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Product
COM Express
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COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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Product
COM Express Solutions
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COM Express® is a PICMG® standard that defines a Computer-On-Module in a family of Small Form Factors (SFF). It is single board computers appropriate for a wide range of commercial and mil/aero applications.
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Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
COM Express Type 2 Starter Kit
Computer on Module
The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.
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Product
COM Express Type 6 Compact module
COMeT6-1100
Compact Module
The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel® 11th Gen Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
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Product
COM Express Type 10
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The COM Express Type 10 Mini (84 x 55 mm, credit card size) module is intended for low power platforms (TDP 12W and below), capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications. Type 10 modules are targeted at handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications.
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Product
COM Express Boards
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COM Express is a highly integrated Computer On Module. It can be considered as a component (integrated circuit) in more complex designs.
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Product
COM Express Type 7
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COM Express Type 7 with NXP platforms provides super speed I/O, high-bandwidth expansion interfaces, and 10 x GbE interface for data transmission.
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Product
COM Express Type 7 Starter Kit
COMe Type 7 Ice Lake-D STKit
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The Type 7 Starter Kit Plus consists of a COM Express Type 7 module with ATX size Type 7 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for 10GbE adapter card that convert 10GBase-KR to 10GbE Optical Fiber or 10GbE Copper signal, one PCI Express x16 slot, two PCI Express x8 slots, Serial ATA, USB3.0/2.0, Gigabit LAN and Super I/O. in addition, a IPMI BMC (miniBMC) located on carrier board connect to COM Express Type7 module by NC-SI interface to support some of out-of-band management features. All necessary cables are included.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
COM Express Type 6
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The COM Express Type 6 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express Type 7 10GBASE-T Network Adapter Card
10GBASE-T Network Adapter Card
Network Interface Controller
- Supports up to four 10GbE copper interface (10GBASE-T)- Compatible with PICMG COM.0 R3.0 Type 7 modules
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Product
COM Express Type 2
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Axiomtek COM Express Type 2 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express Type 6 evaluation carrier board
ATX-M-CC462-T6
Carrier Board
The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules.
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Product
COM Express Type 7 10GBASE-T Network Adapter Card
CEI-2x10GBASE-T
Network Interface Controller
- Support up to two 10GbE BASE-T interfaces- Marvell AQR113C inside- COM.0 R3.1 Type 7 compliant- Dedicated for Express-VR7
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Product
COM Express
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The COM Express product platform includes Intel©-based CPU modules and Type 2/3 or Type 6 carrier cards. Additionally, support products are available for prototyping and production such as: development systems, MIL-DTL-38999 front panels, and an assortment of cables.
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Product
COM Express Type 7
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One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
Computer on Module
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express® Type 7 Reference Carrier Board in ATX Form Factor
Express-BASE7
Carrier Board
The Express-BASE7 is an ATX size COM Express Type 7 reference carrier board. Together with the COM Express Type 7 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
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The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
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Product
COM Express Type 7 Basic Module With Intel® Xeon® D-1500 & Pentium® Processor D1500
CEM700
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The CEM700 offers scalable processor options from the 16-core Intel® Xeon® D-1577 processor to the 4-core Intel® Pentium® D1519 processor (codename: Broadwell DE). This COM Express Type 7 module comes with two 10GBASE-KR channels and supports two DDR4-2400 SO-DIMM slots for up to 32GB system memory. It delivers powerful server-class performance in a small form factor of 125 x 95 mm. Axiomtek's CEM700 is well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughputs, such as edge computing, microserver, data transmission device, and other networking fields. The Axiomtek's CEM700 incorporates two 10GBASE-KR interfaces and an NC-SI (Network Controller Sideband Interface) for remote management to fulfill server application demands. The Intel® Broadwell DE-based module has a wide operating temperature range from -20ºC to +70ºC (or optionally -40ºC to +85ºC) to fully serve the needs of diverse applications. To enable fast turnkey evaluation, Axiomtek also provides CEB94701, the COM Express type 7 baseboard to operate with CEM700. Customers can quickly emulate the functionality for software development and hardware verification.
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Product
COM Express Type 2
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The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Product
COM Express Type 6 Compact Module With AMD Ryzen™ Embedded V1000 Processor
CEM130
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*AMD Ryzen™ Embedded V1000 processors*2 DDR-2400/3200 SO-DIMM for up to 32GB of memory*Max. up to 7 lanes of PCI Express*2 SATA-600*3 USB 3.0 and 8 USB 2.0*TPM 2.0 supported*Wide voltage input from +8V to +20V
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Product
COM Express Type 7 10GbE Optical Fiber Network Adapter Card
10GbE Optical Fiber Network Adapter Card
Network Interface Controller
- Supports up to four 10GbE optical fiber interfaces (SFP+)- Compatible with PICMG COM.0 R3.0 Type 7 modules
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
COM Express Type 6 Application Board With MXM Slot
CEB94022
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*MXM type A supported*SATA-600*LVDS, VGA, HDMI, and DisplayPort*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS-232/422/485 and 1 RS-232
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
