Product

Selective Wave Soldering Optical Inspection Machine

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Landrex Technologies Co., Ltd.

Landrex Technologies Co., Ltd.

Selective Wave Soldering Optical Inspection Machine

Product

High Speed Caged Ball

SBK

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THK America, Inc.

SBK - THK America, Inc.

High Speed Caged Ball Ball Screw. THK high speed caged ball ball screw type SBK that eliminates collisions and friction between ball and prolongs the effectiveness of grease by utilizing the caged ball mechanism. This mechanism reduces a noise level, torque fluctuation, and a long maintenance-free period. 

Product

Open-Frame Collet Socket with Solder Tail Pins

Series 518

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Aries

Series 518 - Aries

Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.

Product

30" Ball Bearing Slides Pair

DRS-30

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ELMA Electronic, Inc.

DRS-30 - ELMA Electronic, Inc.

30"D ball bearing slides ship complete with brackets and all hardware for attachment to cabinet

Product

2 Inch 535g Steel Impact Ball For Impact Test

CX-B2

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-B2 - Shenzhen Chuangxin Instruments Co., Ltd.

2 inch 535g steel impact ball for impact test

Product

UL1989, UL1418 535g 2 Inch Steel Ball

CX-02

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-02 - Shenzhen Chuangxin Instruments Co., Ltd.

UL1989, UL1418 535g 2 inch Steel Ball

Product

Solder Paste Inspection

3D SPI

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Viscom AG

3D SPI - Viscom AG

Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.

Product

Solder Paste Analysis

SPA1000

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Gen3 systems

SPA1000 - Gen3 systems

The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.

Product

Dual Projection 3D In-Line Solder Inspection System

KY8030-2

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Koh Young Technology

KY8030-2 - Koh Young Technology

The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization