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Semiconductor Substrate
thin crystalline material sliced from ingot.
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Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Custom Coatings
MICROMATTER provides custom coating services (single or multi-layer) on customer supplied glass, metal and semiconductor substrates.
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High Volume Semiconductor Substrate Interconnect Tester
GATS-2100
Pre-align *load *CCD camera alignment *electrical test * unload * sort of pass, opens, shorts, and alignment errors.The GATS-2100 concurrent approach provides unmatched volume capability... 2.5 seconds per device. As with all Nidec-Read Test systems, the GATS-2100 offers you the most test technologies for your requirements
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Calibration Substrates
The GGB Industries, Inc., line of CALIBRATION SUBSTRATES allows the user to calibrate any GGB Industries, Inc., microwave Picoprobe® at the probe tip. The underlying principal of the calibration of a measurement system is to provide accurate known standards to which the measurement system can be connected
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Semiconductor
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Semiconductor
With state-of-the-art manufacturing facilities in the U.S., Europe and Asia, local sales offices throughout the world, and on-site applications support, FUJIFILM Electronic Materials is your global partner.
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Semiconductor Testers
Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Semiconductors
Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Semiconductor
You can find Spring probes used for test process for production of semiconductor here. Spring probe is probe with spring inside and is also called Double-ended probe and Contact probe. It is assembled in IC socket and becomes electronic path, which vertically connects Semiconductor and PCB. By our excellent machining technique, we can provide spring probe with low contact resistance and long life. “MARATHON” series is our standard lineup of spring probe for testing semiconductor.
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Semiconductor
Semiconductor technology requirements often outpace the test coverage that traditional ATE provides for analog, mixed-signal, and RF test. Semiconductor test engineers need smarter solutions that address cost, scalability, design, and device challenges.
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Compound Semiconductor
Scientific Computing International
Semiconductors that are made from two or more elements.
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Semiconductor
Copper Mountain Technologies USB VNAs provide a low-cost semiconductor testing option, offering measurement speeds on the order of 10,000 points per second while maintaining 80-90 dB dynamic range, are uniquely suited for deployment into such demanding scenarios. Additional considerations for these applications include availability of external trigger inputs and outputs, amenability to external program control, size of the instrument, and parallel processing capability.
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Semiconductor Package Wind Tunnel
WT-100
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Semiconductor Testing
Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.
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Semiconductor / FPD Inspection Microscope
MX61L
Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.
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GaN substrates
Sumitomo Electric Industries, Ltd.
Gallium Nitride (GaN) substrates are widely used for optical devices in the blue-violate to green ranges due to their excellent material characteristics. In recent years, GaN substrates have been drawing attention for power devices. Many development projects are underway.
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Semiconductor Switching Systems
Keithley 700 Series
The high speeds and low currents of semiconductor devices demand high quality, high performance switching of I-V and C-V signals. We offer switching solutions for both semiconductor R&D and production test applications with mainframes that can support up to 2,880 channels and a family of matrix cards designed specifically for semiconductor applications.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Semiconductors
Meets SDIO card v2.0 specificationSupports SDIO SPI, 1-bit, and 4-bit SD modesHost clock rate from 0-50 MHzSingle SDIO function interfaceSD commands processed in hardwareReset output on completion of initializationIndication of high speed and high power enabling to application logicMaximum block size supported is 1024 bytesThree I/O mode selection pinsCRC7 and CRC16 modulesSupports direct R/W (IO52) and extended R/W (IO53) commandsAPB bus interfaceParallel bus interfaceStandard 8051 split bus interfaceGeneric 8051 bus interfaceUART interface
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Compact Semiconductor ATE
QST286
Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Substrate Thickness, Warp, and TTV Measurement
413 Series
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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Semiconductor Testing
The integrated PXI platform and the open interfacing provides extension capabilities for additional testing requirements like DUT specific resistors-networks or temperature sensors. The Test System comes with the ready-to-run GTSoftware package and allows easy programming of test sequences (GTbuilder) and fast execution in production/test mode (GTengine).
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
