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Product
PCIe VU13P UltraScale+TM With Massive Optical I/O
PCI597
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The PCI597 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The Unit provides active cooling of the FPGA making it appropriate for power-hungry applications or those requiring temperature stability for good performance. The FPGA has interface to DDR4 memory channels (single bank of 64-bit wide, 16 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
Ultra Grade SODIMM DDR4 2666/3200
SQR-SD4E
Dual In-Line Memory Module (DIMM)
Ultra Wide temperature natively support -40~125C, Micron original Ultra High grade IC adopted. An underfill technique to stronger PCB and IC structural, 30u" Golden finger & Locked BOM components list. Exclusive SQ Manager software to monitor and deliver real time information.
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Product
Xilinx Kintex UltraScale SoM
TE0841
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Sundance Multiprocessor Technology Ltd.
The Trenz Electronic TE0841 is an industrial-grade FPGA module integrating a Xilinx Kintex UltraScale KU35 or KU40 with 2x banks of 16-Bit width 512Mbtyes DDR4 SDRAM, max 256 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
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Product
16G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U16GN32-SE1
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Product
6.5" Fanless Panel PC With Intel® Celeron® N6210 Processor
PPC-306 EHL
Panel PC
Industrial-grade 6.5" VGA TFT LCD with LED backlightDurable true-flat touchscreen with 5-wire resistive touch controlIntel® Celeron® N6210 dual-core, 1.2 GHz, processorUp to 32 GB DDR4 SDRAMCompact, fanless design with IP66-rated front panelSupports expansion via M.2 slotSupports VESA 75 x 75 mounting holes
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Product
DDR4 Protocol Debug And Analysis Solution
U4972A
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The U4972A DDR4 DRAM bundle provides software applications, probing, and hardware options for DDR4 DRAM debug, compliance validation, and analysis. The U4972A bundle includes systemization of hardware (modules installed into chassis) and software loaded onto the M9537A controller.
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Product
8-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - PCIe
Model 78131
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized versions available
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
Software Development Kit
Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
Dual LGA3647-P0 Intel® Xeon®Scalable EATX Server Board with 12 DDR4, 5 PCIe x16 + 1 PCIe x8 + 1 PCI, 8 SATA3, 6 USB3.0, Dual 10GbE, IPMI
ASMB-925
Server Board
- EATX Server Board with dual Xeon Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3), one PCIe x8 (Gen3), and one PCI slot- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and six USB3.0 ports- 0 ~ 40 °C ambient operation temperature range
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
PCIe FPGA Carrier For FMC+, Altera Arria-10 GX1150
PCI536
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The PCI536 is based on the Altera Arria-10™ GX1150 FPGA in F1517 package. The FPGA interfaces directly to the FMC+ DP 0-23 (single connector) and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. The PCI536 has x8 PCIe edge connector routed to the FPGA PCIe Gen3 hard IP block. It also has interface to two DDR4, 64-bit wide, with 16 GB total memory. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Product
Industrial Fanless Mini PC (Dual 4K Media Player)
EMP-100 Series
Box PC
- Palm size and slim design (H: 28mm)- Intel® Celeron® N6210/J6412 processor- Support 2x HDMI output- Support 12V DC input- 1 x DDR4 SO-DIMM, up to 16GB- 1 x M.2 2280 Key M for optional storage device- 1 x M.2 2230 Key E for optional Wi-Fi/BT Module- 3 x USB 3.2 Gen.1 (Type-A)
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Product
Logic Analyzer Module With State Mode Up To 4Gb/s
U4164A
Logic Analyzer
The U4164A logic analyzer provides industry’s highest data rate state mode (up to 4 Gb/s), highest deep trace timing mode (up to 10 GHz), and deepest memory (up to 400 Mb), enabling validation and debug of DDR4 or LPDDR4 at data rates over 3.5 Gb/s.
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Product
Space Radiation Tolerant 4GB DDR4
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This 4GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.
