Discrete Semiconductor
semiconductor typically having one circuit.
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Product
Compact Semiconductor ATE
QST286
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Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Product
Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
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Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
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Product
Design-for-Test And Semiconductor Data Analytics
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Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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Product
Semiconductors on Film-Frame
Ismeca NY32W
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32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.
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Product
Semiconductors
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Teledyne Lincoln Microwave designs our own proprietary microwave diodes, which underpin many of our performance advantages.Our Semiconductor Technology Centre is located at the School of Physics and Astronomy within the University of Nottingham, UK. Facilities include a 90m2 ISO class 6 process cleanroom with ISO class 5 laminar flow.
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Product
RTM Discrete Signal Conditioning Board
MS 3632I
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CPCI Rear IO Discrete Signal Conditioning Board is a signal conditioning and interface board for CPCI based Advance Compute & IO Module (MS3639i). This board primarily focusing on signal conditioning of TTL/CMOS DIO levels to required type of discrete input and output interface. Digital IO from ACIO board to discrete IO at Rear IO interface. Board takes 144 DIO from ACIO and does Open/Ground, 28V/Open, 28V/Ground configuration. In addition it shall generate additional 32 discrete input / output signals with signal conditioning and all IO interfaces are brought to two 96 Pin Euro Connector.
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Product
Signal, Module, ID, CASS, 64 Position, Discrete Wiring
510114108
ITA Module
Signal, Module, ID, CASS, 64 Position, Discrete Wiring.
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Product
Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
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* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Product
Conduction Cooled XMC Interface Board with PCI Express Host Interface, Supporting up to 4 PX Modules, 2 RTx 5 Channel Modules, 1 Discrete & 1 Serial Module
EXC-8000ccXMC
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The EXC-8000ccXMC is part of Excalibur’s 8000 family of multiprotocol boards. This conduction cooled XMC interface board has a PCI Express host interface and supports up to 4 Px modules, 2 RTx 5 channel modules, 1 Discrete and 1 Serial module. Due to the constraints of the XMC specification the modules are integrated onto the board itself rather than as physically separate modules.The EXC-8000ccXMC supports Direct Memory Access (DMA), which enables the board to access system memory for reading and writing independently of the computer’s CPU. This results in faster data transfer to and from modules that support DMA, with much less CPU overhead than when not using DMA.
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Product
Switch Modules - 8 Single Pole, Form C, Discrete Power Relays which are Wired & Controlled Individually
JX8/KCP
Switch Module
This module has 8 single pole, Form C, discrete power relays which are wired and controlled individually. The relays can be externally wired to make any configuration needed. Use as individual A-B relays or use them to drive external relays, solinoids, or any external device. Screw Terminal Connectors and Armature power relay for switching up to 8 Amps of DC or AC current.
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Product
Combination Module: 2 Ch. MIL-STD-1553 & 12 Ch. Discrete I/O
CM8
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The CM8 module is a combination of NAI's MIL-STD-1553B module, FTB, and Enhanced Discrete I/O module, DT4. The CM8 offers twelve channels of discrete I/O and two channels of MIL-STD-1553B communications. The twelve discrete I/O channels are programmable as either input (voltage or contact sensing with programmable, on-module pull-up/pull down current sources), or output (current source, sink, or push-pull) up to 500 mA per channel from an applied, external 3-60 VCC source. The discrete I/O channels also provide additional functionality modes such as Pulse Width Modulation (PWM) output mode and Pattern Generator output mode. The two MIL-STD-1553B communications channels feature a dual, redundant, balanced-line, physical layer; a (differential) network interface; time division multiplexing; half-duplex command/response protocol; and up to 31 remote terminals (devices).
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Product
Semiconductor Testers
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Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Product
Semiconductor Lifecycle Management
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Defense and space applications no longer drive the semiconductor industry. There is such a mismatch between the market life of a modern semiconductor, which can be measured in months to a couple of years, and the platform needs of defense and space platforms, measured in decades.Semiconductor Lifecycle Management (SLiM™) from Teledyne e2v HiRel Electronics solves this headache. We have many years of experience partnering with customers to save cost and lower risk when dealing with platform extensions.
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Product
32-CH Discrete Input Modules
HSL-DI32-M-N/HSL-DI32-M-P
Digital Input Module
- Slave ID consumption: 2 consecutive from odd- "N" type for NPN sinking type sensor or dry contact; "P" type for PNP sourcing type sensor or wet contact- Photo couple isolation voltage: 2500 Vrms- Input impedance: 4.7 KΩ- Input current: ± 10 mA (Max), ± 12.5 mA (Peak)- Input voltage: ± 40 V (Max)- LED indicator: Power, Link and Input status- Power supply: +10 V to +30 VDC
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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
