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Product
Computer On Module
COMET6-DEVKIT-460-I7
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The COMET6-DEVKIT-460-I7 is designed for rapid testing and evaluation of WINSYSTEMS’ COM Express Type 6 processor modules. This DevKit ships with WINSYSTEMS’ COMET6-1185GRE-32IL module and 11th Gen Intel® CORE™ i7 UP3-Class embedded processor. The DevKit includes all essential components for quick and easy system setup so you can start programming right out of the box, reduce engineering and software development time, perform rapid product evaluation, design validation, and speed time to market.
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
Computer on Module
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
COM Express Type 7 Development Baseboard
CEB94701
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*Two 10GBASE-KR SFP+ ports*2 SATA-600*VGA*4 USB 3.0*2 PCI Express Mini Card slots*2 RS-232/422/485
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Product
COM Express Type 7 Starter Kit
COMe Type 7 Ice Lake-D STKit
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The Type 7 Starter Kit Plus consists of a COM Express Type 7 module with ATX size Type 7 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for 10GbE adapter card that convert 10GBase-KR to 10GbE Optical Fiber or 10GbE Copper signal, one PCI Express x16 slot, two PCI Express x8 slots, Serial ATA, USB3.0/2.0, Gigabit LAN and Super I/O. in addition, a IPMI BMC (miniBMC) located on carrier board connect to COM Express Type7 module by NC-SI interface to support some of out-of-band management features. All necessary cables are included.
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Product
COM Express Type 10
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The COM Express Type 10 Mini (84 x 55 mm, credit card size) module is intended for low power platforms (TDP 12W and below), capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications. Type 10 modules are targeted at handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Product
COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
Software Development Kit
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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Product
COM Express Type 10 Development Baseboard
CEB94017
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*COM Express Type 10 baseboard*2 SATA-300 and SD card slot*1 PCI Express Mini Card slot*5 USB 2.0 and 2 USB 3.0*Port 80 display for debugging
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Product
COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
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The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Product
Qseven
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Qseven module is a very small size Computer-on-Module targeting towards low power and mobile applications. The Qseven footprint is smaller than that of COM Express and ETX. The maximum power consumption is no more than 12 watt.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
Computer On Modules
COM Express Basic
Computer on Module
COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
Multipurpose Debug Board
DB40 Debug Module
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The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features: - Port 80/81 decoding for Power On Self Test (POST) via LPC - Interface to SPI Flash for BIOS update - Interface to Board Management Controller (BMC) for update - Power and Reset buttons and status LEDs The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose. (Includes DB40 Debug Module, two 40-pin FFC cables, and 14-pin cable for SP100 DediProg USB to SPI programmer.)
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Product
MXI-Express Cable, Gen 2 x8, Copper, 5m
782317-05
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
Computer-on-Modules
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Arm-based Computer-on-Module with OSM, SMARC, Qseven, rugged RTX, and COM Express Type 7 as well as embedded board design services.
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Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
MXI-Express Cable, Gen 1 x1, Copper, 1m
779500-01
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
MXI-Express Cable, Gen 1 x4, Copper, 7m
779725-07
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
MXI-Express Cable, Gen 3 x8, Copper, 1m
785550-01
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
MXI-Express Cable, Gen 3 x4, Copper, 3m
785549-03
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
Computer on Module
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
PXIe-8399, Gen 3, x16, 2-Port PXI Remote Control Module
784180-01
MXI Express
PXIe, Gen 3, x16, 2-Port PXI Remote Control Module—The PXIe-8399 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8399 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection. An additional port allows daisy-chaining for multi-chassis configurations.
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Product
PXIe High Performance System Module: Dual Port (x16), Gen 3
M9023A
PXI Express Module
The M9023A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The M9023A has a flexible configuration capability. Each card has two Gen 3 x8 PCIe cable links capable of achieving speeds up to 8 GB/s on each port. These two ports can be combined into a single x16 cable link providing a speed of up to 16 GB/s. This means a data-intensive system can be built using high-performance desktop or rack-mounted computers.
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Product
PCIe Gen3 x8 FMC Module
PXI Express Module
VITA 57.1 FMC HPC ConnectorPCIe Gen3/Gen2/Gen1 x8 Slot (upto 64Gbps)Single module supports both PCIe Root Port & EndpointM.2 Key-M NVMe slot with PCIe Gen3 x2 interface & SATA3.0 interfaceMIPI DSI & CSI Connector through LVDS IOs32Kb-EEPROM
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Product
MXI-Express Cable, Gen 1 x1, Fiber Optic, 10m
778959-10
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
Computer On Module
ITX-M-CC452-T10
Carrier Board
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
