Integrators
Unite all or part of a test system. Integration
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Product
Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
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The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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Rack Systems
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Real-time testing and validation often require versatile testing platforms, providing a high number of different signals ranging from low-power communication and sensor signals to high-power actuator signals. Integrating all the necessary components in one standard system and designing signal-conditioning for all interfaces is time-consuming and requires specific expertise.
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Product
Class 2 Integrating Sound Level Meter
Castle Sonus GA216I
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The Castle Sonus GA216i is a feature packed instrument, fully compliant with IEC 61672:2002 Class 2. This meter gives simultaneous Leq and peak measurements for assessments to the Control of Noise at Work Regulations 2005. It has a high-specification measurement microphone and is cased in tough, crack resistant ABS plastic. To comply with the Control of Noise at Work Regulations 2005, this Class 2 Sound Level Meter enables you to assess Noise in the workplace at fantastic value.
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Integrated Vision System
GEVA 312T
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The GEVA-312T is an integrated vision system complete with a 12” touch screen display, 1.6GHz dual core processor and two Gigabit Ethernet camera ports. The slim-line form factor maximizes control panel real estate for PLCs, motions controllers and non-vision related components. The GEVA-312T is a good choice for customers who are looking for a complete system that is low-cost, expandable and applicable for a wide range of vision applications.
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Product
Integrated 5G mmWave Test System
IQgig-5G
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The IQgig-5G is a fully-integrated, non-signaling solution for testing 5G mmWave products at both the 28 GHz and 39 GHz frequency bands. All signal generation, analysis, and RF front-end routing hardware are self-contained inside a single chassis. The IQgig-5G is license-upgradeable to support the pre-5G and 3GPP standards evolution with up to 1 GHz of tester bandwidth. The IQgig-5G solution has three bi-directional source and measurement ports each with 2.92mm connector coaxial interface.
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Product
±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
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High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Product
GHZ-Wideband Amplifiers
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Ultra-wide bandwidth from 10 kHz up to 2.5 GHzGain up to 60 dB (x 1,000)Transimpedance gain with photodetectors up to 50,000 V/AVery low input noise down to 310 pV/√Hz (6.2 pA/√Hz)Integrated DC-current path for biased photodetector applicationsTwo identical signal outputs (HSA-Y series)DC-monitor output (HSA-Y series)
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Product
Integration API
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Testdroid API is an easy-to-use gateway for managing your development and testing effort on real Android and iOS devices. As an alternative for an official Testdroid Cloud site, the API provides all infrastructure through different clients (e.g. Java, Python, Ruby) following the RESTful architecture paradigm and returning JSON with appropriate HTTP response codes.
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Product
Low-power, High-performance FPGA
iCE40 LP/HX
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*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
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Product
PacStar Integrated Solutions
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Curtiss-Wright Defense Solutions
PacStar Integrated Solutions are turnkey tactical and expeditionary, based on the PacStar 400-Series, combined with IQ-Core Software, and a vast array of partner technologies — pre-integrated and ready to meet mission requirements.
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Product
PCB Triaxial Accelerometer, 1000mV/g, ICP®(IEPE), 0.5Hz-3kHz
784815-01
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The PCB Miniature Triaxial Accelerometer helps you acquire sound and movement data with supported PXI Sound and Vibration Modules, C Series Sound and Vibration Input Modules, and USB-based Sound and Vibration Devices. This sensor uses the Integrated Electronics Piezo-Electric (IEPE) current excitation. The PCB Miniature Triaxial Accelerometer features a sensitivity range of 1000 mV/g and requires the PCB lightweight cable with 4-socket plugs.
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Product
Modulation Distortion Up To 90 GHz
S930709B
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S930709B enables fast and accurate active device modulation distortion characterization under modulated stimulus conditions up to 90 GHz. The wide dynamic range and vector error correction of the PNA-X results in an extremely low residual EVM of the test setup, delivering you a complete picture of your device’s performance without test system interference. S930709B measures EVM, NPR, ACPR, and decomposes nonlinear signals and linear signals with the spectral correlation between input and output spectrum without doing demodulation. Integration with the PNA-X SCCM provides quick modulation distortion measurements while making other VNA measurements.
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Product
Communication Solutions
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Bender provides a wide range of communication products to connect systems to facility technicians and management. A wide range of protocols are supported, ensuring interoperatibility with continually evolving technologies.Web browser interfaces and HMIs provide an easy-to-use gateway to your system. Integratable communication brings Bender into your industrial network. Cloud-based solutions provide a scalable, secure solution for system status and analytics across multiple facilities and locations.
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Product
BRIC™ - Large PXI Matrix Modules
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High Density Packaging and Integrated BackplanesWith Pickering's BRIC Large PXI Matrix Modules, the use of high density packaging and integrated backplanes enables a large matrix to be implemented with no user configuration or special matrix expansion kits. These matrices use thru-hole mechanical relays (not surface mount) and can be serviced using standard de-soldering tools simplifying repair and reducing down time. Our BRIC's integrated design ensures high matrix performance with high signal bandwidth and fewer system implementation errors.
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Product
Signal Integration Systems
Avenue
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The Avenue system includes modules for video up/down conversion, audio embedding, synchronization, conversion, routing, noise reduction, protection switches, test signal generators and more. Avenue signal processing modules are used worldwide in broadcast, mobile, satellite, cable, worship and post production facilities. Avenue is a tray-based signal integration system housed in a 1RU or 3RU frame. Any combination of 1.5 Gb/s HD, 3 Gb/s HD, SD, MPEG, analog video and audio processing modules can be used together in the same frame.
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Product
Data Integration System
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Our innovative AI data integration system will automatically do the mappingof your data in an automated way and integrate all types of global data toa harmonized global database so you can keep your existing data outputsand structures.
