Single Board Computers
Whole computer on one PCB.
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Product
Development Board
SOM-DB5800
Carrier Board
Development Board for COM Express® R2.1 Type 6 / 10 Modules. Development Board Compliant to PICMG COM.0 R2.1 Type 6 / 10 Pin-out. Support COM Express Basic, Compact & Mini modules. Expansion: PCIe x16, PCIe x4, PCIe x1, Mini-PCIe, Express Card.
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Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
Industrial Computer
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
Distribution Board, For 8 N181x SPDT Switches
Y1150A / 34945EXT
Distribution Board
Connects the 34945EXT to 8 N181x SPDT to route the power and control signals from the driver module to the switches
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Product
14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
Industrial Computer
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
Carrier Boards
ROM-DB7501
Carrier Board
ROM-DB7501 is an Referenced Carrier Board designed for Advantech's RISC Qseven 2.0 module. It i provides a thorough environment for module board evaluation with its completefunction support. It also supports 12V power input through AC/DC power adapter and with smart battery design, it's more easier for the end user to design portable devices by referring ROM-DB7501 design.
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Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
Computer on Module
ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
COM Express® Type 7 Reference Carrier Board in ATX Form Factor
Express-BASE7
Carrier Board
The Express-BASE7 is an ATX size COM Express Type 7 reference carrier board. Together with the COM Express Type 7 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor
COM-HPC Server Base
Carrier Board
The COM-HPC Server Base is an extended ATX size COM-HPC Server Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Server Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
2-Axis High-Resolution Laser Axis Board for VME
10898D
Laser Board
The 10898D 2-axis high-resolution laser axis board provides the same resolution as the Keysight 10897D high-resolution laser axis board with increased slew rates and reduced noise. The increased stage velocity limits and low noise compared to previous laser systems offer premium positioning repeatability and accuracy for advanced applications such as IC fabrication equipment.
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Product
DIN Rail, 160-Pin DIN41612 Breakout
40-967-160-M
Breakout Board
This termination option is capable of accepting heavy duty connection wires and uses rising clamp screw terminals to minimize the danger of copper strand damage. Users should care take to protect the termination and provide a suitable method of restraining the cables. Pickering cable assemblies for this product are contained elsewhere in this data sheet. Interfacing PCB?s should be designed with suitable clearances for the voltage the application requires.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
Digital Output Board
VME-2128A
Digital Output Board
VME-2128A 128-bit High-Voltage Digital Output Board with Built-in-Test
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Product
ATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Workstations, General-Purpose Servers, And Multi-Tasking.
ASMB-789
Server Board
Features an LGA 1851 socket for Intel® Core™ Ultra 9/7/5 processors with the W880 chipset, delivering next-gen performance.Supports up to 192 GB of high-speed DDR5 ECC/Non-ECC UDIMM memory at up to 5600 MT/s.Provides extensive expansion with one PCIe x16 (Gen5), one PCIe x8 (Gen5), and five PCIe x4 slots.Drives triple independent displays through DisplayPort, VGA, and HDMI 2.0 for advanced visual workspaces.Includes four SATA 3 ports for traditional storage and seven USB 3.2 ports for high-speed peripherals.Features one M.2 2280 slot (PCIe x4) for fast NVMe SSDs, accelerating boot times and application performance.Its rackmount-optimized design ensures positive airflow, enhancing cooling and system reliability in server environments.Built to operate reliably in a 0 ~ 60°C (32 ~ 140°F) ambient temperature range, suitable for various industrial settings.
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Product
COM Express Type 6 evaluation carrier board
ATX-M-CC462-T6
Carrier Board
The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules.
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Product
Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
Industrial Computer
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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Product
Development Board
SOM-DB5920
Carrier Board
Development Board for COM Express® R3.0 Type 7 Modules. PICMG COM.0 R 3.0 Type 7 Pin out. COM Express ® Basic/Compact module, 10 Gigabit Ethernet support by OCP mezzanine card. Extension: PCIe x16, PCIe x8, 2 PCIe x4.
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Product
Carrier Boards
ROM-DB7503
Carrier Board
ROM-DB7503 is the Referenced Carrier Board designed for Advantech's Qseven 2.1 module. It i provides a thorough environment for module board evaluation with its completefunction support. it's more easier for the end user to design portable devices by referring ROM-DB7503 design.
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Product
PCI Three-Axis Laser Board
N1231A
Laser Board
The Keysight N1231A PCI Three-Axis Laser Board is a register based PCI bus board that implements three axes of laser measurement for position monitoring and closed-loop servo control. The hardware outputs, optimized for connection to a DeltaTau PMAC servo control system, provide parallel digital position data at rates up to 4MHz. The same position data along with velocity data is available over the PCI bus at rates up to 100kHz (3 axes of position and velocity) or 200kHz (position or velocity only).
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Product
FMC Add-On Cards
FPGA Board
iWave’s FPGA-IP Evaluation Add-On FMC Card is designed to meet ANSI/VITA 57.1 FMC Standard. The card supports both High-Pin Count (HPC) & Low-Pin Count (LPC) connector and can be used in an air-cooled environment. FPGA-IP Evaluation Add-On Card can be interfaced with most of the FPGA development kits available in the market. This card also helps to evaluate iWave’s proprietary FPGA Intellectual Property (IP) Cores.
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Product
Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)
Q7-AL
Computer on Module
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
Computer on Module
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
Server Board
- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Computer on Module
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
