Single Board Computers
Whole computer on one PCB.
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Product
Dual LGA 3647-P0 Intel® Xeon® Scalable Proprietary Server Board with 12 DDR4, 4 PCIe x16 + 1 PCIe x8+4 PCIe x4, 14 SATA3.0, 8 USB3.0, Dual 10GbE, IPMI
ASMB-975
Server Board
- Proprietary server board with dual Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- 14 SATA3.0 connectors (including two M.2 2242)- Four PCIe x16 slots (Gen3) for double-deck cards- Intel® X557-AT2 dual 10GbE ports- 0 ~ 40 °C ambient operating temperature range
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Product
50-Pin D-Type Breakout Female DIN mount
40-967-050-F
Breakout Board
This termination option is capable of accepting heavy duty connection wires and uses rising clamp screw terminals to minimize the danger of copper strand damage. Users should care take to protect the termination, provide a suitable method of restraining the cables, and ensure appropriate electrical safety precautions are observed.
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Product
Dual LGA3647-P0 Intel® Xeon® Scalable EATX Server Board with 24 DDR4, 5 PCIe x16 + 1 PCIe x8, 10 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-935
Server Board
- EATX server board with dual Xeon Scalable processors- DDR4 2933 MHz RDIMM up to 3TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards- Intel® X557-AT2 dual 10GbE ports- Ten SATA3.0 and six USB3.0 ports- One M.2 2280 (SATA / PCIe compatible)- 0 ~ 40 °C ambient operating temperature range
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
Cyclone V based 6U cPCI COTS Module
FPGA Board
iWave’s Cyclone V based 6U cPCI Card is a rugged standalone module complaint with 6U size CPCI PICMG 2.0 Rev 3.0 backplane, aimed for the high-speed data, video processing, and display applications. The card offer speed up to 512MB/s of DMA transfer and up to a 6 channels of transceiver interfaces capable of operating up to 6 Gbps, SFP, Built-in health monitoring circuits, DVI Input, and Output Interfaces
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Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
Modular Edge Computer
Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
Industrial Computer
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
6U CompactPCI Dual 64-bit PMC Slots Carrier Board
cPCI-8602
Carrier Board
- Supports two single-size 32,64-bit/33,66 MHz PMC sites in 4HP width- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- PICMG® 2.1 Hot Swap Specification Compliant- 3.3V or 5V V(I/O) for cPCI bus and PMC sites- PLX® PCI-to PCI bridge PCI6154 for PCI bus- Power and HotSwap LED incidators on front panel
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Product
Development Board
SOM-DB5920
Carrier Board
Development Board for COM Express® R3.0 Type 7 Modules. PICMG COM.0 R 3.0 Type 7 Pin out. COM Express ® Basic/Compact module, 10 Gigabit Ethernet support by OCP mezzanine card. Extension: PCIe x16, PCIe x8, 2 PCIe x4.
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
78-Pin D-Type Female Breakout DIN Rail
40-967-078-F
Breakout Board
This termination option is capable of accepting heavy duty connection wires and uses rising clamp screw terminals to minimize the danger of copper strand damage. Users should care take to protect the termination, provide a suitable method of restraining the cables, and ensure appropriate electrical safety precautions are observed.
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Product
Digital Output
VME-2170A
Digital Output Board
The VME-2170A optically coupled digital output board consists of VMEbus compatibility logic,data control logic, four 8-bit output registers, and 32 optically isolated high-level outputs. The board is implemented as a double Eurocard form factor PC board, and provides all necessary address decoding and data transfer control logic to accept both 8- and 16-bit data transfers. Optical couplers isolate the 32 outputs from each other and from the VMEbus.
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Product
Printed Circuit Board
RISER-PPM-1
Printed Circuit Board
WINSYSTEMS’ RISER-PPM-1 boards are designed to provide extra space in a PC/104-Plusstack. They are printed circuit boards (PCBs) with PCI-104 mounting holes and bus connectors. They allow a board with either tall components or heat sinks to be placed in a stack of boards in a location other than only at the top. The additional separation is 0.60 inches using standard PC/104-type spacers.
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Product
Digital Output Board
VME-2128A
Digital Output Board
VME-2128A 128-bit High-Voltage Digital Output Board with Built-in-Test
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Product
CPCI Advanced Compute And IO Board
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Advanced Compute & IO Board is high end Microprocessor based Mixed Input & output Board. It is suitable for high speed Data Acquisition, Simulation, ATE applications. This board have digital I/O signals, analog I/O signals, USB, RS232, Ethernet interface and external bus interface. Board is well suitable for special type data acquisition & processing application. Board has high end FPGA which is used for automatic (Programmable) data acquisition and very useful high speed data acquisition. Board is based on CPCI architecture and can be used with CPCI or PXI backplane.
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Product
High-Resolution VMEbus Laser Axis Board
10897D
Laser Board
The 10897D High-resolution VMEbus laser axis board provides excellent resolution of up to 0.3 nm with a high resolution interferometer. The data age uncertainty is dramatically reduced allowing extremely accurate measurement and control of moving systems. The very high data rates accommodate high-bandwidth and high-performance closed-loop applications. Configured with appropriate lasers and optics components, the 10897D supplies unsurpassed positioning accuracy for dynamic measurement.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
Computer on Module
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
Edge Computing Platform
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
Intelligent Computing
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EFCO offers a wide range of product platforms for intelligent applications, from entry to advanced, from edge computers to HMI. Our high performance and integrated platforms facilitate a smooth operation performance, ensuring fulfilling customers satisfaction.
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Product
Computer On Modules
COM Express Basic
Computer on Module
COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
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Product
Industrial Computers
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So what is an industrial computer and what would make an Amplicon industrial computer your preferred solution? The Amplicon industrial computer offers the user a lower long-term cost of ownership.
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Product
Board
ARDUINO UNO WiFi REV2
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The Arduino UNO WiFi Rev.2 is the easiest point of entry to basic IoT with the standard form factor of the UNO family. Whether you are looking at building a sensor network connected to your office or home router, or if you want to create a Bluetooth® Low Energy device sending data to a cellphone, the Arduino UNO WiFi Rev.2 is your one-stop-solution for many of the basic IoT application scenarios.
