Spring Probes
Spring loaded electrical conductor contacting elements. Also known as: Pogo Pin
See Also: Pogo Pin, Test Fixtures, Bed of Nails
-
Product
Spring Contact Probes
-
We differentiated the spring contact probes by center and application, for the purpose of clarity. Please choose in the left navigation bar!
-
Product
Spring Probes & Hyperboloid Contacts
-
In-Circuit / Functional Probes, Socketless X Probes®, High Current Probes, Double Ended Probes, ATE Interface Probes, integraMate®
-
Product
High Force Type Spring Probes
-
Total length of spring probes for high force is longer than standard type and is more optimized to use for testing PCB. We have 1mm to 2.54mm pitch and you can choose not only tip type but also spring force for each pitch. This makes it possible for you to choose spring probe suits the best for your use.
-
Product
Spring Probes
Spring Probe
An essential component in the testing of electronic components. In Test & Measurement applications, they are used to make contact with test points, connecting the DUT (device under test) with the test equipment.
-
Product
High Frequency Spring Probes
-
We have spring probes for high frequency for 0.5 and 0.8mm pitch. We provide spring probe with low insertion loss by shorten the total length to 1.5mm (use length 1.1mm).
-
Product
Standard Pitch Spring Probes
-
Other than spring probes with gold plating, we have spring probe with anti-solder migration coating and plating that were developed by KITA. We also have anti-solder migration material for plunger tip. These are all included in “MARATHON” series. They have wide range of tip type for various use for every popular total length.
-
Product
Rugged Connectors
-
Guaranteed for a minimum of 100,000 connections, our rugged connectors are designed to meet your industrial & ergonomic demands in harsh testing environments. We offer numerous connector specifications all fitted with interchangeable spring loaded test probes. Supplied as a single hand held unit, panel mounted or fitted to a test lead, the combinations are limitless. Designed directly from your CAD data and thoroughly tested, our rugged & reliable connectors are used worldwide on a daily basis.
-
Product
Semiconductor Probe
-
Using the spring contact probes for semiconductor package inspection, customers can test various types of packages with LEENO's Total Interface Solution.
-
Product
Linear Testfixture (Cassette Not Included), UTT 105 x 170 mm
MG-01
-
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (1000N) 650 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 105 x 170 mm (wxd)• Outer dimensions: 254 x 400 x 50 x 140 mm (wxdxh1xh2)• Designed for changeable cassette
-
Product
WLCSP Probe Heads
-
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
-
Product
Linear Testfixture Testfixture for Mass Interconnect Cassette Interface Cassette and VPC ITA Frame Not Included, UUT 306 x 248 mm
MG-02-01 VPC G12
-
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 306 x 248 mm (wxd)• Outer dimensions: 470 x 490 x 100 x 170 mm (wxdxh1xh2)• Designed for Mass interconnect changeable cassette• Up to a maximum of 8 interface blocks of 160 or 170 signals• All interface blocks can be customized
-
Product
Linear Testfixture for VPC iCon i1 Mass Interconnected Cassette Interface (Cassette Not Included) 4 or 10 Positions Blocks, UTT 306 x 248 mm
MG-02-01
-
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 306 x 248 mm (wxd)• Outer dimensions: 470 x 490 x 100 x 170 mm (wxdxh1xh2)• Designed for Mass interconnect changeable cassette• Up to a maximum of 4 interface blocks of 160 signals• All interface blocks can be customized
-
Product
Hybrid Socket
CSP/Ballnest
-
Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
-
Product
Test Probes
-
Petracarbon is a leading supplier and provider of spring contact probes and semiconductor test sockets.
-
Product
Ingun Spring Probes
-
MicroContact AG offers the assortment of test probes and test adapters from Ingun as a Swiss representative.
-
Product
Test Contactor/Probe Head
Hydra
-
Engineered for excellence and efficiency, Hydra™ spring probe series offers precision, reliability, and standardized semiconductor test interface.Designed to be best-in-class at a competitive price point, Hydra is optimized to maximize your operational efficiency. Hydra is built to withstand demanding high-volume manufacturing test environments with its robust and durable design.With a common test-height, Hydra offers the ability to mix and match power, RF, and Kelvin probes within the same test socket. In addition, Hydra streamlines inventory management with fewer probe part numbers to manage and shorter lead times.
-
Product
PCB Connectors
-
Smiths Interconnect offers a broad range PCB connectors for harsh environments. A wide choice of configurations and terminations of signal, power, high speed, RF contacts and spring probes solutions.
