3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
-
Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
-
Saki's 3D SPI identifies critical defects and assists with process improvement.
-
Product
3D Solder Paste Inspection (SPI)
-
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
-
Product
3D Solder Paste Inspection
aSPIre 3
-
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
-
Product
3D SPI
-
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
-
Product
Solder Paste Inspection System
KY8030-3
-
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
-
Product
3D Solder Paste Inspection system
PI Series
-
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
-
Product
5D SPI
-
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
-
Product
3D Inline Solder Paste Inspection System
TROI 7700 SERIES
-
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
-
Product
3D Solder Paste Inspection (SPI)
TR7007 SII
-
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
-
Product
3D SPI Series
MS-15
-
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
Product
3D SPI Series
MS-11e
-
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
Product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
-
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
-
Product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Soldering Fixture
Used to solder Mini Coax Solder Sleeve contacts.
-
Product
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
Soldering Fixture
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
-
Product
Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
Inspection Tool
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
-
Product
Tool, Inspection Depth Gauge, Mini Coax, ITA
910121157
Inspection Tool
Used to verify the depth setting of the center conductor of the ITA mini coax contacts.
-
Product
Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, ITA.
-
Product
Solder Past Inspection
-
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
-
Product
Solder Paste Inspection
3D SPI
-
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
-
Product
Solder Paste
MVP Versa (3D SPI)
-
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
-
Product
Solder Paste Analysis
SPA1000
-
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
-
Product
Solder Paste Printers
-
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
-
Product
Solder Paste Inspection Machine
3D SPI
-
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
-
Product
3D Inspection Software
Metrolog X4
-
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
-
Product
High Speed Solder Paste Inspection
VisionPro HSi
-
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
-
Product
3D Automated Optical Inspection
Zenith UHS
-
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
-
Product
Solder Paste Analyser
SPA 1000
-
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
-
Product
3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
-
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
-
Product
Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
-
Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
-
Product
Solder Joint Inspection System
-
DMC developed the software to inspect the solder joints of automotive power door lock switches.
