Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
SDIO Wi-Fi Module
SX-SDMAC
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This Wi-Fi SDIO module is a low-power, single-stream solution with 802.11a/b/g/n/ac support based on the QCA9377 System-on-Chip from Qualcomm Atheros. This module supports Wave 2 MU-MIMO (Client), which increases the overall WLAN system performance by 3X compared to 11n. The module’s small form factor, rich features, and low power make it perfect for portable devices.
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Product
Fibre Channel Modules
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AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
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Product
Fixed Attenuators
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Macom Technology Solutions Holdings Inc.
MACOM offers fixed attenuator bare die to be used in chip and wire assemblies. These products offer excellent return loss and flat attenuation from DC to 50 GHz. Attenuation values range from 0 to 20 dB.
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Product
8GB DDR5-5600 1GX16 1.1V SAM
AQD-D5V8GN56-SC
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SAM Original Chip, PCB: 30μ gold finger. Anti-sulfuration, On-die ECC for Enhanced RAS. Operating Temperature: 0°C ~ 85°C.
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Product
Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
RFSoC Board
VP431
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VP431, the next generation of our highly successful VP430, is a 3U VPX commercial off-the-shelf direct RF processing system that features the 3rd-generation Xilinx Radio Frequency System-On-Chip (RFSoC). The VP431 maximizes I/O channel density, reduces the radio frequency signal chain complexity, and allows for heterogeneous processing capability.
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
Coating And Finish Durability
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Our capabilities: Adhesion. Impact Resistance. Gravelometer. Chemical Resistance. Cyclic Corrosion. Hardness. Chipping. Resistance. Water Immersion
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Product
VIS-SWIR FPA's
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Imaging electronic sensors sensitive in visible, near infrared, short wavelength infrared spectral bands that generate two dimensional electronic images have found mass applications in industry, defense, security, science, environmental protection, medicine etc. Imaging sensors sensitive only in VIS/NIR range are almost exclusively silicon chips manufactured using a series of technologies: CCD, CMOS. ICCD, EMCCD, EBAPS, sCMOS in color or monochromatic versions. Color VIS/NIR sensors are sensitive to light only in visible range when monochromatic VIS/NIR sensors are sensitive up to about 1000nm.
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Product
SparkFun LTE GNSS Breakout
SARA-R5
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The SparkFun SARA-R5 LTE GNSS Breakout is a robust development tool for u-blox's impressive SARA-R510M8S module. The SARA-R510M8S combines u-blox's UBX-R5 cellular chipset with their M8 GNSS receiver chipset to provide a 5G-Ready wireless IoT device complete with positioning data all on a single chip. As an asset tracker, the LTE GNSS Breakout offers Secure Cloud LTE-M communication for multi-regional use and has an integrated u-blox M8 GNSS receiver for accurate positioning information.
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Product
Impulse Voltage Generator
GDCY
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The impulse voltage generator is mainly used to the field of impulse voltage tests by lightning impulse voltage full wave, lightning impulse voltage chipped wave and operate impulse voltage wave for such test products as electrical instrument.
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Product
Rectifier Diodes
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Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Product
Ultra Low Power Radios
IoT
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IEEE 802.11b/g/n-compliant Wi-Fi Radio (2.4 GHz)Ultra-low-power hostless Wi-Fi IoT Module features QCA4010 RadioSingle Stream System (1x1), 20 MHzIntegrated RF front end and PCB trace antennaHostless IoT application development platform with large internal memoryUART AT command set for optional external MCU hostAllJoyn supportWi-Fi Protected Setup SupportIPv4 / iPv6, TCP and UDP Protocol Supported on Chip, Offloading the Host ControllerIdeal for cost effective Internet of Things (IoT) Applications
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Product
Data Analytics
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KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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Product
1G SO-DDR1-400 200Pin 64MX8 2.5V Unbuffered
96SD1-1G400NN-AP
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DDR1-400, 200-Pin, 64MBX8, Promos Chip.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Microelectro Mechanical Systems And MEMS Sensors
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NevadaNano has spent a decade integrating multiple, complementary chemical sensors on a single silicon chip. We call it the Molecular Property Spectrometer™ (MPS™). The MPS Gas Sensor works together to measure a variety of thermodynamic and electrostatic molecular properties of sampled vapors, liquids, and particles. In less than a second, the chip creates a large, rich dataset of chemical information. Then, Custom MPS software identifies the types of molecules present in an unknown sample.
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Product
Empowering Traditional Mass Spec
ZipChip
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The ZipChip™ separations platform uses integrated microfluidic technology to prepare, separate and electrospray biological samples directly into traditional mass spectrometers (MS). In less than 3 minutes per sample, the cost-effective ZipChip system enables analysis of a broad range of matrices from growth media to cell lysates, blood, plasma, urine, and biopharma products. Each chip provides answers on analytes from small molecules up to intact proteins, antibodies and antibody drug conjugates (ADCs). This platform provides better separation quality than most liquid chromatography (LC) instruments – in a fraction of the time – all with full MS identification behind every separations peak.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
Capacitors - Beam Lead
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Macom Technology Solutions Holdings Inc.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss leveraging nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs beam lead capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long-term stability.
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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Product
USB Solutions
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Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
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Product
Signal Integrity Products
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Renesas' signal integrity products provide a 300% reach extension over passive copper solutions, and consume 80% less power than competing optical solutions. Renesas lane extender chips with analog equalizers are the perfect solution for DisplayPort™ USB-C long active cables.
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Product
Accelerometers - Special Purpose
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Product
2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
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The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Product
0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
.13u ESD diode
Impulse TSMC
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The Impulse TSMC .13u ESD diode was made to provide ESD discharge paths when integrating third party IP in an integrated circuit design for total ESD protection. The Impulse ESD diode has been successfully used with Dolphin Technologies, Artisan/ARM, TriCN/Synopsis I/O libraries, as well as popular IP blocks from RAMBUS, Chip Idea and other quality IP vendors. A 5.5 volt reverse bias anode to cathode operational specification enables the Impulse TSMC .13u ESD diode to be the device of choice for 5 volt tolerant designs.