-
Product
Linear Testfixture (Cassette Not Included), UTT 456 x 320 mm
MG-07
-
FEATURES• Linear click system with ball bearings, using gas springs• 10 mm ESD-proof top cover with aluminium reinforcement bars• Steel base cabinet with detachable aluminium back and bottom panels• Detachable interchangeable case system with an 8 mm spring loaded probe protection cover• Base cabinet fitted with a telescopic guide rail and catchTECHNICAL SPECIFICATIONS• Max. number of probes (2000N) 1300 units• Max. PCB height: 60 mm• Linear travel: 12 mm• Max UUT: 456 x 320 mm (wxd)• Outer dimensions: 620 x 590 x 100 x 184 mm (wxdxh1xh2)• Designed for changeable cassette
-
Product
ATE Socket
-
Design ATE socket according to customer's requirementsUse on auto-test eqiupments and handler.Pitch range from 0.30 to 1.0mm.Pin amount: 2 and above.Key material: Peek,Torlon.etcContact with top pogo pin
-
Product
Pogo Tower - Advantest T2000 FROG
-
The Pogo Tower - Advantest T2000 FROG is an advanced interface solution designed specifically for semiconductor applications. This modular pogo pin system allows for customization by enabling users to add or remove pin modules based on their unique requirements. With a cutting-edge, modular design, the Pogo Tower supports application-specific configurations, providing flexibility in various environments.This innovative product supports a significant capacity with up to 1,024 signal pins and 512 utility pins, accommodating a wide array of testing and interfacing needs. Its top-load clamshell solution ensures ease of use, making it a preferred choice for professionals looking for reliability and efficiency in their semiconductor testing setups. The Pogo Tower is engineered with precision to meet stringent technical standards, making it a vital component in modern semiconductor applications.
-
Product
Diagnostic Cores
Diagnostic VersaCore™
-
The diagnostic cores are uniquely designed in the VC20™ with Advanced Cantilever™ technology format. Using the customizable PCB, components can be added to create a “golden core” to quickly troubleshoot your system*Test SMUs*Test Motherboard*Test Pogo pins*Test Relay matrix
-
Product
Non-Magnetic Spring Probes
-
We have spring probes, which are composed of nonmagnetic material to use for test environment that requires to remove the effect of magnetism.
-
Product
Board Test Fixture Probes
-
Offering a wide range of standard spring contact probes to meet your testing requirements and has long been recognized as the world’s largest probe manufacturer. With over 60 different probe series ranging from 0.02" (0.51 mm) to 0.187" (4.75 mm) pitch with multiple length, travel, ICT, lead free and rotator options, we provide a full portfolio designed for general purpose test on bare boards, loaded printed circuit boards and surface mount assemblies.
-
Product
For AIM-65 And AIM-75S
8" MSR Module
-
MSR module is suitable for retail customer to do membership card information checking with easy installation wayMSR module is charging via pogo pin
-
Product
Pogo Pin
-
Probe pin is also known as pogo pin or spring probe. It is designed to test the connection between two circuit boards and devices or equipment under test.
-
Product
High-Current Leaf Spring Probes
Spring Probe
Made for flat contacts - fully customizable - great contacting.
-
Product
NI Semiconductor Test Systems
Test System
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
-
Product
Kelvin Test Contactor/Probe Head
Gemini
-
At 3.22 mm test height, the Gemini™ Kelvin test contactor is an excellent all-around spring probe with low inductance, high bandwidth, and excellent current-carrying capacity. The device under test (DUT) side tip design accurately maintains its 100 µm spacing for the life of the probe. Customers report typical probe life of 500 k to 800 k package insertions, or over 2M touchdowns at wafer-level test. The offset tip allows manageable board layout with a board-side spacing of 0.4 mm.Gemini Kelvin probes and contactors provide a first-rate solution that effortlessly makes reliable, true Kelvin contact for high-volume final test of both singulated packages and wafer-level devices. Gemini Kelvin is an ideal solution for devices such as power controllers, A-D and D-A converters, power amplifiers and audio and video circuits.
-
Product
Mechanical Test Head Housing
-
a result of more than 10 years' experienceavailable with integrated manipulatorfully integrated docking and board lockingtest housing mechanics design as per customer specificationssuitable for individual and high-volume productionstandard and customized dimensionsno limitation in size and electrical power capacitiesquick and easy locking and unlocking process for board changelarge application space load boardoptional number of channel boards as per customer specificationsfamily/DUT board connection achieved by high-end double-ended spring probes - 50 Ohmhigh-end cooling fansfacilitated adaptation with all available manipulator solutionsdocking design in compliance with customer internal docking standards/dimensionsdocking force as per customer specificationscenter of gravity fully compensated
-
Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
-
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
