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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
Interposer
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Product
Industrial Flash & Memory Solutions DDR4 Memory
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SQRAM DDR4 memory modules perform at superior speeds of up to 3200 MT/s, a 20% reduction in power consumption, and higher capacity than DDR3.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
Motherboard
Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
Interposer
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
RAMCHECK LX DDR4 Memory Tester
INN-8686-DDR4
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The RAMCHECK LX DDR4 quickly and accurately tests and identifies DDR4 DIMMs for servers and desktops, as well as laptop SODIMMs.
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Product
Dual LGA3647-P0 Intel® Xeon® Scalable EATX Server Board with 24 DDR4, 5 PCIe x16 + 1 PCIe x8, 10 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-935
Server Board
- EATX server board with dual Xeon Scalable processors- DDR4 2933 MHz RDIMM up to 3TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards- Intel® X557-AT2 dual 10GbE ports- Ten SATA3.0 and six USB3.0 ports- One M.2 2280 (SATA / PCIe compatible)- 0 ~ 40 °C ambient operating temperature range
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Product
SODIMM DDR4
SQR-SD4N
Dual In-Line Memory Module (DIMM)
Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
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Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
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Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
Dual In-Line Memory Module (DIMM)
DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SFF
Model 6350
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- Now available in RFSoC Gen 3 with the Model 6353- Small form factor rugged enclosure- Conduction-cooled- Designed to the IP67 specification for dust and water immersion- Sealed military-grade circular connectors- Incorporates Xilinx® Zynq® UltraScale+" RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- Optional dual 100 GigE UDP optical interface- Optional fan cooling for benchtop use- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
21.5" Fanless Panel PC With Intel® Celeron® J6412 Processor
PPC-321W EHL
Panel PC
Industrial-grade 21.5" Full HD TFT LCD with 50K backlight lifetimeDurable true-flat touchscreen with projected capacitive touch controlIntel® Celeron® J6412 quad-core, 2.0 GHz, processorUp to 32 GB DDR4 SDRAM1 x RS-232, 1 x RS-232/422/485, 2 x USB 2.0, and 2 x USB 3.1Compact, fanless design with solid aluminum alloy enclosure and IP66-rated front panelSupports E-key for wireless moduleSupports expansion via M.2 slotSupports Windows Embedded Linux and Android OS
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
Industrial Computer
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF
Model 6353
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- Small form factor rugged enclosure- Conduction-cooled- Designed to the IP67 specification for dust and water immersion- Sealed military-grade circular connectors- Incorporates Xilinx® Zynq® UltraScale+" RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- Optional dual 100 GigE UDP optical interface- Optional fan cooling for benchtop use- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Rugged PC Compatible
SYS-ITX-N-6425E
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WINSYSTEMS’ SYS-ITX-N-6425E is an industrial embedded computer based on the Intel® Atom™ x6425E Elkhart Lake processor family. It uses less than 12 watts for fanless applications and performs reliably in industrial operating temperatures ranging from -20º to +60ºC. The unit includes a SODIMM socket supporting up to 32 GB of DDR4 system memory and internal mounting support for one 2.5” SATA HDD/SSD. Additional storage is available through MiniPCIe, mSATA, and microSD.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
Server Board
- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Product
Rugged SODIMM DDR4 2666/3200
SQR-YD4N
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
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*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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Product
Ultra Compact PC-Based EtherCAT Controller With Intel Atom Processor, 64GB EMMC, 2 X LAN, 2 X USB And Slice IO Expansion
AMAX-357
Controller
Up to 32-axis EtherCAT PC-based motion controllerIntel® Atom® quad-core x6413E processor4 GB DDR4 onboard memory64GB eMMC on board storage2 x GbE LAN, 2 x USB, 1 x HDMI, 1 x EtherCATFull-size mPCIE/mSATA for flexible expansionBuilt-in TPM2.0 for hardware-based securitySupports PTP, linear and circle interpolation, Path tableSupports C/C++, VS.Net, LabVIEW programming languages
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Product
8-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - 6U VPX
Model 57131
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports one Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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Product
ATCA PCIe Rugged Processor With Dual Xeon E5-26xx V4
ATC127
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The ATC127 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with eight banks of memory up to 256 GB DDR4 memory. Versatile connectivity includes two PCIe Gen3 x16 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector. Onboard mSATA storage is available for local boot.
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Product
9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
Processor Blade
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
