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MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Pre-Configured Core Test Sets
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An In-Phase Core Test Sets provide you with a solid foundation and hardware framework to build your test set. Our pre-engineered Core Test Sets provide a completely integrated test set
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23.8" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-324W TGL
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Industrial-grade 23.8" LCD panel with 30k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology
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SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
Dual Quad Core Multiprocessor
DSP282A
Multiprocessor
Designed for size, weight and power (SWaP) sensitive applications, Abaco's high performance embedded computing (HPEC) platforms deliver expanded mission capabilities across a wide range of manned- and un-manned airborne, ground and naval platforms.
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Entry Level Loss Tester
Model：OLT-20
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OLT-20 Optical Loss Tester integrates laser source module and power meter module in one set, which can perform power testing and link loss testing in optic fiber network conveniently. The typical applications include fiber identification, attenuation and loss measurement, continuity verification and fiber link transmission quality evaluation for installation, routine inspection and daily maintenance of MAN, WAN and CATV systems as well as for lab test and research work.
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THIN 1U Embedded PC - Intel® 8th Generation Desktop Core™ I3/i5/i7
EPC-T2286
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Thin design with 44.2mm in height.Support Intel® 8th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
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21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Fanless Embedded System With Intel® Atom™ Processor E3845 Quad Core™ (1.91 GHz) For Railway PC
tBOX323-835-FL
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The tBOX323-835-FL, a fanless railway PC, is designed for in-train applications. Integrated with onboard quad-core Intel® Atom™ E3845 processor and 4 GB low-powered DDR3L memory. The fanless railway PC boosts its computing performance and specializes its I/O design with five isolated COM ports, two M12-type LAN connectors, USB 2.0 ports, and one isolated digital I/O. The railway PC also provides VGA and HDMI outputs for in-train surveillance. The tBOX323-835-FL is an ideal all-in-one IoT (Internet of Things) solution for various applications, including railway multi-functions of gateway, controller, digital signage management and surveillance. Certificated with EN50155 and EN50121 for rolling stock and complied with EN45545-2 for fire resistance, the rugged embedded system operates reliably in a -40ºC to 70ºC operating temperature range (EN50155 Class TX) and in a high vibration environment.
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TAP Adapter for Corelis JTAG Controllers
Low Voltage Adapter
Controller
High technology, energy efficient, and small form factor products push JTAG interfaces to the limits; low power and high performance means low voltage, high speed, and high drive requirements. Building specialized interface circuits on product Printed Circuit Boards (PCBs) is inconvenient and costly—an out-of-the-box, external solution is needed.The Corelis Low Voltage adapter is an add-on accessory that provides existing scan controllers with an active, plug-in interface to access low voltage scan chains, without sacrificing performance.
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Multifunctional Digital Design Core
PA72DIOS6016
Digital I/O
The PA72DIOS6016 is a multifunctional digital design core. The FPGA allows for implementing many different custom applications. The connector has 64 Input/Output pins which can be assigned as TTL I/O or as differential inputs. 128 MByte of DDR2 memory is available to the FPGA, and an onboard EEPROM allows for storing values in non-volatile memory. The I/O bank voltage can be FPGA-selected between 2.5 and 3.3 Volt.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Two-Way Optical Loss Test Set
KI23427OLF-INGAAS-APC
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A Two-Way Optical Loss Test set (OLTS) that's perfect for medium to ultra high fiber count loss, length and optical return loss testing applications on single mode fiber with an APC connector at triple 1310 / 1490 / 1550 nm. A pair of these compact instruments set new standards of productivity, accuracy and ease of use. The 650 nm VFL is on a separate port.
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19" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-319S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
Industrial Computer
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784227-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
Single Board Computer
ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
Controller
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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High-Performance Gaming Platform Based On 12th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA2X-AD
Gaming Platform
ADLINK's ADi-SA2X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 12th Generation Intel® Core™ processors, the ADi-SA2X-AD provides compelling graphics performance from a PCI Express 4.0x16 discrete graphics card and/or an embedded Intel® UHD Graphics 770 together with multi-display support for up to eight independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-AD fully satisfies the needs of your gaming application.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Split Core Current Transformers
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Application:Watt Transducer, Current Transducer, KWH Meter, Demand Meter, Power Factor Meter, Current Sensing Relays, Energy Management SystemsContinuous Thermal: Rating 1.25 at 30° C, 1.0 at 55° C Standard 5-amp secondary. Others available.
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15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
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Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
Optical Return Loss Meter
ORL
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•Four functions in one•Power meter and light source•Return loss meter and insertion loss meter•3 wavelength detection(1310/1490/1550nm)•Rugged, shock and water-proof for field use•Compact size, lightweight and cost-effective•Quick and easy to operate
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PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
Single Board Computer
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Product
Industrial Mini-ITX Motherboard With 14/13/12th Gen Intel® Core™ I9/i7/i5/i3 Processors
AmITX-RL-I
Motherboard
- 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 processors and Q670 chipset, up to 65W- Dual-channel DDR5 4800 MHz memory up to 64 GB- Quad. independent display: HDMI 2.0b, HDMI 1.4b, DP 1.4a, LVDS or eDP- Dual GbE ports: 1x 1GbE, 1x 2.5GbE- Expansion slots: 1x PCIe x16, 4x USB 3.2 Gen2, 2x USB 3.2 Gen1, 4x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 2x M.2 M-key- Support ATX (24+4 pin) or 12V DC-in power input
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3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Dielectric Loss Tangent Testing Instruments
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Insulation materials in electrical equipment are used between a pair of electrodes; therefore it can be expressed as capacitors. Applying AC voltage to a capacitor with insulation materials causes an energy loss due to the leak current, the dielectric polarization, and the partial discharge. Because of this, the phase of the capacitor current is more delayed than that of a zero-loss current (reactive current) flowing in an ideal insulation material. The delay angle is called "Dielectric Loss Angle", and the tangent is "Dielectric Loss Tangent" (tanδ). Please refer to the technical guide explained in detail.
