Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
High-Temperature SOIC DIP Adaptor
SERIES 35000-10-HT
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High Temperature Lead Free SOIC DIP Adapters. A cost effective means of upgrading to SOIC...without changing your PCB layout. Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers.
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Product
68-Pin PLCC-to-DIP 64-Pin Motorola MC68HC000 Adaptor
1110267-N
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68 PIN PLCC PACKAGE MOTOROLA MC68HC000 TO 64 PIN DIP FOOTPRINT. Allows easy replacement of a difficult to find part.
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Product
Vertisocket™ Horizontal Mounting
Series 800
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Vertisockets Horizontal Mounting with Bifurcated Contacts. Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting position and pin configuration provide exceptional design freedom.
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Product
Economy Mini-Link™ Miniature Jumper
Series ME-100
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Economy Mini-Link Miniature Jumper. Mini-LinkTM miniature jumpers are useful for jumpering .025 [.63] square pins on .100 [2.54] centers. Their miniature size makes it possible to stack one on top of the other.
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Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
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132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
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144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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Product
Mini-Link™ Miniature Jumper
Series ML-100
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Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
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Product
SOWIC-to-DIP Adaptor 14 to 28 Pins
Series 35W000
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SOWIC to DIP Adapters - 14/28Pins. A cost effective means of upgrading to SOIC without changing your PCB layout.
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Product
Header Covers
Series 650
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Header Covers. Aries offers a complete line of DIP headers and covers useful for mounting components such as resistors, diodes, etc. Consult Data Sheet 12032 for mating DIP header information. Four cover heights provide mounting of 1/8? [3.18] high to 3/4? [19.05] high components.
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Product
Pin-Line™ Header with Screw Machine Contacts
Series 0625
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Pin-Line Headers with Screw Machine Contacts. Aries Pin-Line headers are available with a variety of screw machined contacts. Consult Data Sheet No. 12034 for strip-line headers with coined contacts. Break feature allows header to be cut to the number of positions desired.
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Product
24-Pin SOIC w/Package-to-22-Pin 0.400" DIP
22-304504-18
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24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
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Product
PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adaptor
Series 505
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PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
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Product
DIP Jumpers
Series 100 thru 111
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DIP Jumpers. Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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Product
160-Position QFP-to-PGA Adapter
96-160M65
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QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
20-Pin PLCC-to-16-Pin DIP Adaptor
16-304633-18
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20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS. A cost effective means of upgrading to PLCC Package without changing your PCB layout.
