Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
300μm Ceramic Interdigitated Electrode Chip
CIA1
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The CIA1 300um Ceramic Interdigitated Electrode Chip is designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research.
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Product
mmWave Sensors
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The world’s most precise millimeter wave sensor available today on a single chip. The world’s most precise millimeter wave sensor available today on a single chip. TI’s CMOS single-chip sensors integrate an RF front-end with a DSP and MCU.
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Product
Stone-chip (Gravelometer)
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Trialon routinely tests products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
High Speed Ethernet DAQ
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Ultraview's ethernet based acquisition boards bring low noise, large channel count solutions to common open-source platforms. The flexibility of being able to combine a large number of publicly available firmware/software modules with laboratory quality data acquisition chips makes many previously difficult project integrations possible at a fraction of the cost of developing the entire system.
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Product
FEC Accelerator Based On Intel® VRAN Dedicated Accelerator ACC100
PCIe-ACC100
Interface Card
ADLINK’s PCIe-ACC100 is a PCIe interface accelerator adapter developed based on Intel's vRAN Dedicated Accelerator ACC100 eASIC chip. It supports 4G and 5G codec acceleration, checksum rate matching, onboard 4G ECC memory, and hybrid automatic repeat request technology (HARQ). The PCIe form factor HHHL (half-height, half-length) can meet the needs of most application scenarios.
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Product
128 Channel Multihit TDC
VX1190A-2eSST
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The VX1190A-2eSST is a 128 channel Multihit TDC, housed in a 1-unit wide VME64X 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
260pin SODIMM ECC DIMM
SQR-SD4(ECC)
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ECC SODIMM DDR4 2133/2400/2666, Data transfer rate: 2133/2400/2666 MT/sCapacity: 2GB~16GB. Original IC chip (Samsung/Hynix) ECC function support, Wide temperature range support -40oC~85oC.
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Product
10μm Single-Channel IDE Chip
SCI1
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Single-channel 10μm interdigitated electrode for gas sensing, biosensing, and photoelectric research.
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Product
8GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
500-1000W AC Power Source
CX-P150
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage,
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
Anti-Sulfurated Chip Resistor Array
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
ARINC818 Cards
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> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.
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Product
ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Product
10μm Transparent Quartz IDE Chip
TID1
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The TID1 10um Transparent Quartz IDE Chip is an interdigitated electrode chip designed for gas sensing, humidity sensing, biosensing, impedance measurement, and MEMS-related electrochemical or electrical detection research. The 10 um transparent electrode geometry provides a defined interdigitated pattern for surface-functionalized sensing experiments. The quartz glass substrate supports optical access, transparent sensing, and photoelectric detection, while the IDE layout helps improve interaction between the electrode fingers and the target film, electrolyte, vapor, or biological interface.
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Product
64 Channel Multihit TDC
V1190B-2eSST
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The V1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Product
Arduino CAN Shield
IFB-10003-INP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
Moving Die Rheometer
SG-S05A
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It tests the feature about vulcanization and searches for the best suitable vulcanization time.It adopts digital intelligent temperature-controller to adjust and sets easily.Its stability, reappear and accuracy is better than the general rotor rheometer.The microcomputer uses import CMOS chip which has high dependability.It draws、calculates and prints automatically,and has copy or blowwing up function. It adopts computer-control and interface to collect、store or deal with data and print test result .This machine's function is better than other types and shows high automatization features. It has functions about curve-comparing and blow up.It uses series of windows operation system flat and graphical software operation interface.The data is dealed with much truly.The user's test operation becomes faster, flexibly and protect conveniently.
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Rugged SODIMM DDR4 2666/3200
SQR-YD4N
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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16G DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-D5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD -
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Product
Fixed Clamp-on Flowmeter
D116
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Gentos Measurement & Control Co.
D116 Series Ultrasonic Flowmeter is a state-of-the-art universal transit-time flowmeter designed using FPGA chip and low-voltage broadband pulse transmission.
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Product
Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
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Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Product
Digital Receiver Exciter (DREX)
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CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
3U Processor Board
CP39101
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LinkedHope Intelligent Technologies Co.,Ltd.
CP39101 is a 3U CompactPCI 4-channel independent isolated serial communication board, designed for industrial communication applications, compliant with PICMG R3.0 2.1 specification.CP39101 adopts EXER 17D158 communication processor as the master control chip. Each of the on-board 4-channel serial port can be individually configured as RS232, RS485 or RS422, and in any mode, CP39101 can be operated properly in extended temperature ( -40℃ to +85℃ ) range.
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Accelerometers
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Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
