Discrete Semiconductor
semiconductor typically having one circuit.
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Product
32-CH Discrete Input Modules
HSL-DI32-M-N/HSL-DI32-M-P
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- Slave ID consumption: 2 consecutive from odd- "N" type for NPN sinking type sensor or dry contact; "P" type for PNP sourcing type sensor or wet contact- Photo couple isolation voltage: 2500 Vrms- Input impedance: 4.7 KΩ- Input current: ± 10 mA (Max), ± 12.5 mA (Peak)- Input voltage: ± 40 V (Max)- LED indicator: Power, Link and Input status- Power supply: +10 V to +30 VDC
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Product
Semiconductor
DieMark
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DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
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Product
Semiconductor Curve Tracer
CS-5000 Series
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*Max. Peak Voltage : 5,000V（HV mode）*Max. Peak Current : 1,500A（HC mode）*Equipped all models with LEAKAGE mode (Cursor resolution 1pA）*USB port for display hardcopy, waveform data (CSV format) and measurement setup SAVE/RECALL*LAN interface for Remote Control
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Product
Semiconductors
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Teledyne Lincoln Microwave designs our own proprietary microwave diodes, which underpin many of our performance advantages.Our Semiconductor Technology Centre is located at the School of Physics and Astronomy within the University of Nottingham, UK. Facilities include a 90m2 ISO class 6 process cleanroom with ISO class 5 laminar flow.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
Discrete Devices Test
FTI 1000
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The FTI 1000 tester consists of independent test channels that allow all DC and AC MOSFET parameters to be tested either separately, or in one handler insertion or prober touch-down.
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Product
High Volume Semiconductor Substrate Interconnect Tester
GATS-2100
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Pre-align *load *CCD camera alignment *electrical test * unload * sort of pass, opens, shorts, and alignment errors.The GATS-2100 concurrent approach provides unmatched volume capability... 2.5 seconds per device. As with all Nidec-Read Test systems, the GATS-2100 offers you the most test technologies for your requirements
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Product
NI Semiconductor Test Systems
Test System
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Product
Semiconductor
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Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Product
Semiconductor Material Evaluation Equipment
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Equipment for evaluating semiconductor materials using various measuring methods is available.
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Product
32-CH Discrete Input Modules with U Profile
HSL-DI32-UD
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HSL U series is designed as compact & horizontal-placed slave module. For I/O module, ADLINK adopts three types of connectors to meet different users' requirements & habits. Compared with past models, U series brings compact size, easier-to-wire and cost-effective advantages for users. DI/O, AI/O and motion control module are supported
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Product
RTM Discrete Signal Conditioning Board
MS 3632I
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CPCI Rear IO Discrete Signal Conditioning Board is a signal conditioning and interface board for CPCI based Advance Compute & IO Module (MS3639i). This board primarily focusing on signal conditioning of TTL/CMOS DIO levels to required type of discrete input and output interface. Digital IO from ACIO board to discrete IO at Rear IO interface. Board takes 144 DIO from ACIO and does Open/Ground, 28V/Open, 28V/Ground configuration. In addition it shall generate additional 32 discrete input / output signals with signal conditioning and all IO interfaces are brought to two 96 Pin Euro Connector.
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Product
Discrete Detectors
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TRAL test station is a quasi-universal test station designed to measure parameters of discrete (or small linear array) infrared detectors sensitive in a wide spectral range from about 700nm to about 16 000 nm (NIR/SWIR/MWIR/ LWIR detectors or broadband non selective detectors). All main types of infrared detectors can be tested: photonic detectors: photovoltaic/photoreconductive, cooled/non-coooled, thermal detectors, pyroelectric detectors etc.
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Receiver, 9050, 50 Module, Dual Discrete Wiring Tiers, EMI Gasket
310104429
Receiver
The 9050, 50-module receiver is rugged and designed to accommodate high I/O and suited for larger test and measurement systems. Both tiers are designed for discrete wiring and can accommodate individual 9025 ITAs. This 9050 also offers a gasket for EMI applications.
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Product
96-Pin SCSI Micro-D Discrete Wire
40-962-096-F
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This connector is designed to allow users to terminate discrete wires with IDC connections to the 96-Pin SCSI Style Micro-D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Semiconductor Relays
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Panasonic Industrial Devices Sales Company of America
Panasonic Semiconductor Relays are categorized into two types: PhotoMOS® and Solid State Relays (SSRs).
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Semiconductor Device Parameter Analyzer/Semiconductor Characterization System Mainframe
B1500A
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Current-voltage (IV) measurement capabilities of spot, sweep, sampling and pulse measurement in the range of 0.1 fA - 1 A / 0.5 V - 200 VAC capacitance measurement in multi frequency from 1 kHz to 5 MHz and Quasi-Static Capacitance-Voltage (QS-CV) measurement capabilitiesAdvanced pulsed IV and ultra-fast IV measurement capability from minimum 5 ns sampling interval (200 MSa/s)Up to 40 V high voltage pulse forcing for non-volatile memory evaluation
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Product
Semiconductors
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Meets SDIO card v2.0 specificationSupports SDIO SPI, 1-bit, and 4-bit SD modesHost clock rate from 0-50 MHzSingle SDIO function interfaceSD commands processed in hardwareReset output on completion of initializationIndication of high speed and high power enabling to application logicMaximum block size supported is 1024 bytesThree I/O mode selection pinsCRC7 and CRC16 modulesSupports direct R/W (IO52) and extended R/W (IO53) commandsAPB bus interfaceParallel bus interfaceStandard 8051 split bus interfaceGeneric 8051 bus interfaceUART interface
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Product
Semiconductor Solutions
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Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products.
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Product
Semiconductors on Film-Frame
Ismeca NY32W
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32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.
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Product
Semiconductor Test Platform
Diamondx DxV
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The Diamondx DxV semiconductor test system provides full ATE performance in a desktop PC footprint. Fully integrated, ultra-compact test system designed to be used in the engineering lab or office. Unlike traditional semiconductor tester solutions that is no mainframe, separate workstation or support cabinets needed. The Diamondx DxV is completely stand-alone, so it can be placed on a bench or desktop:
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Product
Semiconductor Testers
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Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Product
ITA, 9050, 50 Module, VXI and Discrete Wiring, Double Tier
410104538
ITA
The 50 module ITA can be used in a number of applications to accomplish the required connection to the Unit Under Test (UUT). You can mount a VPC front or rear mount enclosure or customize your own fixture to be attached on the frame. A wide range of ITA modules are available separately for user configuration.
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Product
32-CH Discrete Output Modules with U Profile
HSL-DO32-UD
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*UD type is suitable for screw type wiring. Each wire to sensors or actuators can be fixed by the screw terminal*RJ-45 phone jack for easy installation*Compact and single board design to meet space limitation and cost-effective requirement*Support 32 DO channels*Transmission speed: 3/6/12 Mbps
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Product
Protective Cover, 9050, VXI and Discrete Wiring, Receiver
310113285
Protective Cover
When the Receiver is not in use, the Protective Cover is used to protect the modules and contacts. The Protective Cover is made up of black anodized aluminum.
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Product
Trusted Semiconductor Die/Wafer Source
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To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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Product
Compact Semiconductor Tester
QST4416-FC
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Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST4416-FC is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features facilitates it to test linear & mixed signal IC components which covers a wide range of products like linear, Power management, Opto electronics, digital and mixed signal devices etc.
