Solder Paste Inspection
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Measurement, 3D Solder Paste Inspection
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Product
PDP Driver/Function Inspection System
SRV
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*Greatly Reduced Testing Tact Time*Cutting-Edge Inspection*Easy Operation
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Product
Testing, Inspecting & Cleaning Kit
KI-TK033
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850/1300 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO, SC, LC connectors
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Product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
Measuring And Inspection Systems For Rubber And Tires
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The rubber processing industry, as well as the tire production process is supported by Micro-Epsilon with a range of systems for inspection, monitoring and control of miscellaneous processes.
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Product
X5 Pipeline X-Ray Inspection
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Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Connector, 104-Pin D-Type Male, Solder Bucket, 5A
40-960-104-M
D-Sub Male Connector
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell.
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Product
Optical Inspection Machine
3D AOI
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3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
On-site EL/PL Inspection Machine
“EPTiF”
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"EPTiF (EL/PL Test in Field)" enables you to check invisible conditions of installed solar panels during daytime by EL and PL inspections, which are adopted by a number of solar panel manufacturers, without detaching solar panels. Irradiance-independent and steady results can be obtained. This is the first in the industry.
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Product
Wave Soldering Machines
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Shenzhen Leadsmt Technology Co.,Ltd
A bulk soldering process used for the manufacturing of printed circuit boards.
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Product
Automatic Flight Inspection System
AT-930DG
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Fully Automatic OperationAll-Weather CapabilityDifferential GPS Position ReferenceHigh Accuracy and Maximum ReliabilityWindows User Interface SoftwareEasy to Operate and Easy to LearnMinimum Maintenance RequirementsModular System ArchitectureLong-Term Supportability
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Product
Backplane Profiling & Inspection System
603d
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A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Product
Xray Food Inspection
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FlexXray has developed leading, certified technology and processes to use advanced x-ray technology to inspect products specifically for food companies. Although they look like a TSA line at the airport, our systems are highly customized machines and processes built specifically to find contaminants like metal, glass, wood, stone, plastic, and rubber in food products of all types. What we do is find needles in haystacks – but the needles we find are even smaller than needles in a haystack. In fact, FlexXray can find contaminants down to 0.8mm or smaller.
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Product
Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Product
Solder Cup Connector Kit
Y1140A
D-Sub Female Connector
Used to build custom cables for 34922, 34924 – 78-pin Dsub female – 60 V
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Product
Code Verification Systems for Quality Inspection
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Matrix codes enable the comprehensive and seamless traceability of goods, which turns out as significant advantage considering everyday product recalls across all industries. Whether salmonella in food, contaminated cosmetics or poor components: defective products can harm consumers, cause losses of image as well as massive economic losses. Using the 2D code, each individual article can be localized globally. Based on the specific serial number, producers and consumers can clearly identify articles if required. That represents a perfect tool for determining whether the article is subject to be withdrawn from circulation. The proper application and specification of 2D code contents allows for serious and sustainable companies to limit recalls, save costs, and to take responsibility for consumer protection.
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Product
IoT Data Inspection App
Data Explorer
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he Application Data Explorer allows you to easily explore, aggregate, and analyze historical data across all of the devices in an application.The data explorer can be accessed through the "Data Explorer" link in the Application navigation bar: control the time range, resolution, and aggregation of the data. determine what devices and attributes we are gathering data from. displays the data in various ways (in graph form, in table form, or in aggregation form)
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Product
WiFi Inspection Cameras
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WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
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Product
Replacement Solder tip lead set for D420/D620
Dx20-SI
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- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
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Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Product
Real-time X-ray Medical Device Inspection System
The Bench-X
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Our latest real-time, compact system used for Medical Device X-ray Inspection. Very configurable and compact with high resolution at relatively low radiation levels.
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Product
X5C Compact X-Ray Inspection
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Designed with packed convenience food, ready meals and small packaged goods in mind, the X5C is LOMA's smallest X-ray system available, with a machine length of 1000 mm and offers excellent Critical Control Point (CCP) protection in the smallest footprint possible - and manufactured under LOMA's Designed to Survive philosophy to provide one of the toughest systems on the market.
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Product
Defect Inspection Module
EB40
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The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Product
Appearance Inspection
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We perform quality assurance agency of customers' important products through inspection.
