Product

04 With Soldering Eyelets | 3 Wafers | 12 Positions

04-3xx4-00/30-xx

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ELMA Electronic, Inc.

04-3xx4-00/30-xx - ELMA Electronic, Inc.

Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles

Product

Socket with Bifurcated Contact Solder Tail Pins

Series 0511

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Aries

Series 0511 - Aries

Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600

Product

Slides (Ball & Crossed Roller)

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Del-Tron Precision, Inc.

Del-Tron Precision, Inc.

Del-Tron’s linear ball slides and linear crossed roller slides offer engineers and designers the flexibility to choose the right linear slide technology for their application. Our ball slides and crossed roller slides offer several levels of precision ranging from a straight line accuracy of 0.0005” per inch of travel in our standard precision ball slides to 0.0000040” per inch of travel straight line accuracy in our high precision ball slides and crossed roller slides.

Product

IEC60950 Ball Drop Impact Test Apparatus

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Shenzhen Chuangxin Instruments Co., Ltd.

Shenzhen Chuangxin Instruments Co., Ltd.

It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.

Product

160-Pin DIN41612 Connector, Solder Pin, Male

92-960-160-M

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Pickering Interfaces Inc.

92-960-160-M - Pickering Interfaces Inc.

Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.

Product

3D Solder Paste Inspection (SPI)

TR7007 SII

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Test Research, Inc.

TR7007 SII - Test Research, Inc.

Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.

Product

UL1989, UL1418 535g 2 Inch Steel Ball

CX-02

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-02 - Shenzhen Chuangxin Instruments Co., Ltd.

UL1989, UL1418 535g 2 inch Steel Ball

Product

01 With Soldering Eyelets | 10 Positions | M10

01-1xxx-00/30xx-10-N

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ELMA Electronic, Inc.

01-1xxx-00/30xx-10-N - ELMA Electronic, Inc.

Multi wafer compact selector with 36° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque

Product

04 With Soldering Eyelets | 3 Wafers | 24 Positions

04-3xx3-00/30-xx

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ELMA Electronic, Inc.

04-3xx3-00/30-xx - ELMA Electronic, Inc.

Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles

Product

Solder Past Inspection

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Aprotec Instrumentation Ltd

Aprotec Instrumentation Ltd

From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.

Product

04 With Soldering Eyelets | 2 Wafer | 12 Positions

04-2xx4-00/30-xx

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ELMA Electronic, Inc.

04-2xx4-00/30-xx - ELMA Electronic, Inc.

Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles

Product

SQFlash 153 Ball EMMC Series

SQF-MM5 M9x

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Advantech Co. Ltd.

SQF-MM5 M9x - Advantech Co. Ltd.

Compliant with JEDEC eMMC 5.1 standard, Support -40~85℃ True Wide Temperature. Support HS400 High Speed Mode, Support secure erase, write Protection and trim commands. Automotive AEC-Q100 Grade3 or Grade2 product available, sTLC high endurance selection.

Product

01 With Soldering Eyelets | 12 Positions | M10

01-1xxx-00/30xx-12-N

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ELMA Electronic, Inc.

01-1xxx-00/30xx-12-N - ELMA Electronic, Inc.

Multi wafer compact selector with 30° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque

Product

Standard DIP Socket with Solder Tail Bifurcated Contacts

Series 511

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Aries

Series 511 - Aries

Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.

Product

Soldering Station

SM-943

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MCH Instruments Co.,Ltd.

SM-943 - MCH Instruments Co.,Ltd.

*Module: 943*Display: LED*Power Rating: 220V/70W*Temperature: 200-480DEGREE*Noisy: <45dB

Product

Ball Pressure Tester

4710

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Gigasense

4710 - Gigasense

The ball pressure tester is used to test the thermal properties of insulating materials. The test sample is placed in an oven and a steel ball is pressed against the surface. The impression of the steel ball is measured to see if it meets the requirements.

Product

Solder Paste

MVP Versa (3D SPI)

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Machine Vision Products

MVP Versa (3D SPI) - Machine Vision Products

The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.

Product

Ball Pressure Test Apparatus

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SCR ELEKTRONIKS PVT. LTD.

SCR ELEKTRONIKS PVT. LTD.

The Ball Pressure Apparatus is designed to perform test specified in IS Standard where resistance of insulating material to elevated operating temperature is to be determined. It is used to test insulation materials used in Electrical Appliances, Electrical wiring accessories, luminaries, motors, connectors, etc. It is a precision engineered test instrument for use by safety and compliance testing laboratories.

Product

Open-Frame Collet Socket with Solder Tail Pins

Series 518

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Aries

Series 518 - Aries

Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.

Product

1040g Steel Impact Ball Drop Impact Test Ball

CX-B104

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-B104 - Shenzhen Chuangxin Instruments Co., Ltd.

1040g Steel impact ball drop impact test ball

Product

Ball Bearing Linear Stage,13mm Travel, Sensitivity 3um

PSM13(A)-34

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ZOLIX

PSM13(A)-34 - ZOLIX

Model：PSM13(A)-34 Ball Bearing Linear Stage,13mm Travel, Sensitivity 3um

Product

01 With Soldering Eyelets | 10 Positions | M6

01-1xxx-00/30xxx-10-M

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ELMA Electronic, Inc.

01-1xxx-00/30xxx-10-M - ELMA Electronic, Inc.

Multi wafer compact selector with 36° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque

Product

Solder Paste Inspection

3D SPI

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Viscom AG

3D SPI - Viscom AG

Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.