Solder Ball
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Product
Grypper "Y"
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Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Product
Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Product
Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
Soldering Fixture
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
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Product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Soldering Fixture
Used to solder Mini Coax Solder Sleeve contacts.
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Product
Solderability Tester
ZHX-35
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Shanghai Dean Electrical Co., Ltd
Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;
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Product
Soldering station
SM-850 with Hot Air
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*Place of Origin: Guangdong, China (Mainland)*Brand Name: MCH*Model Number: SM-850*CONDITION: BRAND NEW
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Product
SparkFun Solder-able Breadboard
Mini
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This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Soldering Station
SM-898D
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*Using micro-processor PID program control technology, precise dual digital display hot air gun and the stability of the actual temperature of the soldering iron, fast automatic temperature compensation feature further enhanced temperatures.*The amount of wind, air flow, temperature soldering iron are adjustable.*The air gun holder is a magnetron (or light control), holding the handle when the system will automatically enter the working mode; handle is placed on the shelf when the system enters standby mode automatically.(One more than the 898D Auto Sleep off function)*System with automatic cold wind function, can prolong the life of the heating element.*This product uses "brushless fan" as a source of air, reduce noise, improve work efficiency
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Product
SparkFun Solder-able Breadboard
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This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Ball Rebound Tester
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Hildebrand Prüf- und Meßtechnik GmbH
The ball rebound tester is used to determine the resilience of foam materials in accordance with DIN EN ISO 8307 and ASTM D 3574.
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Product
Solder Paste Analysis
SPA1000
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The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Product
Solderability Tester
LBT210
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Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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Product
9-Pin D-type Female, Solder Bucket, HV
92-960-009-F-HV
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9-Pin Female D-type Connector, High Voltage, Solder Bucket - Without Backshell
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Product
01 With Soldering Eyelets | 6 Positions | M10
01-1xxx-00/30xx-6-N
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Multi wafer compact selector with 60° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
68-Pin Micro-D Male Solder Bucket With Backshell
40-962B-068-SB-M
SCSI Male Connector
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
3D Solder Paste Inspection
aSPIre 3
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Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Product
Solder Wettability Tester
5200TN
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Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Product
Solder Cup Connector Kit
Y1141A
D-Sub Male Connector
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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Product
3D Inline Solder Paste Inspection System
TROI 7700 SERIES
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Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Product
50-Pin D-Type Male Solder without Backshell
92-960-050-M
D-Sub Male Connector
This connector is designed to allow users to directly terminate cables with soldered connections. 50-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module.
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Product
Solderability Tester
MUST 3
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The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Product
High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Product
01 With Soldering Eyelets | 6 Positions | M6
01-1xxx-00/30xx-6-M
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Multi wafer compact selector with 60° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
