytac nRF52840 module spectrum covers MDBT50Q-1MV2, MDBT50Q-P1MV2 and MDBT50Q-U1MV2 series with Chip Antenna, PCB Antenna and u.FL connector for External Antenna option for selection.
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Product
10G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
10G DFB Laser Diode Chips by GLSN
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Product
3D Measurement
PSD-Array
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The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Product
Receiver Conformance Test Application for IEEE 802.3ck
M8091CKCA
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Designed to assist and simplify the stress signal calibration used for testing the inputs of IEEE 802.3ck Draft 3.3 chip-to-chip (C2C) and chip-to-module (C2M) electrical interfaces using Keysight M8040A 64Gbaud Higher Performance BERT or an M8050A 120Gbd High-Performance BERT together with Keysight Digital Communication Analyzer (DCA) Oscilloscope or Infiniium UXR real-time Oscilloscope.
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Product
Photonic Device Testing
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ficonTEC’s series of photonic device testing machines is focused on automated electrical, optical or mixed-signal electro-optical characterization (test-&-qualify) of chips and dies, opto-electronic assembles and integrated devices. Capability includes PIC design validation and device verification.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Production Programmers
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eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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Product
Cut Susceptibility Tester
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King Design Industrial Co., Ltd.
Equipment conforms to IEC61730 MST12 specification. Pre- or post-round can be selected for control wiring connection. With weights block’s positioning pin is removed before test; and is inserted in the rear positioning hole for the remaining time. Equipped with rings at both front and rear end; used to connect a rope and control the driving direction. Use replaceable special cutting chip.
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Product
STANAG3910/EFEX Modules
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AIM’s STANAG3910/EFEX test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O. Configurations with dual redundant concurrent HS/LS Bus Controller (BC), Multiple Remote Terminals, and Chronological/Mailbox Bus Monitor operation with full HS/LS protocol error injection/detection, multi-level triggering, advanced capture/filtering and real time bus recording, time stamping and physical bus replay ensure your bus integrity. Support for EFAbus Direct Digital Links (DDL), Fibre Optic DDL (FODDL) and EFAbus Express extensions (Mixed Mode and Dual Mode operation) are available. To support the French ‘Rafale’ aircraft, modules are available with an Electrical Front End. Single Function variants support cost effective solutions. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our STANAG3910 modules.
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Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
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Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Product
GPIB PC/104 Interface Card & Cable
GPIB-PC104-XL
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The ines GPIB PC/104 interface card uses the enhanced features of the ines GPIB chip , resulting in a reliable solution for industrial measurement.
