Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
SOIC DW-to-20-Pin PLCC
MC145158-2
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ADAPTER FOR MOTOROLA. FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. A cost effective means of upgrading to SOJ or SOIC ... without changing your PCB layout.
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Product
Male/Female DIP Jumpers
Series 200 thru 216
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Male/Femaie DIP Jumpers. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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Product
PLCC-to-DIP Adaptor
Series 352000/353000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
DIP-ER™ Logic Jumper
Series 115, 116, & 117
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DIP-ER Logic Jumper. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. DIP-ER Logic jumper wiring is point to point. Consult factory for other wiring needs.
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Product
PLCC-to-DIP Adaptor
Series 652000/653000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
QFP-to-PGA Motorola DSP56000/001 Adaptor
97-56001
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QFP to PGA Adapter for Motorola DSP56000/001. Convert surface mount QFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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Product
Header Covers
Series 650
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Header Covers. Aries offers a complete line of DIP headers and covers useful for mounting components such as resistors, diodes, etc. Consult Data Sheet 12032 for mating DIP header information. Four cover heights provide mounting of 1/8? [3.18] high to 3/4? [19.05] high components.
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Product
Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
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Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Product
DIP Adaptor
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48Pin .5mm QFP to 48Pin .6 Dip Adapter. Makes 48 pin QFP prototype circuits with a standard bread board easy.
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Product
Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adaptor
Series 505
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PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
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Product
Shorting Plugs and Jacks
Series SP200 & SJ200
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.040 [1.02] Shorting Plugs and Jacks. These shorting plugs and jacks are used in conjunction with Aries DIP strips, available separately, for your programming needs. Consult Data Sheet Nos. 16007 and 16008 for details.
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Product
Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor
1110748
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Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
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Product
QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adaptor
96-208M50
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QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
