Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Product
Memory Test System
T5221
Test System
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Product
Parametric Test Fixture
U2941A
Test Fixture
The Keysight U2941A is a parametric test fixture that is designed to complement the usage of U2722A USB source measure unit in the testing of semiconductor components, including SMT and DIP ICs.
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Product
Relay Sockets & Accessories For Power Relays
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Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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Product
BSD (Test Diagnostics)
test
BSD Test Diagnostics software can be added to either developer or factory run-time systems to further improve the location of faults such as net bridges (short-circuits), open pins, open nets and even ''twisted'' connections that can occur within cable assemblies. BSD Test diagnostics reports faults in a verbose English language statement with pin level information included and can easily interpret multiple fault conditions.
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Product
Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Product
Socket Outlet Tester
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Using the new Testavit Schuki 1 LCD and 3 LCD, specialists easily check to see if sockets, cable drums or connecting cables are correctly connected in 230 V installations. Due to three LEDs, the connection status can be quickly and clearly determined. In addition, through the finger contact, it can be tested to see whether an impermissible, high contact voltage is applied at the protective earth connection. In addition, using the Testavit Schuki 1 LCD, a 30 mA FI circuit breaker (RCD) can be triggered via a pushbutton.
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Product
In-Line RF Test Station
AP770
RF Test System
ICT, Functional, Hipot, Vision, ISP and RF test with low cost fixtures in a very compact test station footprint Works with PCBs up to 450×550 mm or with palletized devices Space for up to 25 VPC mass interconnect modules or YAV switching units
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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Product
GFCI Socket Tester
ST120
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The Fluke ST120 GFCI Socket Tester checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120 will give you confidence on your next job.
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Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
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132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Product
LTE/LTE-Advanced Analysis Using NI PXI RF Test Instruments
NI-RFmx LTE/LTE-Advanced
Test Instrument
Highly optimized RF measurement experiencePerform physical layer analysis on LTE cellular signals including MODACC, ACPR, CHP, OBW, and SEMIncludes support for TDD, FDD, and LTE-Advanced signals specified in 3GPP standards release 12Simple access to advanced measurement parallelism
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Product
CPE Design Verification System
Jupiter 310
Test System
Jupiter is the industry standard for automated DOCSIS physical (PHY) layer testing. It provides the most comprehensive test coverage and accurate results on the market for DOCSIS 3.1 devices.
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Product
Massively Parallel Parametric Test System
P9001A
In-Circuit Test System
The highest throughput parallel parametric test solution. 100-pin parallel measurement capability and faster single parameter measurement than Keysight 4080. Good data correlation with Keysight 4080. New per-pin parametric test unit module with all basic measurement function (voltage, current, capacitance, pulse, frequency). Easy development of parallel test plan. Easy migration from 4080 environment. Proven in 1st-tier logic foundries and memory companies.
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Product
At-Speed Non-Intrusive Functional Testing
ScanExpress JET
Functional Test
Functional circuit board testing presents many challenges that are often costly and time consuming. Most functional tests need to be customized for each design, limiting reusability. This results in software engineers vying for time between development code and test code. Even when functional tests become available, the diagnostic details are often inadequate to give clear visibility on a given problem.ScanExpress JET is a tool designed to overcome these challenges by automating the functional test generation process on CPU–based IEEE-1149.1 compliant circuit boards. Coined JTAG Embedded Test, JET is the preferred method for at-speed, non-intrusive functional testing.
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Product
Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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Product
Automated Aerospace and Defense Test
test
Obsolescence management, evolving RF requirements, and design for test (DFT) challenges every test organization in the aerospace and defense industry. Organizations are transitioning from rack-and-stack box instruments and closed-architecture automated test equipment (ATE) systems to smarter test systems built on a modular platform that scales to meet current and future needs.
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Product
Lo-PRO®file ZIF (Zero-Insertion-Force) Socket
Series 526
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LO-PRO file Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. A metal cam provides strong, smooth action as it moves to a positive stop, compressing the double-sided contacts, ensuring a gas-tight seal.
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Product
Flying Prober Test System
QTOUCH1404C
Test System
Qmax Test Technologies Pvt. Ltd.
The Prober Test System is capable of movement in XYZ directions with fixed angle (θ) and dual probe heads (further expandable up to 4 ) . The system has in-built high resolution Vision Camera for easy monitoring of probe needle contact. The prober supports automatic fiduciary recognition. The system has built –in linear encoders to achieve higher precision.
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Product
W-CDMA/HSPA+ Analysis Using NI PXI RF Test Instruments
RFmx W-CDMA/HSPA+
test
The NI-RFmx W-CDMA personality is a highly optimized API for performing physical layer measurements on W-CDMA cellular standard signals. NI-RFmx W-CDMA is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development efforts.
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
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Product
Socket Saver
4690
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The Technobox PMC Socket-Saver permits cost effective volume testing of PMC modules when used with Technobox P/N 3390 ?PMC to PCI adapter for Test.? It may also be used to reduce wear and tear on Technobox P/N 1518/1523 (?Extender/Preprocessor?).
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Product
Photonics Module Test System
58625
Test System
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Product
High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
Test Platform
Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
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Product
Open-Frame Collet Socket with Wire Wrap Pins
Series 508
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Open Frame Collet Sockets with Wire Wrap Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. 2 and 3 level wire wrap pins available. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
230V AC Socket Tester With RCD Test (For UK)
1944
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Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*RCD Test.*30mA leakage current measurement.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon idnicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1.5W*Frequency: 50Hz
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Product
Faraday Chamber for RF w/Exchangeable Cassettes 340x350mm RCV 9025 for 6TL36
AN133
Test Fixture
The Faraday Chamber is an add-on for the 6TL36 test handler. This kit is installed into the 6TL36 in the same way a normal test fixture would be installed, being the only difference the fact that different products to be tested will, from that moment on, only need an additional exchangeable cassettes to be tested.
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Product
Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
