Deposition
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Dynamic Scale Deposition Loop System
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Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Deposition Systems
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When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
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Thin-film deposition
Plasma Source
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SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Atomic Layer Deposition Systems
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Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Physical Vapor Deposition Systems
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Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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Electron Sources
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SPECS Surface Nano Analysis GmbH
To our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.Compliance with industry standards, a good price-performance ratio, stability, and longevity are the guidelines for our product development. We focus on standardized easy handling, user-friendliness, standardized software interfaces and safety.
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Ceramic Process Carrier Pallets
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Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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PLD Systems
Pulsed Laser Deposition
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Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Gas and Vapor Delivery Systems
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In thin film deposition, high-quality results start with how process gases are delivered, as they help create the stable environment needed for consistency by controlling flow, pressure and composition to support processes like ALD, CVD, and PVD. Advanced semiconductor devices developed for the most advanced computing processes, such as AI and edge computing, need the ultra-high-purity environments of our gas and vapor deposition delivery systems.
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Trace Moisture Analyzer
Model 8800P
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Teledyne Analytical Instruments
The 8800 series uses field proven aluminum oxide (Al2O3) sensing technology to accurately detect trace moisture on either a continuous or spot checking basis. All Al2O3 sensors share the same basic operating principle: the capacitance measured between the sensor’s aluminum core and gold film deposited on the oxide layer varies with the water content. The 8800 series moisture sensor employs unique Hyper Thin Film (HTF) technology, which offers three major structural improvements in Al2O3 sensor design. These structural changes, noted below, provide the user with increased sensitivity, greater stability and a quicker response time when compared to other conventional aluminum oxide sensors on the market today.
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EpiStride SiC CVD System
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Veeco’s latest technology for the compound semiconductor market enables high-performance chemical vapor deposition of Silicon Carbide for both 6 and 8-inch wafer production. The platform enables a return to production in under 5 hours after routine cleaning maintenance. The EpiStride system’s high uptimes, short cycle times and overall stable performance lead to the lowest cost of ownership per wafer compared to competitive systems.
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Spectrometer
AirSPEC
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Baltic Scientific Instruments, Ltd
Scintillation gamma-ray spectrometer AirSPEC is intended for measuring scintillation spectra and alsofor determination of activities and specific activities of radionuclides in samples and in conditions of natural occurrence in geometries 2 and 4.Spectrometercan be usedfor various tasksradiation monitoring, including the definition ofspecific effective activity of naturally occurring radionuclides (NORM) in building materials (granite,crushed stone, gravel, etc.), raw materials, products, waste industrial productionand rockswithoutsampling; measurements surface activity of the radionuclide 137Cs (and other); mass fraction of NORM in rocks andoresin the conditions oftheirnatural occurrence on a surface, inboreholes and in warehouses andtransportcontainers, and also in study ofsurface contaminationof soil,as well asprospecting and exploration ofmineral deposits resources.The spectrometercan be used forworkin the laboratoryand in the field conditions.
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ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Pulsed-DC Systems
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Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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kSA BandiT
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The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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Vapor Concentration Monitor
IR-300 Series
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Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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ALD
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Atomic Layer Deposition (ALD) offers precise control down to the atomic scale.Atomic layer deposition holds tremendous promise across a wide array of industries, including energy, optical, electronics, nanostructures, biomedical, and more. Please check out our Applications section for more details in any and all of these areas.
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High Temperature Absolute Pressure Transducers
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Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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ALD For Manufacturing And Production
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Uniformity over large substrates, reproducibility, and low temperature deposition make ALD an ideal candidate for the next generation of large-scale manufacturing thin film technology.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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NR01 net radiometer
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Hukseflux Thermal Sensors B.V.
NR01 is a market leading 4-component net radiation sensor, mostly used in scientific-grade energy balance and surface flux studies. It offers 4 separate measurements of solar and longwave radiation, facing both up and down. NR01 owes its popularity to its excellent price / performance ratio and major improvements relative to comparable instruments. These advantages include weight, ease of levelling, solar offsets in the longwave measurement and pyrgeometer heating, reducing measurement errors caused by dew deposition.
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Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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ALD Periodic Table
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The ALD Periodic Table is a visual guide to the elemental building blocks of atomic layer deposition. Organized by both chemistry and purpose, it helps engineers quickly find materials that meet their priorities, whether that’s conductivity, durability, clarity or thermal stability.
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Duct Deposit Measuring System
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The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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Differential Quartz Crystal Microbalance
Dike
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During an experiment to detect an affinity reaction on biological material, a molecule of interest is attached to the quartz crystal of the measurement channel, this deposition can be achieved by direct binding or by capture through another protein, the result of this process is to make the quartz sensitive to the molecule to be detected.
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Clinker Detection System
CDS
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The Clinker Detection (CDS) System is an ITM proprietary technology for measuring both the size and frequency of deposits that impact a utility boiler floor or bed. This technology enables operations personnel to shorten boiler outages, identify fouling problems and optimize soot blower operations.
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ITO (Indium Tin Oxide) Electrode
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This quite unique material transmits only visible light whereas it does not transmit UV radiation. Our ITO electrodes consist of 100 nm thick of ITO layer deposited on quartz or borosilicate glass substrate (0.5 mm thick).
