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Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Earth Resistance & Resistivity Meter
MRU-200
MRU-200 is the only meter in the market which uses all measurement methods.Possible measurements:- earth resistance measurment with 2-pole, 3-pole,4-pole method,- impulse earth resistance measurement, two kinds of measuring impulse 4/10s, 10/350s,- earth resistance measurement without disconnecting measured earths (using clamp),
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Resistance Meter
MT8-4L
М-module МТ8-4Л is a mezzanine module designed to measure the resistance of resistive sensors using a four-wire measurement circuit in eight channels (eight-channel digitizer). М-module МТ8-4Л is installed on the carrier of mezzanines - module НМ-М and is connected to it via a local information highway. Up to four m-modules of various types can be installed on the NM-M module. The NM-M module, together with the m-modules installed on it, forms a VXI module of size C-1 and is used to create information measuring VXI systems.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Batch Wafer Transfer Tools
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
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2D/3D Wafer Metrology System
7980
Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Resistance Tester
KT-2000RD
This equipment represents the wanted resistance value in digital figures and at the same time, is an ohmmeter which decides products to be bad in case of being out of the previously set range of H,L and to be good in case of being within the range. Moreover, because it is designed and manufactured on the basis of KAST's business experiences and know-hows accumulated through on-the-spot works for a long time, it is highly trustable, especially strong to noise and impulse that occur on the bad electric condition of on-the-spot or on the connection with any other equipments, and also is convenient for use.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Contact Resistance Meter
CRM 200B+
CRM directly measures micro-ohm values at 200A DC under live EHV switchyard conditions quickly & accurately. It is specially designed to reliably measure micro-ohm contact resistances of Circuit Breakers, Isolators, Busbar joints, earth switch joints, welded joints etc., under the hostile electrostatic noise found in live EHV switchyards up-to 765 kV. SCOPE’s ability to make electronics work in such environment enables CRM to measure mili-volts signal in the presence of kilo-volts noise.
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Wafer Mapping Sensor
M-DW1
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Electronic Resistance Store
MPS2
The MPS2 module is a mezzanine module designed to form DC resistance in two channels with a four-wire measurement circuit. MPS2 is installed on the mezzanine carrier - the NMU module and is connected to it via a local information highway. Up to four mezzanines of various types can be installed on the NMU module. The NMU module together with the mezzanines installed on it forms a VXI module of the size C-1 and is used to create information measuring VXI systems.
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Automated Resistance Standard
SmartResistor
The SmartResistor combines, into one transportable device, all the items needed to maintain resistance: a set of standard resistors, a controlled temperature bath, a low thermal emf scanner, and measurement data.
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Resistance Measurement
PROMET
High-precision micro-ohm measuring systems with adjustable DC test current for determining resistances on circuit breakers or inductive loads such as transformers, for example. The high-precision ohm meters of the PROMET series are used to determine very low electrical resistances in the µΩ range. The adjustable test current of up to 600 A in combination with a four-wire measuring method delivers measurement results which meet stringent accuracy requirements. State-of-the-art power electronics coupled with a robust design guarantee excellent reliability for use as a portable device in switching stations and industrial environments. Typical applications include determining the contact resistance of switchgear devices and determining the resistance on inductive loads such as transformers.
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Earth Resistance Testers
.Multi Test Voltage.Conductor resistance measurement(DET4300).Soil resistivity measurement(DET4300).LCD background light.Data hold.Working LED indicator.Low battery warning.Function symbol display