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Product
Thermal Characterization Testing Services
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Thermal Engineering Associates, Inc.
Thermal Characterization - TEA offers this service to customers having need for precise thermal parameter values for product data sheets, purchase specifications, specific application configurations, and/or device comparisons. This service is offered for a wide range of Discrete Devices (i.e., Bipolar Junction Transistors, MOSFETs, IGBTs, Diodes, SCRs, Triacs) and Integrated Circuits (i.e., digital, linear and mixed-signal devices).
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
6U OpenVPX Processor Card
CHAMP-WB
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Curtiss-Wright Defense Solutions
Integrating FPGAs into any system can be challenging: from ensuring your boards will meet your performance needs in the most rugged conditions to creating a basic framework that will last despite growing radar system, EW & SIGINT application needs.
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Product
2-Channel Front End
BEQ II.1
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*Binaural, digital equalizer with 24 bit technology and USB interface.*The digital equalizer BEQ II.1 combines the characteristics of an equalizer, a two-channel front end and an A/D converter into one mobile and very versatile measurement tool.*Binaural, aurally-accurate recordings can be conducted easily with BEQ II. The AES/EBU interface allows a quick and easy expansion into a four-channel system, e.g. with the HMS III or HMS IV. Via the ADAT interface, up to four BEQ II units can be connected, allowing for eight-channel recordings.*Integrated signal conditioning allows common measurement sensors (Microphone, Line, ICP�) to be directly connected to the front end. In addition, separate pulse inputs are available e.g. for RPM data acquisition.*Thanks to the high-performance built-in battery - external DC power supply is also possible - and its low weight, BEQ II.1 is the ideal tool for either mobile or stationary operation.
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Product
Test Fixture with API
TA-14VG
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The TA-14VG test fixture is based on the requirements for the Integrated Test Procedure for the VG-14A assembly as shown in the OEM maintenance manual. The panel also contains a test point breakout for the units main connector as well as one for the VG-401 base. The VG-401 breakouts provide an in series connection that will allow easy access to the gyro's signals and also provides a way to monitor rotor current. The panel also contains a variac to allow for line voltage adjustment.
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Product
PC/104 Integrations
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Sundance Multiprocessor Technology Ltd.
Listed below are our PC/104 based COTS integrations.We have products with ADC, DAC, DAQ video etc.
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Product
Coordinate Measuring Machines
StentCheck®
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High performance multisensor CMM with Integrated Werth Zoom® optic with magnification 0.7x – 6.8xRotary/Tilt Axis with high speed air bearing rotary axisRotary OnTheFly for fast measurementsContour image processing for fully automatic measurements of complex geometrical elements with sub-micron repeatabilityIntegrated goniometer (tilting axis) allows for the measurement of non-cylindrical geometriesUnique lighting design optimized for measurement of stentsTemperature compensation included
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Customizable Integrated Assemblies
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Our ability to design, develop and manufacture, enables us to provide customized solutions to meet all types of signal switching needs, at a reasonable cost. We offer a variety of high-performance RF matrix systems including electromechanical, solid state, fiber optics or hybrid and considered the ideal choice for ATE, SATCOM and Space applications.
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Product
PXI Integration Platform
ATS-3100
Test Platform
The new ATS-3100 enables you to rise above the module level and shift your focus to the sophisticated test solution you’re actually building. Simply add your instruments, software, and customization to create a complete solution. Or, if you're short on time or resources, ask Astronics Test Systems to do the finishing work for you.
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Custom Integration
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K&L Microwave provides a variety of custom integrations built to customers' electrical, mechanical, and environmental specifications. Designs are based on standard products integrated into complex assemblies to offer turn-key solutions to advanced filtering requirements. The list below contains part numbers meeting existing industry and customer specifications, as well as product families.
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Product
CMP Mechanical Kits (100x70mm)
230195 – CMP-90-HP
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The CMP Mechanical kits are an excellent option for manual tests of both low and high volumes. Now in a more rigid design with removable probe plate for easier maintenance. Integrated fixture down switch as an option. The kit is available in 4 standard sizes but can be adjusted to your demands.
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Product
Information Technology Services
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Under the IT contract, Radiance Technologies, Inc. may provide federal agencies and approved federal contractors with a wide variety of information technology services including: facility operation and maintenance; systems development; systems analysis; programming services, backup and security; data conversion; Computer Assisted Design/Computer Assisted Manufacturing (CAD/CAM); Automated Information Systems Design & Integration; network management and other information technology services.
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Product
Switches-SP8T
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Macom Technology Solutions Holdings Inc.
At MACOM we offer an extensive collection of switches covering multiple commercial and aerospace and defense markets. Our product portfolio has a broad frequency spectrum from DC to 70 GHz. Our silicon Heterolithic Microwave Integrated Circuit (HMIC) PIN diode process is ideal for high power and broadband switches operating from 50 MHz to 26 GHz. Our AlGaAs PIN diode process can extend the upper frequency range of our switch die beyond 70 GHz and is ideal for instrumentation and radar applications. Our GaAs pHEMT and MESFET technology is ideal for fast switching and low control voltage switches optimized for both narrow band and broadband applications. Our 75 Ohm absorptive switches are designed specifically for demanding CATV, FTTx and DBS Infrastructure and CPE applications.
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Product
Photo Detector with Integrated Transimpedance Amplifiers
ADN3010-11
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Analog Devices optoelectronic amplifiers include a range of germanium photodiodes that, through a proprietary process, have been monolithically integrated with silicon transimpedance amplifiers and limiting amplifiers. This process eliminates the need for bond wires connecting the photodiode to the transimpedance amplifier, which leads to improved performance and greater manufacturing reliability. Our portfolio of products also supports the growing need for optical and electrical interface miniaturization.
