Dicing Machines
Tokyo Seimitsu Co., Ltd. (Accretech)
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
Tokyo Seimitsu Co., Ltd. (Accretech)
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
