ASIC
Application Specific Integrated Circuits are application specific custom made ICs.
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Product
Development Switch
TTESwitch Lab Space
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The TTESwitch Lab Space supports laboratory testing efforts of Time-Triggered Ethernet applications; user development costs can be reduced by using the internal TTESwitch Controller HiRel ASIC that is also used in flight equipment. With advanced features like speeds of up to 1 Gbit/s, flexible physical layer configuration and three supported traffic classes, it is the optimal switching solution for a large variety of application areas. TTEthernet is a fault-tolerant, real-time communication protocol for safety-relevant systems integrating Ethernet and TTEthernet data flows onto one physical infrastructure.
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Product
Custom & ASSP
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Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Product
Power Bead Inductors
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Power bead inductors are typically used in high current multi-phase voltage regulators that power processors, memory modules and high current ASICs and FPGA in a wide range of applications including servers, graphics cards, storage and data centers. The construction consists of a ferrite core assembled over a 1T or 2T winding and which allows for extremely low DCR, high peak current and low AC losses. Pulse has single phase, integrated phases and coupled inductor versions. Our high volume manufacturing enables us to produce components that are cost-effective while maintain exceptional quality and reliability.
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Product
EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
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The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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Product
ASIC / COT / FPGA Design
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EL & Associates, Inc. specializes in integrated solutions for design (RTL to GDSII), Design-For-Test (DFT) and Design-For-Manufacturing (DFM) services for ASIC, ASSP, COT, and FPGA. We engage with customers from RTL phase to silicon prototype. The ELA methodology is optimized to manage risk in design, manufacture and product deployment. ELA has successfully completed over 750 designs to date.
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Product
Complete IP Module
Scan Ring Linker SRL
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The Scan Ring Linker SRLTM - is a complete IP module that can be easily embedded into a CPLD, FPGA or ASIC on a PCB to reduce the complexities and costs of designing 1149.1 (JTAG) test infrastructure for designs that use multiple scan rings. The SRL IP module links any number of scan rings (secondary scan paths) into a single high-speed test bus, which permits devices on secondary scan chains to be independently tested and configured through a single 1149.1 external interface.
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Product
Analyze RTL
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ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Product
VME Master - DAQ and Detector Interface
VX1394
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The VX1394 board features a radiation hard 4.8 Gbps SERDES ASIC, which, in connection to a rad-hard optical transceiver implements a newer generation optical links for many detector readout systems. The ASIC performs data transmission, trigger distribution and clock forwarding towards the front-end electronics in the crate.
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Product
Verification IP's
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SmartDV Technologies India Private Limited
We develop Verification Components, leveraging our rich experience in ASIC / SoC design verification and capabilities on high-level verification languages (HVLs). Our verification components are configurable, reusable plug-and-play verification solutions for standard interfaces based on HVL. We currently support SystemVerilog, Vera, SystemC, Specman E and Verilog. All our VIP''s are supported natively in SystemVerilog VMM, RVM, AVM, OVM, UVM, Verilog, SystemC, VERA, Specman E and non-standard verification env.
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Product
I/O Expanders and Level Translators
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ST’s Xpander family of general-purpose input/output port expanders are used to interface digital ASICs via a two-line bidirectional bus (I²C) . ST’s dual-supply level translators are used as interface between multi-voltage chipsets and system I/Os, ranging from 5.5 V down to 1.2 V.
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Product
GRIDSCAN 5000
Hydrogen Series
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The H2scan GRIDSCAN 5000 Hydrogen Sensor pairs a high performance ASIC to H2scan’s field-proven solid-state hydrogen sensor. This stand-alone sensor system has been designed to provide precision hydrogen measurement, at a lower cost for the high-volume OEM or utilities. No calibrations or maintenance is needed for up to 10 years, and the GRIDSCAN 5000 is the lowest cost by thousands to any other available hydrogen DGA system. H2scan is the only company in the industry that can state retail sales of over 15,000 sensor systems worldwide with no after sale calibrations performed since 2012.
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Product
Mixed Signal Tester
STI9000
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The STI9000 is a mixed signal ATE used for testing ASIC and MEMS products. Each STI9000 test instrument fits into a small tester mainframe and contains multi-functional analog and digital test resources.
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Product
Transducer / Transmitter
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General purpose industrial pressure transducer provides outstanding integrity concerning high shock, vibration and pressure cycling. Utilizing high-performance ASIC, digital compensation provides excellent temperature performance, while the thin film sensor enables long-term stability.
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Product
FPGA Image Processing (IP) Development Kit
ProcVision
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Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).
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Product
Network Switches
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Our switch fabric modules provide full service switching through hardware accelerating ASICs from leading device makers including Mellanox or may be software defined for upgradability. These high bandwidth switches include system management capabilities including full compliance with VITA 46.11.
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Product
STP Engine (IP Core)
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The Stream Transpose® (STP) engine is a reconfigurable processor (DRP: Dynamically Reconfigurable Processor) core that combines the flexibility of software and the speed of hardware. The firmware defining processing can be reconfigured in an instant, allowing an almost infinite variety of functions to be integrated into a system. A 40nm process is currently available for ASIC.
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Product
Component Test and Analysis Laboratories
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The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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Product
PCI Express IP
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Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Product
Inductive Proximity Sensors
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Millions of inductive proximity sensors are currently in use in virtually all industries. They detect metal objects without contact, and are characterized by a long service life and extreme ruggedness. With the latest ASIC technology, SICK's sensors offer the ultimate in precision and reliability. SICK can provide the right solution to meet your requirements every time – from cylindrical or rectangular standard sensors with single, double or triple operating distance, to special sensors for explosive zones and harsh environments. Our sensors are the intelligent, reliable route to implementing industry-specific and customized solutions to any task involving automation.
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Product
Ultrascale FPGA PCIe Board
SE100 – Solar Express
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Sundance Multiprocessor Technology Ltd.
SE100 is based on Xilinx’s Virtex Ultrascale FPGA XCVU190-2FLGC2104E, and is a powerful processing card with plenty of IO capabilities to meet the needs of modern compute-intensive applications such as Supercomputing, Data Centers and defense. The board can optionally be populated with 095, 125, and 160 devices in C2104 package for reduced cost. Host interface is via 8 lanes of PCIe Gen3 but the card can also be used as an embedded, standalone, hardware too. Multiple cards can be cascaded to provide a multi-FPGA system with cards connected together via the board’s fast IO channels to meet the needs of even more demanding applications like ASIC design and Stock Market fast trading systems.
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Product
PCI Express 5 Base Specification Receiver Test Automation
N5991PB5A
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The N5991PB5A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 5.0 ASICs
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Product
Universal PMICs
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PowerArchitect™ design and configuration software speeds development and significantly reduces overall time-to-market compared to legacy analog power solutions. An I²C interface and multiple GPIO pins ensure easy system integration. Configurable warning and fault levels, fault behavior and power up and down sequencing ensure any load can be properly powered and protected. The power system design can be completed with confidence long before the final revision of the SoC or ASIC is available.
