Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
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Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Product
SSOP-to-DIP Adaptor
Series 651000
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SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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Product
SSOP-to-DIP Adaptor
Series 351000
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SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
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Product
68-Pin PLCC-to-DIP 64-Pin Motorola MC68HC000 Adaptor
1110267-N
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68 PIN PLCC PACKAGE MOTOROLA MC68HC000 TO 64 PIN DIP FOOTPRINT. Allows easy replacement of a difficult to find part.
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Product
DIP Header with Screw Machine Contacts
Series 625
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DIP Headers with Screw Machine Contacts. Aries offers a full line of DIP headers, available with either screw machine or coined contacts in a variety of styles. Consult Data Sheet No. 12032 for coined contacts.
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Product
SOIC and SOJ-to-DIP Adaptor
Series 35000X
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SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
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Product
QFP-to-PGA Motorola 68340 144-Pin Adaptor
97-68340
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144 Pin QFP to PGA Adapter for Motorola 68340. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
DIP Jumpers
Series 100 thru 111
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DIP Jumpers. Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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Product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
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Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
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QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
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132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Product
Universal Test Socket Receptacle
Series 6556
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Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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Product
160-Position QFP-to-PGA Adapter
96-160M65
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QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
