3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
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Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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Product
Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
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The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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Product
3D Imaging Sensor
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The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Product
9-Pin D-Type Female, Solder Bucket, HV
40-960-009-F-HV
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9-Pin Female D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Product
X5 Pipeline X-Ray Inspection
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Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Magnetic Particle Inspection
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Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
37-Pin D-Type Female Solder Bucket
92-960-037-F
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Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Product
68-Pin Micro-D Male Solder Bucket With Backshell
40-962B-068-SB-M
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This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Product
37-Pin D-Type Male Solder Pin HV
40-960-037-MHV
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This connector is designed to allow users to directly terminate cables with soldered connections.
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Product
Smart Inspection Station
SiS
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Smart Inspection Systems LLC was born in 2010 in response to orthopedic manufacturers’ demands for faster inspection than their sister industries. Our signature product, the Smart Inspection Station™ (SiS™), is an automated turnkey inspection solution that yields comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. The SiS™ is custom-configured per the client’s needs, yet versatile enough for simultaneous commissioning on multiple product lines. The product of years of refinement, the SiS™ gives comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. Your SiS™ can be custom-configured according to your needs, but is still versatile enough for simultaneous use on multiple product lines. And best of all, every SiS™ purchase comes with ongoing support from L3I’s expert staff.
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Product
FieldMaster 3D
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Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Automated Optical Inspection Solutions
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Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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Automated Optical Inspection
AOI
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No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Product
3D Optical Surface Profiler
NewView™ 9000
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The NewView™ 9000 3D optical surface profiler provides powerful versatility in non-contact optical surface profiling. With the system, it is easy and fast to measure a wide range of surface types, including smooth, rough, flat, sloped, and stepped. All measurements are nondestructive, fast, and require no sample preparation.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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X-Ray Inspection
MXI Jade Plus
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Restrictions in manufacturing materials and ever increasing expectations for reliability mean ensuring quality product manufacture is more important than ever. Jade Plus enables you to Prove Your Quality and reduce product returns from the field, and the associated cost and damage to reputation.
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Articulating Inspection Cameras
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Articulating Inspection Cameras with probes whose tips can be precisely turned (articulated) by the user up to 150 in two directions. Articulation enables inspection of targets located off-axis (even "behind" the probe) or in a tight space without removing the probe. The Inspection Cameras currently offered include the DCS16HPART, its wireless cousin the DCS18HPART, and the DCS665-ART Articulating Inspection Cameras.
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Bulkflow X-Ray Inspection System
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Designed to be integrated into line with optional reject stations, the Bulkflow X-ray System is perfect for loose and free flowing products. Offering a good detection levels on a wide range of contaminants including all metal, bone, glass and dense plastics.
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Product
contact/non-contact portable 3D measurement system
ScanArm
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The FARO ScanArm combines all of the advantages of the FaroArm with a hand held laser scanner and is the perfect contact/non-contact measurement system. Unlike other scanning systems, the ScanArm’s hard probe and the Laser Line Probe can digitize interchangeably without having to remove either component. Users can accurately measure prismatic features with the hard probe, then laser scan sections requiring larger volumes of data — all in one simple tool.
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Product
Inspection of Glue Dot Assembly
ScanINSPECT's ADI
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ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Product
Fiber Optic Inspection Microscope
80761
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The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
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(AOI) Automated Optical Inspection Systems
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For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Video Inspection Probe
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With today's high data rates and high definition services, connector quality and inspection has never been so important. Research reveals that up to 75% of all optical network failures are attributed to poor connector quality - reduce your installation time and ensure your network is reaching its full potential.The Video Inspection Probe (VIP) application for Anritsu field testing platforms gives operators a safe, easy way to analyze and document connector conditions.
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3D Software
Geomagic Control X
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Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
