Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
-
Product
Production Programmers
-
eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
-
Product
VS Tool Suite for Virtual Scan Synthesis and ATPG
VirtualScan
-
VirtualScan is SynTest's solution to combat increase in test data volume and test cycle volume. With VirtualScan (VS) an extremely large number of short scan chains within the SOC can be virtually accessed from outside the chip with a limited number of pins assigned as scan pins.
-
Product
CMOS Cameras
-
A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
-
Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
-
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
Solid-State High Power Amplifier 18 - 26.5 GHz
AMP4065LC-2
-
Exodus Advanced Communications
Designed for EMI/RFI, lab, and general communication applications. Exodus Broadband SSPA product feature GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from Operating Frequency Range 18.0-26.5 GHz.
-
Product
Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
-
The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
-
Product
PC/104 Low-Power SBC with Vortex86DX CPU and Data Acquisition
HELIOS
-
Helios is a low power, mid-range performance PC/104 form factor single board computer combining a highly integrated CPU with Diamond Systems’ renowned high-accuracy data acquisition circuitry on a single board, reducing size and cost while increasing ruggedness. Helios utilizes a Vortex integrated single chip CPU operating at 800MHz or 1GHz, and 256MB of DRAM soldered on-board.
-
Product
Mobile Forensics Tool-Chip off
-
Mobile phone forensics-chip-off data recovery -system verifydebug and internal-analyzequality review.etc
-
Product
8 Channel Sample & Hold and Signal Conditioning Board for Group3
-
All channels provide for voltage division ahead of transient suppression before going into the S&H ICs. Channels that are sampled and held use a common sample and hold pulse that samples while high and holds while low. Jumpers on each S&H chip allow buffering of analog signals where sample and holds are not required. An advantage to the buffers is that it provides a high input impedance for high impedance voltage dividers.
-
Product
Balanced Measurements
-
The unbalanced interface of a VNA is not very well suited for measuring balanced circuits like antennas, transmission lines or chip impedances. In fact it is nearly impossible to get a decent calibration on a balanced 2-port measurement using coax cables.
-
Product
Digital Input/Output Card
IOD-144
-
This is a 144-bit full-size card. A Programmable Peripheral Interface chip, type 8255-5 provides three 8-bit ports (A, B, and C) for each 24-bit group. Each port can be independently programmed for either input or output. Port C can also be configured as two 4-bit ports. These cards fully implement Mode 0 of the 8255 PPI chip. (Consult the factory if you desire to operate in Mode 1.) Type LS245 bi-directional transceivers sink 24 mA (optionally 64 mA) and source 15 mA. These transceiver buffers provide hysteresis correction on inputs and added drive capability on outputs. The direction of the transceivers is set by software.
-
Product
UV Sensors
-
With analog (4-20mA, 0-5V, 0-10V) or digital (USB, Modbus) output, also available with Android device (incl. app). SiC photodiode chip based Broadband UV sensitivity or filtered for UVA, UVB, UVC or UV-Index spectral sensitivity. Our sensors are also available with logarithmic signal transduction, linearity from 0 … 1500 mV. Calibration services available at our Berlin facility prior to delivery and after use
-
Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
-
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
-
Product
8GB DDR5-5600 288Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-D5V8GN56-HC
-
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
-
Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW1
-
DDR4 3200Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, Anti-sulfuration resistor. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
-
Product
Module Spectrum
nRF52840 Series
-
Raytac nRF52840 module spectrum covers MDBT50Q-1MV2, MDBT50Q-P1MV2 and MDBT50Q-U1MV2 series with Chip Antenna, PCB Antenna and u.FL connector for External Antenna option for selection.
-
Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
-
Product
Wafer/Chip/Package Semi-automated ESD Tester
400SW
-
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
-
-
Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
DDR4 Registered DIMM
-
a type of computer RAM that features a register (or buffer) between the memory chips and the system memory controller. This register stabilizes the electrical load, allowing servers and workstations to utilize higher memory capacities and improve overall stability compared to unbuffered RAM (UDIMM).
-
Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
-
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD –
-
e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
-
Product
NVM Express
-
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
-
Product
Electronic Ballast Analyzer
WT3000
-
• It has 8 windows to display each parameter of input and output characteristics • Frequency response for testing input current up to 1MHz, suitable for precise testing of various kind of electronic ballast • WT3000 has expanding analysis for envelope wave. • Symmetry analysis for envelope wave’s crest factor of lamp current • Sampling at ultra-high speed, dynamic analysis single frequency curve, highest sampling frequency is up to 10MHz • Portable with built-in chip micro-processor, particular suitable for development and spot production • RS-232C standard interface can be connected to PC, English version software can run in WinXP or Win7
-
Product
JTAG (and IJTAG) Environment Tool Suite
SAJE
-
SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
-
Product
Multi-Contact Wedge
-
The GGB Industries MULTI-CONTACT WEDGE allows for more chip design flexibility because it is custom configured to your circuit. Four Wedges can be used at the same time to probe a complete chip.
-
Product
Socket with Collet Contacts
Correct-A-Chip
-
Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
-
Product
6U cPCI 1/10/40 GbE Switch
ComEth4050e
-
The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
