Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Chip Obsolescence Solutions
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Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Product
5μm Quartz Interdigitated Electrode Chip
THB1
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Transparent 5μm quartz interdigitated electrode chip for gas sensing, biosensing, and photoelectric applications.
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Product
100μm Flexible PI Interdigitated Electrode Chip
FIC1
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100μm flexible polyimide (PI) interdigitated electrode chip for gas sensing, biosensing, humidity monitoring, and electrochemical research.
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Chip Tester
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Chip aging test is a very important task. It simulates various environmental and stress conditions of the chip during long-term use, evaluates its reliability and life, and provides effective reference and guidance for chip product design and manufacturing. It is necessary to select high-quality chip testers to ensure accurate test data, thereby further improving the reliability and life of chip products.
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100μm Gold Interdigitated Electrode Chip
IGE1
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Gold interdigitated electrode chip with a 100μm gap for gas sensing, humidity monitoring, and biosensor applications.
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LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
5μm Transparent Quartz Interdigitated Electrode Chip
TIM1
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5μm transparent quartz IDE chip designed for MEMS, gas sensing, bioelectrochemical, and photoelectric applications.
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10μm Single-Channel IDE Chip
SCI1
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Single-channel 10μm interdigitated electrode for gas sensing, biosensing, and photoelectric research.
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4μm Transparent Quartz Interdigitated Electrode Chip
TIA1
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4μm transparent quartz IDE chip designed for MEMS, gas sensing, biosensing, and photoelectric applications.
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Current Sensing Chip Resistors
CS
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*3W rating in 1W size, 1225 package*High purity alumina substrate for high power dissipation*Long side terminations with higher power rating
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Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of Chip Resistors including conventional Thick Film Chip Resistors, Specialized Resistors such as Thin Film, Current Sense, Anti-Sulfur, Anti-Surge and Metal Film Chip Resistors.Panasonic’s standard Thick Film Chip Resistors are offered in cases sizes from 01005 to 2512.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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SMD/Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of SMD/Chip Resistors including conventional Thick Film and Precision Thick Chip Resistors as well as specialized Resistors such as Thin Film, Metal Film Chip, Current Sense and more.
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32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Metal Foil Low Resistance Chip Resistor
MFF
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*Low Resistance / TCR / EMF / Inductance*Excellent long term stabilityRoHS compliant and halogen free.*Lead free.*High precision current sensing and voltage division.
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32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Chip Inductors AECQ200 Compliant
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Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
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Chip Test Adapter
SOJ EDO/FPM
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Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Anti-Sulfurated High Power Wide Terminal Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Chip Rings
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Panasonic Industrial Devices Sales Company of America
Extremely robust Chip Rings for signal measuring terminals featuring a metal sheet structure for high reliability.
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8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Semiconductor Thermal Transient Tester
T3Ster®
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T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
